Printed circuit board and method of manufacturing the same
A printed circuit board (PCB) includes: a substrate; and a circuit pattern disposed on the substrate, wherein the circuit pattern includes a first seed layer disposed on the substrate and including a nitride, and a metal layer disposed on the first seed layer.
1. A printed circuit board comprising:
a substrate;
an insulating resin disposed on the substrate and including epoxy and cyanate;
a circuit pattern disposed on the insulating resin; and
a via disposed on the substrate and the insulating resin,
wherein each of the circuit pattern and the via includes:
a first seed layer disposed on the insulating resin and including a nitride;
a second seed layer disposed on the first seed layer and including at least one metal material of copper and nickel; and
a metal layer disposed on the second seed layer,
wherein the insulating resin has a surface roughness of 0.3 μm or less,
wherein the insulating resin includes a via hole passing through top and bottom surfaces of the insulating resin,
wherein the first seed layer is disposed on an inner wall of the via hole to expose a top surface of the substrate, and
wherein the top surface of the substrate comprises:
a first portion being in direct contact with the insulating resin;
a second portion being in direct contact with the first seed layer of the via;
a third portion being in direct contact with the second seed layer of the via; and
a fourth portion being in direct contact with the metal layer of the via.
2. The printed circuit board of claim 1 , wherein the first seed layer includes at least one of titanium nitride (TiN), nickel nitride (NiN), copper nitride (CuN), molybdenum nitride (MoN), tantalum nitride (TaN), and chromium nitride.
3. The printed circuit board of claim 1 , wherein the first seed layer has a thickness in the range of 10 nm to 70 nm.
4. The printed circuit board of claim 1 , wherein the second seed layer has a thickness in the range of 200 nm to 400 nm.