Antenna structure incorporated in heat spreader, heat sink, and cooling fins
An antenna system reusing metallic components in a device includes a first antenna element which is also configured to transfer heat into surrounding air; a ground plane which is part of reused metallic components in the device for heat dissipation; and a first physical connection between the first antenna element and the ground plane which supports thermal conductivity based on an associated size and material of the first physical connection.
1. An antenna system reusing metallic components in a device, the antenna system comprising:
a first antenna element which is also configured to transfer heat into surrounding air;
a ground plane which is part of reused metallic components in the device for heat dissipation; and
a first physical connection between the first antenna element and the ground plane which supports thermal conductivity based on an associated size and material of the first physical connection, wherein the first physical connection is metal, and supports both electrical conductivity and thermal conductivity, and wherein the first antenna element comprises an inductance loop between the ground plane via the first metal connection and an antenna connection.
2. The antenna system of claim 1 , wherein the reused metallic components comprise a Faraday cage and/or Electromagnetic Interference (EMI) shield for circuitry in the device.
3. The antenna system of claim 1 , wherein the first antenna element further operates as a cooling fin, and wherein the ground plane is part of a heat sink in the device.
4. The antenna system of claim 1 , further comprising:
a second antenna element which is also configured to transfer heat into surrounding air, wherein the second antenna element shares the ground plane with the first antenna element; and
a second physical connection between the second antenna element and the ground plane which supports thermal conductivity based on an associated size and material of the second physical connection.
5. The antenna system of claim 4 , wherein the first antenna element and the second antenna element are positioned such that effective current flow from the first antenna element and the second antenna element is substantially orthogonal to one another on the ground plane.
6. The antenna system of claim 4 , wherein the second physical connection is metal, and supports both electrical conductivity and thermal conductivity.
7. The antenna system of claim 4 , wherein the ground plane comprises one or more slits or slots between the first antenna element and the second antenna element.
8. The antenna system of claim 1 , wherein the first antenna element is a folded or stacked element to increase the heat transfer.
9. The antenna system of claim 1 , further comprising:
an extension plate connected to the first antenna element via an inductor, to increase the heat transfer.
10. The antenna system of claim 1 , further comprising:
a second antenna element, a third antenna element, and a fourth antenna element each of which is also configured to transfer heat into surrounding air, wherein the second antenna element, the third antenna element, and the fourth antenna element shares the ground plane with the first antenna element; and
a second physical connection between the second antenna element and the ground plane, a third physical connection between the third antenna element and the ground plane, and a fourth physical connection between the fourth element and the ground plane each of which supports thermal conductivity based on an associated size and material of the respective connection.
11. The antenna system of claim 10 , wherein the first antenna element and the second antenna element are positioned such that effective current flow from the first antenna element and the second antenna element is substantially orthogonal to one another on the ground plane, and
wherein the third antenna element and the fourth antenna element are positioned such that effective current flow from the third antenna element and the fourth antenna element is substantially orthogonal to one another on the ground plane.
12. The antenna system of claim 10 , wherein the ground plane comprises one or more slits or slots between the first antenna element, the second antenna element, the third antenna element, and the fourth antenna element.
13. The antenna system of claim 1 , wherein the reused metallic components substantially surround one or more of a Radio Frequency (RF) board, a power board, and a Printed Circuit Board (PCB) in the device.
14. A combined antenna and heat sink apparatus in a device, the combined antenna and heat sink apparatus comprising:
a heat sink structure enclosing one or more of a Radio Frequency (RF) board, a power board, and a Printed Circuit Board (PCB) in the device, wherein the heat sink structure is one or more of a Faraday cage and/or Electromagnetic Interference (EMI) shield for circuitry and power in the device; and
one or more antenna elements thermally coupled to the heat sink structure such that the heat sink structure operates as a ground plane to the one or more antenna structure, the one or more antenna elements operate as cooling fins for the heat sink.
15. The combined antenna and heat sink apparatus of claim 14 , wherein the one or more antenna elements comprise at least two antenna elements positioned such that effective current flow is substantially orthogonal to one another on the ground plane.
16. The combined antenna and heat sink apparatus of claim 14 , wherein the heat sink structure comprises one or more slits or slots between the electrical coupling of the one or more antenna elements.
17. A wireless Access Point (AP) with an antenna structure reusing metallic components in the wireless AP, the wireless AP comprising:
Radio Frequency (RF) components;
circuitry and power components;
a heat sink structure adjacent to the RF components and/or the circuitry and power components;
one or more 2.4 GHz antenna elements thermally coupled to the heat sink structure such that the heat sink structure acts as a ground plane to the one or more 2.4 GHz antenna elements; and
one or more 5 GHz antenna elements thermally coupled to the heat sink structure such that the heat sink structure acts as the ground plane to the one or more 5 GHz antenna elements.
18. The wireless AP of claim 16 , wherein the one or more 2.4 GHz antenna elements and the one or more 5 GHz antenna elements act as cooling fins for the heat sink structure.
19. An antenna system reusing metallic components in a device, the antenna system comprising:
a first antenna element which is also configured to transfer heat into surrounding air;
a ground plane which is part of reused metallic components in the device for heat dissipation;
a first physical connection between the first antenna element and the ground plane which supports thermal conductivity based on an associated size and material of the first physical connection;
a second antenna element which is also configured to transfer heat into surrounding air, wherein the second antenna element shares the ground plane with the first antenna element; and
a second physical connection between the second antenna element and the ground plane which supports thermal conductivity based on an associated size and material of the second physical connection.
20. An antenna system reusing metallic components in a device, the antenna system comprising:
a first antenna element which is also configured to transfer heat into surrounding air;
a ground plane which is part of reused metallic components in the device for heat dissipation;
a first physical connection between the first antenna element and the ground plane which supports thermal conductivity based on an associated size and material of the first physical connection; and
an extension plate connected to the first antenna element via an inductor, to increase the heat transfer.