Wafer inspection system, wafer inspection apparatus and prober

1. A wafer inspection system comprising:

a transfer region in which a transfer device is arranged;

an inspection region in which test heads for inspecting a substrate are arranged; and

a maintenance region in which the test heads are maintained,

wherein the inspection region is located between the transfer region and the maintenance region,

a plurality of inspection rooms accommodating the test heads are adjacent to each other in the inspection region,

a slide rail is provided along a longitudinal direction of at least one of the test heads within a corresponding inspection room to support the at least one test head,

each of the plurality of inspection rooms has an opening facing the maintenance region, and

of the at least one test head is configured to be unloaded in the longitudinal direction by the slide rail from the inspection region to the maintenance region through the opening of the corresponding inspection room.

2. The wafer inspection system of claim 1 ,

wherein a maintenance carriage which is movable and is configured to support the unloaded test heads is arranged in the maintenance region.

3. The wafer inspection system of claim 2 ,

wherein the maintenance carriage is configured to accommodate the test heads and has a case which is movable up and down, and

the case is allowed to directly face one of the inspection rooms by moving the maintenance carriage and by moving the case up and down.

4. The wafer inspection system of claim 2 ,

wherein a position of the maintenance carriage and a position of the case are configured to be fixed.

5. The wafer inspection system of claim 2 ,

wherein a guide rail configured to control a moving direction of the maintenance carriage is arranged in the inspection region.

6. A wafer inspection apparatus comprising:

a plurality of inspection rooms accommodating test heads for inspecting a substrate on which a semiconductor device is formed and having a slide rail, along a longitudinal direction of the test heads within each of the plurality of inspection rooms, for supporting the test heads and unloading the test heads to a maintenance region; and

a loader configured to transfer the substrate into one of the inspection rooms,

wherein the plurality of inspection rooms are arranged at a cell tower between the loader and the maintenance region,

each of the plurality of inspection rooms has an opening facing the maintenance region,

one of the test heads is configured to be unloaded in the longitudinal direction by the slide rail from one of the inspection rooms to the maintenance region through the opening of each of the inspection rooms, and

the loader and the maintenance region are arranged at opposite sides of the cell tower.

7. A wafer inspection apparatus comprising:

a plurality of inspection rooms accommodating test heads for inspecting a substrate on which a semiconductor device is formed and having a slide rail, along a longitudinal direction of the test heads within each of the plurality of inspection rooms, for supporting the test heads and unloading the test heads to a maintenance region; and

a loader configured to transfer the substrate into one of the inspection rooms,

wherein the plurality of inspection rooms are arranged between the loader and the maintenance region,

each of the plurality of inspection rooms has an opening facing the maintenance region,

one of the test heads is configured to be unloaded in the longitudinal direction by the slide rail from one of the inspection rooms to the maintenance region through the opening of each of the inspection rooms, and

the loader and the maintenance region are facing each other across the plurality of inspection rooms.