Determining an automatic bonding sequence for optical bonding

1. A method for customizing an automated bonding sequence, the method comprising:

detecting, by a processor of a computing system, that a first substrate is in close proximity with a second substrate, during an optical bonding operation, wherein at least the first substrate includes an amount of adhesive for optically bonding to the second substrate;

stopping, by the processor, an automated process of optically bonding of the optical bonding operation, in response to the detecting;

recording, by the processor, operator feedback control signals, the operator feedback control signals being received from a controller being operated by an operator to contact the first substrate and the second substrate;

analyzing, by the processor, the operator feedback control signals to determine a bonding sequence for automatically optically bonding the first substrate and the second substrate; and

resuming, by the processor, the automated process of the optical bonding operation.

2. The method of claim 1 , wherein the bonding sequence is used to contact a new first substrate of the same size as the first substrate and a new second substrate of the same size as the second substrate, in a subsequent optical bonding operation, instead of the operator operating the controller.

3. The method of claim 1 , wherein the analyzing the operator feedback control signals to determine the bonding sequence comprises:

analyzing, by the processor, a plurality of factors from the recorded operator feedback control signals; and

creating, by the processor, a sequential order for automatically controllably contacting the first substrate and the second substrate, based on the plurality of factors.

4. The method of claim 3 , wherein the plurality of factors include a distance moved along a X axis, a distance moved along a Y axis, a distance moved along a Z axis, a rotation about the yaw axis, a wait time between moves, a speed, a rate of progression causing of a capillary effect of the adhesive between the first substrate and the second substrate.

5. The method of claim 4 , wherein the resuming the automated process including, actuating, by the processor, an array of UV lights, moved into position to cure the optical bonding between the first substrate and the second substrate.

6. The method of claim 1 , further comprising:

inspecting, by the processor, the bonded substrates for a presence of defects prior to the resuming, wherein the inspecting includes examining a video or image of the bonded substrates captured by a camera positioned beneath the first substrate.

7. The method of claim 1 , wherein at least one of the first substrate and the second substrate are transparent.

8. A computer system, comprising:

a processor;

a memory device coupled to the processor; and

a computer readable storage device coupled to the processor, wherein the storage device contains program code executable by the processor via the memory device to implement a method customizing an automated bonding sequence, the method comprising:

detecting, by a processor of a computing system, that a first substrate is in close proximity with a second substrate, during an optical bonding operation, wherein at least the first substrate includes an amount of adhesive for optically bonding to the second substrate;

stopping, by the processor, an automated process of optically bonding of the optical bonding operation, in response to the detecting;

recording, by the processor, operator feedback control signals, the operator feedback control signals being received from a controller being operated by an operator to contact the first substrate and the second substrate;

analyzing, by the processor, the operator feedback control signals to determine a bonding sequence for automatically optically bonding the first substrate and the second substrate; and

resuming, by the processor, the automated process of the optical bonding operation.

9. The computer system of claim 8 , wherein the bonding sequence is used to contact a new first substrate of the same size as the first substrate and a new second substrate of the same size as the second substrate, in a subsequent optical bonding operation, instead of the operator operating the controller.

10. The computer system of claim 8 , wherein the analyzing the operator feedback control signals to determine the bonding sequence comprises:

analyzing, by the processor, a plurality of factors from the recorded operator feedback control signals; and

creating, by the processor, a sequential order for automatically controllably contacting the first substrate and the second substrate, based on the plurality of factors.

11. The computer system of claim 10 , wherein the plurality of factors include a distance moved along a X axis, a distance moved along a Y axis, a distance moved along a Z axis, rotation about the yaw axis, a wait time between moves, a speed, a rate of progression of each axis causing a capillary effect of the adhesive between the first substrate and the second substrate.

12. The computer system of claim 8 , further comprising:

inspecting, by the processor, the bonded substrates for a presence of defects, prior to the resuming, wherein the inspecting includes examining a video or image of the bonded substrates captured by a camera positioned beneath the first substrate.

13. The computer system of claim 12 , wherein the resuming the automated process including, actuating, by the processor, an array of UV lights, moved into position to cure the optical bonding between the first substrate and the second substrate.

14. The computer system of claim 8 , wherein at least one of the first substrate and the second substrate are transparent.

15. A computer program product, comprising a computer readable hardware storage device storing a computer readable program code, the computer readable program code comprising an algorithm that when executed by a computer processor of a computing system implements a method customizing an automated bonding sequence, the method comprising:

detecting, by a processor of a computing system, that a first substrate is in close proximity with a second substrate, during an optical bonding operation, wherein at least the first substrate includes an amount of adhesive for optically bonding to the second substrate;

stopping, by the processor, an automated process of optically bonding of the optical bonding operation, in response to the detecting;

recording, by the processor, operator feedback control signals, the operator feedback control signals being received from a controller being operated by an operator to contact the first substrate and the second substrate;

analyzing, by the processor, the operator feedback control signals to determine a bonding sequence for automatically optically bonding the first substrate and the second substrate; and

resuming, by the processor, the automated process of the optical bonding operation.

16. The computer program product of claim 15 , wherein the bonding sequence is used to contact a new first substrate of the same size as the first substrate and a new second substrate of the same size as the second substrate, in a subsequent optical bonding operation, instead of the operator operating the controller.

17. The computer program product of claim 15 , wherein the analyzing the operator feedback control signals to determine the bonding sequence comprises:

analyzing, by the processor, a plurality of factors from the recorded operator feedback control signals; and

creating, by the processor, a sequential order for automatically controllably contacting the first substrate and the second substrate, based on the plurality of factors.

18. The computer program product of claim 17 , wherein the plurality of factors include a distance moved along a X axis, a distance moved along a Y axis, a distance moved along a Z axis, a rotation about yaw axis, a wait time between moves, a speed, a rate of progression of the axes causing a capillary effect of the adhesive between the first substrate and the second substrate.

19. The computer program product of claim 15 , wherein the analyzing of the operator feedback control signals to determine the bonding sequence produces a delineation of the plurality of values that are manipulated for further bond routine optimization.

20. The computer program product of claim 15 , further comprising:

inspecting, by the processor, the bonded substrates for a presence of defects, prior to the resuming, wherein the inspecting includes examining a video or image of the bonded substrates captured by a camera positioned beneath the first substrate.