IP Library Granted Patent US 11,011,355
Granted Patent B2
US 11,011,355 · App. 15/593,987 · Granted May 18, 2021

Temperature-tuned substrate support for substrate processing systems

Inventors: Norman Mertke (San Jose, CA); Himanshu Chokshi (Fremont, CA)
Assignee: LAM RESEARCH CORPORATION
H01J37/32724H01J37/32697H01J2237/335
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Quick Facts
Patent No.
US 11,011,355
App. No.
15/593,987
Granted
May 18, 2021
Kind
B2
Abstract

A system for controlling a temperature of a substrate during treatment in a substrate processing system includes a substrate support defining a center zone and a radially-outer zone. The substrate is arranged over both the center zone and the radially-outer zone during treatment. A first heater is configured to heat the center zone. A second heater is configured to heat the radially-outer zone. A first heat sink has one end in thermal communication with the center zone. A second heat sink has one end in thermal communication with the radially-outer zone. A temperature difference between the center zone and the radially-outer zone is greater than 10° C. during the treatment.

Claims (52)

1. A system for controlling a temperature of a substrate during treatment in a substrate processing system, comprising:

a substrate support defining a center zone and a radially-outer zone,

wherein the substrate is arranged over both the center zone and the radially-outer zone during treatment;

a first heater configured to heat the center zone;

a second heater configured to heat the radially-outer zone;

a first heat sink including axially extending projections, the axially extending projections conducting heat, and having one end in thermal communication with the center zone; and

a second heat sink having an annular portion and having one end in thermal communication with the radially-outer zone,

wherein a temperature difference between the center zone and the radially-outer zone is greater than 10° C. during the treatment.

2. The system of claim 1 , wherein the substrate is held by gravity on the substrate support and is not held by mechanical clamping or an electrostatic chuck.

3. The system of claim 1 , wherein the substrate support includes:

a first component including:

a first center portion having a first thickness; and

a radially-projecting portion having a second thickness that is less than the first thickness;

a second component arranged below and radially outside of the first component and including:

a second center portion; and

an axially-projecting portion that is connected to the second center portion of the second component and to a radially-outer edge of the radially-projecting portion of the first component.

4. The system of claim 3 , wherein a first gap is defined in an axial direction between the first center portion of the first component and the second center portion of the second component, and wherein a second gap is defined between a radially-outer surface of the first center portion and a radially-inner surface of the axially-projecting portion.

5. The system of claim 3 , wherein an upper surface of the first center portion at least partially defines the center zone, wherein an upper surface of the axially-projecting portion at least partially defines the radially-outer zone.

6. The system of claim 3 , wherein:

the second component includes a plurality of bores; and

the axially extending projections are connected to the first component and pass through the plurality of bores.

7. The system of claim 1 , further comprising a plurality of spacers arranged in the substrate support to provide a predetermined gap between the substrate and the substrate support during treatment.

8. The system of claim 1 , wherein the substrate support includes a plurality of notches that are defined in the center zone and the radially-outer zone and that extend radially inwardly from an outer edge of the substrate support.

9. The system of claim 1 , further comprising a temperature-controlled thermal mass in thermal communication with other ends of the first heat sink and the second heat sink.

10. The system of claim 1 , wherein at least one of the center zone and the radially-outer zone is maintained at a temperature in a range from 90° C. to 350° C. and wherein the temperature difference is in a range from 18° C. to 100° C.

11. The system of claim 1 , wherein the treatment comprises photoresist ashing, at least one of the center zone and the radially-outer zone is maintained at a temperature in a range from 90° C. to 350° C. and wherein the temperature difference is in a range from 18° C. to 100° C.

12. The system of claim 1 wherein the axially extending projections extend from the center zone.

13. A system for controlling a temperature of a substrate during treatment in a substrate processing system, comprising:

a substrate support including:

a first component including:

a center portion having a first thickness and partially defining a center zone; and

a radially-projecting portion having a second thickness that is less than the first thickness; and

a second component arranged below and radially outside of the first component and including:

an annular portion; and

an axially-projecting portion that is connected to the annular portion of the second component and a radially-outer edge of the radially-projecting portion of the first component and that partially defines a radially-outer zone, wherein the substrate is arranged over both the center zone and the radially-outer zone during treatment;

a first heater configured to heat the first component;

a second heater configured to heat the second component;

a first heat sink including axially extending projections, the axially extending projections conducting heat, and having one end in thermal communication with the first component; and

a second heat sink having one end in thermal communication with the second component,

wherein a temperature difference between the first component and the second component is in a range from 10° C. to 100° C. during the treatment.

14. The system of claim 13 , wherein the substrate is held by gravity on the substrate support and is not held by mechanical clamping or an electrostatic chuck.

15. The system of claim 13 , wherein an upper surface of the center portion corresponds to the center zone, and wherein an upper surface of the axially-projecting portion corresponds to the radially-outer zone.

16. The system of claim 13 , wherein:

the second component includes a plurality of bores; and

the axially extending projections are connected to the first component and pass through the plurality of bores.

17. The system of claim 13 , further comprising a plurality of spacers arranged in the center zone to provide a predetermined gap between the substrate and the substrate support during treatment.

18. The system of claim 13 , wherein the substrate support includes a plurality of notches projecting radially inwardly from an outer edge of the substrate support.

19. The system of claim 13 , further comprising a temperature-controlled thermal mass in thermal communication with other ends of the first heat sink and the second heat sink.

20. The system of claim 13 , wherein at least one of the center zone and the radially-outer zone is maintained at a temperature in a range from 90° C. to 350° C. and wherein the temperature difference is in a range from 18° C. to 100° C.

21. The system of claim 13 , wherein the treatment comprises photoresist ashing, at least one of the center zone and the radially-outer zone is maintained at a temperature in a range from 90° C. to 350° C. and wherein the temperature difference is in a range from 18° C. to 100° C.

22. The system of claim 13 , wherein the second thickness is uniform throughout the radially-projecting portion.

23. The system of claim 13 wherein the axially extending projections extend from the first component.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 5, 2018
From: CHOKSHI, HIMANSHU
To: LAM RESEARCH CORPORATION
Reel/Frame 045441/0885 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 12, 2017
From: MERTKE, NORMAN
To: LAM RESEARCH CORPORATION
Reel/Frame 042357/0040 →
Continuity (1)
Related Publication 20180330928A1 · Nov 15, 2018