Board-to-board connectors and mounting structure

1. A method of assembling a circuit card assembly, the method comprising:

forming a first three dimensional trace by layer-by-layer additive manufacturing, wherein the first three dimensional trace comprises a first end and a second end;

forming a support structure and a fixture, wherein the support structure is connected to the first three dimensional trace and the fixture is connected to the support structure;

attaching the first three dimensional trace to a first printed wiring board with a first receiving feature by inserting the first end of the first three dimensional trace into the first receiving feature; and

attaching a second printed wiring board to the first three dimensional trace by receiving the second end of the first three dimensional trace in a second receiving feature of the second printed wiring board.

2. The method of claim 1 , wherein forming the first three dimensional trace comprises forming a plurality of traces in a three dimensional array.

3. The method of claim 2 , further comprising attaching a second trace to at least one of the first and second printed wiring boards and attaching at least a third printed wiring board to at least one of the first and second traces.

4. The method of claim 1 , further comprising removing the support structure from the first three dimensional trace.

5. The method of claim 1 , further comprising integrally forming the first three dimensional trace, the support structure, and the fixture together as a single piece of material.

6. The method of claim 1 , further comprising supporting the first three dimensional trace with the support structure during the additive manufacturing of the first three dimensional trace.

7. The method of claim 1 , further comprising removing the support structure and the fixture from the first three dimensional trace after the first printed wiring board is attached to the first three dimensional trace.

8. The method of claim 7 , wherein removing the support structure and the fixture from the first three dimensional trace comprises applying at least one of a frictional force, a torsional force, a tensile force, a compressive force, a vibration force, and a thermodynamic force to at least one of the support structure and the fixture.

9. A circuit card assembly formed by the method of claim 1 , wherein the circuit card assembly comprises:

the first printed wiring board with the first receiving feature;

the second printed wiring board with the second receiving feature; and

the first three dimensional trace, wherein the first end of the first three dimensional trace engages with the first receiving feature of the first printed wiring board, and wherein the second end of the first three dimensional trace engages with the second printed wiring board.

10. The method of claim 1 , wherein the circuit card assembly comprises a plurality of traces in a three dimensional array.

11. The method of claim 1 , wherein the first receiving feature of the first printed wiring board comprises a solder cup, a socket, a surface mount, or a thru-hole.

12. The method of claim 1 , wherein the second end of the first three dimensional trace comprises a pin or a socket.

13. The method of claim 1 , wherein the circuit card assembly further comprises a structural support, a stop, a chamfer, a heat sink, a test point lead, an electromagnetic shield, a locating feature, or a resilient element with a spring constant.

14. The method of claim 13 , further comprising tuning at least one of a material or a configuration of the structural support to match a frequency level of an airborne munition into which the circuit card assembly is configured to be installed.

15. The method of claim 1 , wherein the first three dimensional trace comprises a non-conductive material.

16. The method of claim 1 , wherein the second printed wiring board is disposed non-parallel to the first printed wiring board.

17. The method of claim 1 , further comprising providing spacing between the first and second traces such that at least one of electro-dynamic interference, thermodynamic interference, and arcing is prevented between the first and second traces.

18. The method of claim 1 , further comprising electrically insulating the circuit card assembly by inserting a potting material between any two or more of the first three dimensional trace, the second trace, the first printed wiring board, and the second printed wiring board.

19. The method of claim 1 , further comprising tuning a spring constant of at least one of the first or second traces by adjusting at least one of a quantity, a length, and a size of the at least one of the first or second traces.

20. A method of assembling a circuit card assembly, the method comprising:

forming a first three dimensional trace by layer-by-layer additive manufacturing, wherein the first three dimensional trace comprises a first end and a second end, wherein forming the first three dimensional trace comprises forming a plurality of traces in a three dimensional array;

attaching the first three dimensional trace to a first printed wiring board with a first receiving feature by inserting the first end of the first three dimensional trace into the first receiving feature;

attaching a second printed wiring board to the first three dimensional trace by receiving the second end of the first three dimensional trace in a second receiving feature of the second printed wiring board;

attaching a second trace to at least one of the first and second printed wiring boards; and

attaching at least a third printed wiring board to at least one of the first and second traces.