IP Library Granted Patent US 10,325,793
Granted Patent B2
US 10,325,793 · App. 15/600,937 · Granted Jun 18, 2019

Method for producing crystal substrate

Inventors: Masahiro Hayashi (Kanagawa, JP); Chiharu Kimura (Miyagi, JP)
Assignee: SCIOCS COMPANY LIMITED
H01L21/67309H01L21/67011H01L21/67242H01L21/67353H01L21/6835H01L21/6836H01L21/68735C30B29/38C30B29/64H01L33/0095H01L33/16H01L2221/68327
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Quick Facts
Patent No.
US 10,325,793
App. No.
15/600,937
Granted
Jun 18, 2019
Kind
B2
Abstract

A method for producing a crystal substrate includes preparing, measuring, holding, and machining. The preparing prepares a crystal substrate body including a curved crystal lattice plane. The measuring measures a shape feature of the crystal lattice plane. The holding holds the crystal substrate body in a warped state in accordance with the shape feature measured by the measuring, to more flatten the crystal lattice plane than the crystal lattice plane at the preparing. The machining machines a surface of the crystal substrate body held in the warped state, to flatten the surface.

Claims (24)

1. A method for producing a crystal substrate, the method comprising:

(a) preparing a crystal substrate body including a curved crystal lattice plane;

(b) measuring a shape feature of the crystal lattice plane;

(c) sticking a back surface of the crystal substrate body to a convex or concave abutting surface and holding the crystal substrate body in a warped state to the convex or concave abutting surface in accordance with the shape feature measured in (b), to more flatten the crystal lattice plane than the crystal lattice plane prepared in (a); and

(d) machining a front surface of the crystal substrate body held in the warped state, to flatten the front surface.

2. The method according to claim 1 , wherein a distribution of an off-angle formed by the front surface of the crystal substrate body prepared in (a) and the crystal lattice plane has one extreme value.

3. The method according to claim 1 , wherein the machining in (d) further comprises machining the back surface of the crystal substrate body to be parallel to the front surface.

4. The method according to claim 1 , wherein a thickness of a work-affected layer of a portion machined in (d) is 1 μm or less.

5. The method according to claim 1 , wherein the crystal substrate body is a single crystal substrate of group 13 nitride.

6. The method according to claim 1 , wherein a shape similarity of the crystal lattice plane and the front surface of the crystal substrate body upon the machining in (d) is greater than that of the crystal lattice plane and the front surface in (a).

7. The method according to claim 1 , wherein the crystal lattice plane is internal to the crystal substrate body.

8. A method for producing a crystal substrate, the method comprising:

(aa) preparing a crystal substrate body including a curved crystal lattice plane;

(bb) sticking a back surface of the crystal substrate body to a convex or concave abutting surface in accordance with a shape feature of the curved crystal lattice plane, to more flatten the crystal lattice plane than the crystal lattice plane of the crystal substrate body prepared in (aa); and

(cc) machining a front surface of the crystal substrate body held in a warped state, to flatten the front surface.

9. The method according to claim 8 , wherein a distribution of an off-angle formed by the front surface of the crystal substrate body prepared in (aa) and the crystal lattice plane has one extreme value.

10. The method according to claim 8 , wherein the machining in (cc) further comprises machining the back surface of the crystal substrate body to be parallel to the front surface.

11. The method according to claim 8 , wherein a thickness of a work-affected layer of a portion machined in (cc) is 1 μm or less.

12. The method according to claim 8 , wherein the crystal substrate body is a single crystal substrate of group 13 nitride.

13. The method according to claim 8 , wherein a shape similarity of the crystal lattice plane and the front surface of the crystal substrate body upon the machining in (cc) is greater than that of the crystal lattice plane and the front surface in (aa).

14. The method according to claim 8 , wherein the crystal lattice plane is internal to the crystal substrate body.

15. The method according to claim 8 , further comprising:

(b1) measuring a shape feature of the crystal lattice plane of one crystal substrate body; and

(b2) performing (aa), (bb) and (cc) for each of one or more other crystal substrate bodies, in which the convex or concave abutting surface employed in (bb) for said each of one or more other crystal substrate bodies corresponds to the shape feature measured in (b1) from the one crystal substrate body.

Assignments (4)
MERGER Recorded Nov 16, 2022
From: SCIOCS COMPANY LIMITED
To: SUMITOMO CHEMICAL COMPANY, LIMITED
Reel/Frame 061949/0761 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 20, 2020
From: SCIOCS COMPANY LIMITED
To: SUMITOMO CHEMICAL COMPANY, LIMITED; SCIOCS COMPANY LIMITED
Reel/Frame 053550/0309 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2019
From: RICOH COMPANY, LTD.
To: SCIOCS COMPANY LIMITED
Reel/Frame 048379/0545 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2017
From: HAYASHI, MASAHIRO; KIMURA, CHIHARU
To: RICOH COMPANY, LTD.
Reel/Frame 042452/0001 →
Priority Claims (1)
JP 2016-106551 · May 27, 2016 · national
Continuity (1)
Related Publication 20170345694A1 · Nov 30, 2017