IP Library › Granted Patent US 10,203,074
Granted Patent B2
US 10,203,074 · App. 15/593,150 · Granted Feb 12, 2019

Light-emitting diode and lighting module

Inventors: Siegfried Herrmann (Neukirchen, DE); Markus Pindl (Tegernheim, DE)
Assignee: OSRAM GMBH
F21K9/69F21V5/04F21V5/045H01L25/0753H01L33/483F21Y2113/17F21Y2115/10H01L33/486H01L33/54H01L33/60H01L2933/0091
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Quick Facts
Patent No.
US 10,203,074
App. No.
15/593,150
Granted
Feb 12, 2019
Kind
B2
Abstract

A light-emitting diode and a light module are disclosed. In an embodiment the light-emitting diode includes at least one light-emitting diode chip and a first optical element, which is reflective for light generated by the at least one light-emitting diode chip during operation, wherein the first optical element completely covers at least one of the at least one light-emitting diode chip in a plan view.

Claims (33)

1. A light-emitting diode comprising:

at least one light-emitting diode chip; and

a first optical element, which is reflective for light generated by the at least one light-emitting diode chip during operation,

wherein the first optical element completely covers at least one of the at least one light-emitting diode chip in a plan view;

wherein the first optical element completely covers at least one of the at least one light-emitting diode chip in a view from a radiation exit surface of the light-emitting diode; and

wherein the reflectivity of the first optical element for light emitted by the at least one light-emitting diode chip is at least 75%.

2. The light-emitting diode according to claim 1 , wherein the first optical element completely covers all light-emitting diode chips in the plan view.

3. The light-emitting diode according to claim 1 , wherein the first optical element is opaque to the light generated by the at least one light-emitting diode chip during operation.

4. The light-emitting diode according to claim 1 , further comprising an enveloping body, which is transmissive to the light generated by the at least one light-emitting diode chip during operation, wherein the enveloping body abuts all light-emitting diode chips.

5. The light-emitting diode according to claim 4 , wherein the first optical element covers the enveloping body in places in the plan view.

6. The light-emitting diode according to claim 4 , wherein the first optical element abuts the enveloping body in places.

7. The light-emitting diode according to claim 4 , wherein the enveloping body is constructed for mixing the light generated by the light-emitting diode chips during operation.

8. The light-emitting diode according to claim 1 , wherein the at least one light-emitting diode chip comprises at least one light-emitting diode that emits blue light, at least one light-emitting diode chip that emits red light and at least one light-emitting diode chip that emits green light.

9. The light-emitting diode according to claim 1 , further comprising a second optical element, which is constructed for optically influencing the light generated by all light-emitting diode chips during operation.

10. The light-emitting diode according to claim 9 , wherein the light generated by the light-emitting diode chips during operation leaves the light-emitting diode exclusively through the second optical element.

11. The light-emitting diode according to claim 1 , further comprising a cover, which is opaque to the light generated by the at least one light-emitting diode chip during operation, wherein the cover completely surrounds a second optical element in lateral directions.

12. The light-emitting diode according to claim 1 , wherein the light-emitting diode comprises at least two of the light-emitting diode chips, and at least one of the light-emitting diode chips is arranged spaced apart in a vertical direction from at least one other of the light-emitting diode chips.

13. The light-emitting diode according to claim 1 , further comprising an enveloping body which is transmissive to the light generated by the light-emitting diode chips during operation,

wherein the enveloping body abuts all light-emitting diode chips of the light-emitting diode,

wherein the enveloping body is formed with a base material into which particles of a radiation-scattering and/or a radiation-reflecting material have been incorporated so that the enveloping body is constructed for mixing the light generated by the light-emitting diode chips during operation,

wherein the at least one light-emitting diode chip comprises at least one light-emitting diode chip that emits blue light, at least one light-emitting diode chip that emits red light and at least one light-emitting diode chip that emits green light, and

wherein at least one of the light-emitting diode chips is arranged spaced apart in a vertical direction from at least one other of the light-emitting diode chips.

14. The light-emitting diode according to claim 1 , further comprising an enveloping body which is transmissive to the light generated by the light-emitting diode chips during operation,

wherein the enveloping body abuts all light-emitting diode chips of the light-emitting diode,

wherein the enveloping body is formed with a base material into which particles of a radiation-scattering and/or a radiation-reflecting material have been incorporated, so that the enveloping body is constructed for mixing the light generated by the light-emitting diode chips during operation,

wherein the at least one light-emitting diode chip comprises at least one light-emitting diode chip that emits blue light, at least one light-emitting diode chip that emits red light and at least one light-emitting diode chip that emits green light,

wherein at least two of the light-emitting diode chips are arranged in different planes of the light-emitting diode,

wherein the different planes of the light-emitting diode chips run at least in sections or wholly parallel to one another and are arranged one above the other in a vertical direction which runs transversely or perpendicularly to the planes, and

wherein a spacing between the two light-emitting diode chips which are arranged in different planes is at least the height of one of the light-emitting diode chips.

15. A lighting module comprising:

at least two light-emitting diodes according to claim 1 , wherein the light-emitting diodes are arranged one next to the other in lateral directions, and wherein the light-emitting diodes are mechanically connected to one another.

16. The lighting module according to claim 15 , wherein each light-emitting diode has a hexagonal outline in plan view, and wherein at least one of the light-emitting diodes abuts six light-emitting diodes in the lateral directions.

17. The lighting module according to claim 15 , which has a hexagonal outline in plan view.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 18, 2018
From: HERRMANN, SIEGFRIED; PINDL, MARKUS
To: OSRAM GMBH
Reel/Frame 045841/0485 →
Priority Claims (1)
DE 10 2016 108 692 · May 11, 2016 · national
Continuity (1)
Related Publication 20170328525A1 · Nov 16, 2017