Flexible heat spreader lid
Heat spreader lids and package assemblies including a heat spreader lid. The heat spreader lid has a central region configured to be coupled with an electronic component, a peripheral region configured to be coupled with a substrate, and a connecting region arranged between the central region and the peripheral region. The connecting region is configured to impart stress relief to the central region.
1. A structure comprising:
a heat spreader lid having a central region configured to be coupled with an electronic component, a peripheral region configured to be coupled with a substrate, a connecting region arranged between the central region and the peripheral region, and one or more openings that extend completely through the connecting region,
wherein the central region includes a center point, and the one or more openings in the connecting region are aligned radially relative to the center point of the central region and are arranged circumferentially about the center point of the central region.
2. The structure of claim 1 wherein the connecting region surrounds the central region, and the peripheral region surrounds the connecting region and the central region.
3. The structure of claim 1 wherein the one or more openings modify a structural stiffness of the connecting region.
4. The structure of claim 1 wherein at least one of the one or more openings is linear.
5. The structure of claim 1 wherein each of the one or more openings extends transverse to a side edge of the electronic component.
6. The structure of claim 5 wherein each of the one or more openings has a beginning point and an ending point within the connecting region, and the ending point is located outside of the side edge of the electronic component.
7. The structure of claim 1 wherein the one or more openings divide the connecting region into a plurality of sectors, the central region has a first thickness, and at least one of the sectors has a second thickness that is less than the first thickness.
8. A structure comprising:
a heat spreader lid having a central region configured to be coupled with an electronic component, a peripheral region configured to be coupled with a substrate, and a connecting region arranged between the central region and the peripheral region,
wherein the connecting region has a thickness, and the connecting region includes one or more grooves that extend partially through the thickness of the connecting region.
9. The structure of claim 8 wherein each of the one or more grooves has a depth that is greater than or equal to 20% of the thickness of the connecting region and that is less than or equal to 80% of the thickness of the connecting region.
10. The structure of claim 8 wherein at least one of the one or more grooves is arranged to extend into the central region.
11. The structure of claim 8 wherein at least one of the one or more grooves is arranged to extend parallel to a side edge of the electronic component.
12. The structure of claim 8 wherein the connecting region includes a first surface and a second surface separated from the first surface by the thickness of the connecting region, at least one of the one or more grooves is located on the first surface, and at least one of the one or more grooves is located on the second surface.
13. The structure of claim 12 wherein the at least one of the one or more grooves on the first surface is arranged to extend parallel to the at least one of the one or more grooves on the second surface.
14. The structure of claim 8 wherein the one or more grooves modify a structural stiffness of the connecting region.
15. A package assembly comprising:
an electronic component;
a substrate; and
a heat spreader lid including a central region, a peripheral region with a flange, and a connecting region arranged between the central region and the peripheral region,
wherein the connecting region has a thickness, and the connecting region includes one or more grooves that extend partially through the thickness of the connecting region.
16. The package assembly of claim 15 wherein the one or more grooves modify a structural stiffness of the connecting region.
17. The package assembly of claim 15 further comprising:
a thermal interface layer between the central region of the heat spreader lid and the electronic component.
18. The package assembly of claim 17 further comprising:
an adhesive layer between the flange and the substrate.
19. The package assembly of claim 15 further comprising:
an adhesive layer between the flange and the substrate.
20. The package assembly of claim 15 wherein the connecting region includes a first surface and a second surface separated from the first surface by the thickness of the connecting region, at least one of the one or more grooves is located on the first surface, and at least one of the one or more grooves is located on the second surface.