Electrochromic device including a means for preventing ion migration and a process of forming the same
An electrochromic device can include a substrate; an electrochromic layer or a counter electrode layer over the substrate and including a mobile ion; a first transparent conductive layer over the substrate and including Ag. In one embodiment, the electrochromic device can include a barrier layer disposed between first transparent conductive layer and the electrochromic or counter electrode layer. In another embodiment, the electrochromic device can include means for preventing (1) the mobile ion from migrating into the first transparent conductive layer, (2) Ag from migrating into the electrochromic layer or counter electrode layer, or both (1) and (2). A process of forming an electrochromic device can include forming an electrochromic layer or a counter electrode layer over a substrate; forming a barrier layer; and forming a first transparent conductive layer over the substrate.
1. An electrochromic device comprising:
a substrate;
an electrochromic layer or a counter electrode layer over the substrate, wherein the electrochromic or counter electrode layer includes a mobile ion;
a first transparent conductive layer over the substrate and including Ag; and
a barrier layer disposed between first transparent conductive layer and the electrochromic or counter electrode layer, wherein the barrier layer is spaced apart from the Ag within the first transparent conductive layer.
2. The electrochromic device of claim 1 , wherein the barrier layer is conformal.
3. The electrochromic device of claim 2 , wherein the barrier layer has a thickness of in a range of 5 nm to 200 nm.
4. The electrochromic device of claim 1 , wherein the barrier layer includes a metal oxide.
5. The electrochromic device of claim 4 , wherein the barrier layer includes Al 2 O 3 .
6. The electrochromic device of claim 4 , wherein the barrier layer includes TiO 2 .
7. The electrochromic device of claim 1 , further comprising a first transparent conductive oxide between the Ag and the barrier layer.
8. An electrochromic device comprising:
a substrate;
an electrochromic stack comprising:
an electrochromic layer or a counter electrode layer over the substrate, wherein the electrochromic or counter electrode layer includes a mobile ion;
a first transparent conductive layer over the substrate and including Ag; and
a barrier layer disposed between first transparent conductive layer and the electrochromic or counter electrode layer; and
a second transparent conductive layer,
wherein the first transparent conductive layer is coupled to one of the electrochromic layer and the counter electrode layer, and the second transparent conductive layer is coupled to the other of the electrochromic layer and the counter electrode layer.
9. A process of forming an electrochromic device comprising:
providing a substrate;
forming an electrochromic layer or a counter electrode layer over the substrate, wherein after forming the electrochromic or counter electrode layer, the electrochromic or counter electrode layer includes a mobile ion;
forming a barrier layer over the substrate; and
forming a first transparent conductive layer over the substrate and including Ag,
wherein forming the barrier layer is formed between forming the electrochromic or counter electrode layer and forming the first transparent conductive layer, and wherein forming the barrier is performed using a metal-containing precursor including an organometallic compound, a metal halide, or a metal carbonyl compound.
10. The process of claim 9 , wherein forming the barrier layer is performed using atomic layer deposition.
11. The process of claim 10 , wherein the barrier layer is conformal.
12. The process of claim 10 , wherein the barrier layer has a thickness of in a range of 5 nm to 200 nm.
13. The process of claim 9 , wherein the organometallic compound includes a metal alkyl compound, a metal alkoxide compound, or a dialkyl-amino metal, wherein each alkyl group or alkoxide group has no more than four carbon atoms.
14. The process of claim 9 , wherein forming the barrier layer is performed using H 2 O, H 2 O 2 , O 2 , or O 3 , or any combination thereof.
15. The process of claim 14 , wherein the barrier layer includes a metal oxide.
16. The process of claim 15 , wherein the barrier layer includes Al 2 O 3 or TiO 2 .
17. The process of claim 9 , wherein the barrier layer is spaced apart from the Ag within the first transparent conductive layer.
18. The process of claim 17 , further comprising a first transparent conductive oxide between the Ag and the barrier layer.