IP Library Granted Patent US 10,748,773
Granted Patent B2
US 10,748,773 · App. 15/577,859 · Granted Aug 18, 2020

Laser bonding apparatus for three-dimensional molded sculptures

Inventors: Jae Joon Choi (Gwangju-si, KR); Byung Rock Kim (Incheon, KR)
Assignee: LASERSSEL CO., LTD.
H01L21/268H01L21/52H01L21/6773H01L21/67721H01L24/04H01L24/741H01L24/75H01L24/81H01L24/82H01L2021/60112H01L2021/60292
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Quick Facts
Patent No.
US 10,748,773
App. No.
15/577,859
Granted
Aug 18, 2020
Kind
B2
Abstract

Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.

Claims (45)

1. A laser bonding apparatus for three-dimensional structures comprising:

an electronic component providing unit for mounting and transporting a plurality of electronic components;

a three-dimensional structure providing unit for supporting and conveying a plurality of three-dimensional structures;

an adhesive material applying unit for applying adhesive material to one of the three-dimensional structures;

an electronic component attaching unit for attaching an electronic component to the three-dimensional structure on which the adhesive material is applied; and

a laser bonding unit for bonding the electronic component to the three-dimensional structure by irradiating a laser beam to the electronic component attached to the three-dimensional structure,

wherein the electronic component providing unit comprises: a tray on which the plurality of electronic components are mounted; and a tray transporting unit for transporting the tray in a predetermined direction.

2. The laser bonding apparatus according to claim 1 , wherein the three-dimensional structure providing unit includes:

a working table for supporting a plurality of three-dimensional structures; and

a working table conveying unit for conveying the working table on which the plurality of three-dimensional structures are mounted.

3. The laser bonding apparatus according to claim 1 , wherein the three-dimensional structure providing unit includes:

a seat on which the plurality of three-dimensional structures are seated;

a driving shaft connected to the seat; a driving belt connected to the driving shaft;

a first motor for rotating the driving belt; a coupler coupled to the driving shaft;

a support to which the coupler is rotatably coupled; and

a second motor connected to the coupler for rotating the coupler.

4. The laser bonding apparatus according to claim 2 , wherein the adhesive material applying unit includes:

a dispenser for applying solder paste or NCP to the three-dimensional structures mounted on the working table;

a first transfer unit for transferring the dispenser vertically and horizontally within a plane perpendicular to a tray transporting direction; and

a first gantry for supporting the first transfer unit.

5. The laser bonding apparatus according to claim 4 , wherein the adhesive material applying unit further includes a first monitoring unit for detecting the alignment state of the dispenser with respect to the three-dimensional structures and application state of the solder paste or NCP to the three-dimension structures.

6. The laser bonding apparatus according to claim 2 , wherein the electronic component attaching unit includes:

an electronic component attach for picking up the electronic component from the tray and attaching the electronic component to the three-dimensional structure on which the solder paste or NCP is applied;

a second transfer unit for transferring the electronic component attach vertically and horizontally within a plane perpendicular to a tray transporting direction; and

a second gantry for supporting the second transfer unit.

7. The laser bonding apparatus according to claim 6 , wherein the electronic component attach further includes a second monitoring unit for detecting an alignment state of the electronic component attach with respect to the three-dimensional structures and an attachment state of the electronic component to the three-dimensional structures.

8. A laser bonding apparatus for three-dimensional structures comprising:

an electronic component providing unit for mounting and transporting a plurality of electronic components;

a three-dimensional structure providing unit for supporting and conveying a plurality of three-dimensional structures;

an adhesive material applying unit for applying adhesive material to one of the three-dimensional structures;

an electronic component attaching unit for attaching an electronic component to the three-dimensional structure on which the adhesive material is applied; and

a laser bonding unit for bonding the electronic component to the three-dimensional structure by irradiating a laser beam to the electronic component attached to the three-dimensional structure,

wherein the laser bonding unit includes:

a laser oscillator for emitting the laser beam to the electronic component attached to the three-dimensional structure;

a laser beam irradiating unit including a beam shaper and an optical system for converting the laser beam having Gaussian distribution outputted from the laser oscillator into square or rectangular surface beam having a uniform energy distribution;

a third transfer unit for moving the laser beam irradiating unit vertically and horizontally within a plane perpendicular to the direction of tray transport; and

a third gantry for supporting the third transfer unit.

9. The laser bonding apparatus according to claim 8 , wherein the laser bonding unit further includes a third monitoring unit for detecting an alignment state of the laser beam irradiating unit with respect to the three-dimensional structures and a bonding state of the electronic component to the three-dimensional structures.

10. A laser bonding apparatus for three-dimensional structures comprising:

an electronic component providing unit for mounting and transporting a plurality of electronic components;

a three-dimensional structure providing unit for supporting and conveying a plurality of three-dimensional structures;

an adhesive material applying unit for applying adhesive material to one of the three-dimensional structures;

an electronic component attaching unit for attaching an electronic component to the three-dimensional structure on which the adhesive material is applied; and

a laser bonding unit for bonding the electronic component to the three-dimensional structure by irradiating a laser beam to the electronic component attached to the three-dimensional structure,

wherein the three-dimensional structure is a structure for an automobile tail lamp or an automobile headlamp.

Assignments (2)
CHANGE OF NAME Recorded May 14, 2020
From: CRUCIAL MACHINES CO., LTD.
To: LASERSSEL CO., LTD.
Reel/Frame 052665/0561 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 29, 2017
From: CHOI, JAE JOON; KIM, BYUNG ROCK
To: CRUCIAL MACHINES CO., LTD.
Reel/Frame 044246/0682 →
Priority Claims (1)
KR 10-2016-0136477 · Oct 20, 2016 · national
Continuity (1)
Related Publication 20190244818A1 · Aug 8, 2019