Method and apparatus for transfer of semiconductor devices
A system to transfer an unpackaged die directly from a die holding substrate to a transfer location on a secondary substrate. The system includes a die separation device disposed adjacent to the die holding substrate to initiate separation of the unpackaged die from the die holding substrate. An energy source is disposed adjacent to the secondary substrate to apply energy to the transfer location and affix the unpackaged die directly to the secondary substrate. A sensor detects a position and orientation of the secondary substrate with respect to the unpackaged die on the die holding substrate. A processor is in communication with the die separation device, the energy source, and the sensor. The processor is configured to cause actuation of the die separation device and the energy source according, at least in part, to transfer instructions and data received from the sensor.
1. A system to transfer an unpackaged semiconductor device die (“unpackaged die”) directly from a die holding substrate to a transfer location on a secondary substrate, the system comprising:
a processor;
memory storing transfer instructions, the memory being in communication with the processor;
a die separation device including a transfer member disposed adjacent to the die holding substrate to initiate separation of the unpackaged die from the die holding substrate;
a first sensor to detect a position of the unpackaged die, the first sensor disposed adjacent to the die holding substrate and spaced apart from the transfer member a distance ranging from about 1 inch to about 5 inches, and the first sensor to send first data to the memory, the first data representing the position of the unpackaged die; and
a second sensor to detect a position and orientation of the secondary substrate with respect to the unpackaged die on the die holding substrate, and the second sensor to send second data to the memory, the second data representing the position and orientation of the secondary substrate,
wherein the processor is in communication with the die separation device, the first sensor, and the second sensor,
wherein the memory stores the first data and the second data, and
wherein the processor is configured to receive the transfer instructions with respect to the first data and the second data from the memory to cause actuation of the die separation device according, at least in part, to the transfer instructions, the first data, and the second data.
2. The system according to claim 1 , wherein the transfer member is sized to transfer at least the unpackaged die via a pressing contact between the transfer member and a side of the unpackaged die in a direction toward the transfer location.
3. The system according to claim 2 , wherein the transfer member includes a needle configured to reciprocate between a non-contact position and a contact position with the side of the unpackaged die, and
wherein, in the contact position, the pressing contact causes at least one peripheral edge of the unpackaged die to protrude away from the die holding substrate.
4. The system according to claim 1 , wherein the transfer member includes a collet that is pivotable between the die holding substrate and the secondary substrate, the collet arranged to remove the unpackaged die from the die holding substrate and pivot to place the unpackaged die on the secondary substrate.
5. The system according to claim 4 , wherein the collet pivots in a plane that is orthogonal to both a plane of the die holding substrate and a plane of the secondary substrate.
6. The system according to claim 1 , wherein the second sensor includes at least one of: a laser range finder or an optical sensor.
7. The system according to claim 1 , wherein the die separation device includes a plurality of transfer members.
8. The system according to claim 1 , wherein the first sensor includes at least one of: a laser range finder or an optical sensor.