Integrated circuits with electrostatic discharge protection and methods for producing the same

1. An integrated circuit comprising:

a deep well;

a drain well overlying the deep well;

a first source well overlying the deep well, wherein the first source well comprises a first source well concentration of conductivity determining impurities;

a second source well overlying the first source well, wherein the second source well comprises a second source well concentration of conductivity determining impurities that is higher than the first source well concentration;

a drain overlying the drain well;

a source overlying the second source well;

a channel defined between the source and the drain; and

a gate overlying the channel.

2. The integrated circuit of claim 1 further comprising an N/P intersection underlying the gate, wherein the channel comprises conductivity determining impurities and the primary type of conductivity determining impurity in the channel changes at the N/P intersection.

3. The integrated circuit of claim 1 further comprising:

a protected circuit; and

an ESD circuit, wherein the ESD circuit is configured to conduct an electrostatic discharge (ESD) to a ground such that the ESD bypasses the protected circuit.

4. The integrated circuit of claim 1 wherein;

at least a portion of the second source well underlies the gate.

5. The integrated circuit of claim 1 further comprising:

a drain shallow trench isolation structure positioned between the drain and the channel.

6. The integrated circuit of claim 1 wherein:

the source comprises a source bottom surface; and

the source extends beyond the second source well adjacent to the gate such that a portion of the source bottom surface contacts the first source well adjacent to the channel.

7. The integrated circuit of claim 1 wherein:

the source comprises a source bottom surface and a source side surface; and

the second source well terminates at an end of the source adjacent to the channel such that the entire source bottom surface contacts the second source well and the source side surface contacts the first source well adjacent to the channel.

8. The integrated circuit of claim 1 further comprising:

a source well contact directly contacting the second source well.

9. The integrated circuit of claim 1 further comprising:

a source well contact directly contacting the first source well.

10. The integrated circuit of claim 1 wherein:

the first source well comprises conductivity determining impurities that are primarily “P” type;

the second source well comprises conductivity determining impurities that are primarily “P” type;

the drain well comprises conductivity determining impurities that are primarily “N” type;

the source comprises “N” type conductivity determining impurities;

the drain comprises “N” type conductivity determining impurities; and

the deep well comprises “N” type conductivity determining impurities.

11. The integrated circuit of claim 1 wherein the entire second source well directly overlies the first source well.

12. The integrated circuit of claim 1 wherein:

the second source well comprises a second source well depth measured from a substrate top surface; and

the drain well comprises a drain well depth measured from the substrate top surface, and the second source well depth is greater than the drain well depth.

13. The integrated circuit of claim 1 wherein the source comprises a source bottom surface, wherein the entire source bottom surface directly contacts the second source well.

14. The integrated circuit of claim 2 wherein the N/P intersection is defined between the deep well and the first source well.

15. The integrated circuit of claim 3 wherein:

the protected circuit and the ESD circuit are connected in parallel between an I/O pad and the ground.

16. The integrated circuit of claim 5 wherein the gate overlies at least a portion of the drain shallow trench isolation structure.

17. An integrated circuit comprising:

an ESD transistor comprising a source, a drain, and a gate positioned between the source and the drain, wherein the source comprises “N” type conductivity determining impurities;

a second source well underlying the source, wherein the second source well comprises “P” type conductivity determining impurities at a second source well concentration;

a first source well underlying the second source well, wherein the first source well comprises “P” type conductivity determining impurities at a first source well concentration that is lower than the second source well concentration; and

a drain well underlying the drain, wherein the drain well comprises “N” type conductivity determining impurities.

18. The integrated circuit of claim 17 further comprising a deep well, wherein the deep well comprises conductivity determining impurities that are primarily “N” type, and wherein the deep well directly contacts the first source well and the drain well.

19. The integrated circuit of claim 17 wherein:

the second source well comprises a second source well depth measured from a substrate top surface;

the drain well comprises a drain well depth measured from the substrate top surface, and the second source well depth is greater than the drain well depth.

20. A method of producing an integrated circuit comprising:

forming a deep well in a substrate, wherein the deep well comprises “N” type conductivity determining impurities;

forming a drain well in the deep well, wherein the drain well comprises “N” type conductivity determining impurities;

forming a first source well in the deep well, wherein the first source well comprises a first source well concentration of “P” type conductivity determining impurities;

forming a second source well overlying the first source well, wherein the second source well comprises a second source well concentration of “P” type conductivity determining impurities that is higher than the first source well concentration of conductivity determining impurities;

forming a drain overlying the drain well, wherein the drain contacts the drain well, wherein the drain comprises “N” type conductivity determining impurities;

forming a source overlying the second source well, wherein the source contacts the second source well, and wherein the source comprises “N” type conductivity determining impurities; and

forming a gate overlying a substrate top surface between the source and the drain.