Circuit board
A circuit board may include an insulating layer; a circuit pattern disposed above the top surface of or below the bottom surface of the insulating layer; and a buffer layer disposed between the insulating layer and the circuit pattern, the buffer layer comprising carbon atoms, nitrogen atoms, oxygen atoms, silicon atoms, sulfur atoms, and metal atoms. The ratio of the carbon atoms to the metal atoms ((carbon atom/copper atom)*100) is within a range of 5-7; the ratio of the nitrogen atoms to the metal atoms ((nitrogen atom/copper atom)*100) is within a range of 1.5-7; the ratio of the oxygen atoms to the metal atoms ((oxygen atom/copper atom)*100) is within a range of 1.1-1.9; and the ratio of the silicon atoms to the metal atoms ((silicon atom/copper atom)*100) is within a range of 0.5-0.9; and the ratio of the sulfur atoms to the metal atoms ((sulfur atom/copper atom)*100) is within a range of 0.5-1.5.
1. A circuit board comprising:
an insulating layer;
a circuit pattern disposed on the insulating layer; and
a buffer layer disposed between the insulating layer and the circuit pattern,
wherein the buffer layer includes carbon atoms, nitrogen atoms, oxygen atoms, silicon atoms, sulfur atoms, and copper atoms,
a mass ratio of the carbon atoms to the copper atoms ((carbon atom/copper atom)*100) is within a range of 5 to 7,
a mass ratio of the nitrogen atoms to the copper atoms ((nitrogen atom/copper atom)*100) is within a range of 1.5 to 7,
a mass ratio of the oxygen atoms to the copper atoms ((oxygen atom/copper atom)*100) is within a range of 1.1 to 1.9,
a mass ratio of the silicon atoms to the copper atoms ((silicon atom/copper atom)*100) is within a range of 0.5 to 0.9, and
a mass ratio of the sulfur atoms to the copper atoms ((sulfur atom/copper atom)*100) is within a range of 0.5 to 1.5.
2. The circuit board of claim 1 , wherein the buffer layer is disposed between a surface of the insulating layer and the circuit pattern.
3. The circuit board of claim 1 , wherein the buffer layer is disposed on an upper surface, a lower surface, and side surfaces of the circuit pattern.
4. The circuit board of claim 1 , wherein the buffer layer is disposed on an upper surface and a lower surface of the circuit pattern.
5. The circuit board of claim 1 , wherein a thickness of the buffer layer is 5 nm to 500 nm.
6. The circuit board of claim 1 , wherein the carbon atoms, the nitrogen atoms, the oxygen atoms, the silicon atoms, the sulfur atoms, and the copper atoms are provided in the buffer layer in molecular or ionic form.
7. The circuit board of claim 1 , wherein the carbon atoms, the nitrogen atoms, the oxygen atoms, the silicon atoms, and the sulfur atoms are bonded to each other and are provided in a plurality of molecules of the buffer layer,
the copper atoms are provided as a copper ion, and
the molecules are chemically bonded to the copper ion.
8. The circuit board of claim 1 , wherein the buffer layer includes a plurality of terminal groups connected to the insulating layer and the circuit pattern, and
the terminal groups are covalent-bonded or coordinate-bonded to the insulating layer and the circuit pattern.
9. The circuit board of claim 1 ,
wherein the buffer layer includes a first functional group bonded to the insulating layer and a second functional group bonded to the circuit pattern.
10. The circuit board of claim 9 , wherein the first functional group includes a hydroxyl group (—OH) and an N group of an azole group, and
the second functional group includes a Si group and a thiocyanate group (—SCN) of a silane group.
11. The circuit board of claim 10 , wherein the first functional group is covalent-bonded to the insulating layer,
the second functional group is coordinate-bonded to the circuit pattern.
12. The circuit board of claim 1 , wherein the circuit pattern includes at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn).
13. The circuit board of claim 1 , wherein the insulating layer includes a plurality of insulating layers,
the circuit pattern is disposed on each of the insulating layers, and
the buffer layer is disposed between at least one insulating layer of the plurality of insulating layers and the circuit pattern.
14. The circuit board of claim 1 , wherein the buffer layer is disposed to surround the circuit pattern.
15. The circuit board of claim 1 , wherein the buffer layer is disposed only where the circuit pattern and the insulating layer overlap.
16. A circuit board comprising:
an insulating layer;
a circuit pattern disposed on the insulating layer; and
a buffer layer disposed between the insulating layer and the circuit pattern,
wherein the buffer layer includes a first functional group that is chemically bonded to the insulating layer, and a second functional group that is bonded to the circuit pattern, the first functional group including oxygen atoms, carbon atoms and nitrogen atoms, and the second functional group including carbon atoms, nitrogen atoms, silicon atoms and sulfur atoms
wherein the buffer layer further includes metal atoms to bond with the oxygen atoms, the carbon atoms, the nitrogen atoms, the silicon atoms and the sulfur atoms,
wherein the metal atoms are copper atoms,
a mass ratio of the carbon atoms to the copper atoms ((carbon atom/copper atom)*100) is within a range of 5 to 7,
a mass ratio of the nitrogen atoms to the copper atoms ((nitrogen atom/copper atom)*100) is within a range of 1.5 to 7,
a mass ratio of the oxygen atoms to the copper atoms ((oxygen atom/copper atom)*100) is within a range of 1.1 to 1.9,
a mass ratio of the silicon atoms to the copper atoms ((silicon atom/copper atom)*100) is within a range of 0.5 to 0.9, and
a mass ratio of the sulfur atoms to the copper atoms ((sulfur atom/copper atom)*100) is within a range of 0.5 to 1.5.