IP Library › Granted Patent US 9,857,609
Granted Patent B2
US 9,857,609 · App. 15/609,701 · Granted Jan 2, 2018

Integrated microwave-to-optical single-photon transducer with strain-induced electro-optic material

Inventors: Lev S. Bishop (Dobbs Ferry, NY); Stefan Filipp (Zurich, CH); Jay M. Gambetta (Yorktown Heights, NY); Jason S. Orcutt (Katonah, NY); Hanhee Paik (Danbury, CT)
Assignee: International Business Machines Corporation
G02F1/011G02B6/29341G06N99/002G02F2203/15
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Quick Facts
Patent No.
US 9,857,609
App. No.
15/609,701
Granted
Jan 2, 2018
Kind
B2
Abstract

Transducers and methods of making the same include a substrate having a cavity with a diameter that supports whispering gallery modes at a frequency of an input signal. A focusing structure in the cavity focuses the electric field of the input signal. A resonator directly under the focusing structure has a crystalline structure that generates an electro-optic effect when exposed to electrical fields. An electric field of the input signal modulates an output signal in the resonator via the electro-optic effect.

Claims (32)

1. A quantum computing device, comprising:

a qubit configured to provide a first signal at a first frequency;

a transducer coupled to the qubit, comprising:

a substrate having a cylindrical cavity with a diameter that supports whispering gallery modes at the first frequency;

a central pin in the cavity; and

a resonator directly under the central pin, having a crystalline structure that generates an electro-optic effect when exposed to electrical fields, wherein an electric field of the input signal modulates a second signal at a second frequency in the resonator via the electro-optic effect; and

a waveguide, optically coupled to the resonator, that is configured to convey the modulated second signal away from the resonator.

2. The quantum computing device of claim 1 , wherein the transducer further comprises a superconducting film that is formed directly on an inner surface of the cavity and on an outer surface of the central pin.

3. The quantum computing device of claim 1 , wherein the resonator is formed from a first material having grooves in a top surface with a second material formed in the grooves, wherein the second material creates a strain in a crystalline structure of the first material to generate the electro-optic effect in the resonator.

4. The quantum computing device of claim 3 , wherein the resonator comprises an optical disc structure.

5. The quantum computing device of claim 3 , wherein the resonator comprises an optical ring structure.

6. The quantum computing device of claim 3 , wherein the first material includes silicon and the second material includes silicon germanium.

7. The quantum computing device of claim 1 , wherein the central pin comprises a surface facing toward the resonator, the surface having a ridge along an outer circumference.

8. The quantum computing device of claim 7 , wherein the ridge on the central pin is positioned directly on the resonator.

9. The quantum computing device of claim 7 , wherein the ridge on the central pin is positioned above the resonator to provide a small gap between the ridge and the resonator.

10. The quantum computing device of claim 1 , wherein the first frequency is a microwave frequency and the second frequency is an optical frequency.

11. The quantum computing device of claim 1 , wherein the central pin is coaxial with the cavity.

12. The quantum computing device of claim 1 , wherein the transducer further comprises a second cavity underneath the resonator having a same diameter as the cavity in the substrate.

13. The quantum computing device of claim 1 , wherein the transducer is coupled to the qubit via a superconducting channel disposed within the substrate.

14. The quantum computing device of claim 1 , wherein the cavity includes a radius of about 2.5 millimeters and the central pin includes a radius of about 2 millimeters.

15. The quantum computing device of claim 1 , wherein the resonator includes a diameter that provides three modes at frequencies ω op −ω q for a red-sideband, ω op for a carrier, and ω op +ω q for a blue-side band, with ω q being a microwave frequency of a microwave resonator.

16. A quantum computing device, comprising:

a qubit configured to provide a first signal at a first frequency;

a transducer coupled to the qubit, comprising:

a substrate having a cylindrical cavity with a diameter that supports whispering gallery modes at the first frequency;

a central pin in the cavity, wherein an outer surface of the central pin and an inner surface of the cavity have a superconducting film formed directly thereon; and

a resonator directly under the central pin, having a crystalline structure that generates an electro-optic effect when exposed to electrical fields, wherein an electric field of the input signal modulates a second signal at a second frequency in the resonator via the electro-optic effect, the resonator being formed from a first material having grooves in a top surface with a second material formed in the grooves, wherein the second material creates a strain in a crystalline structure of the first material to generate the electro-optic effect in the resonator; and

a waveguide, optically coupled to the resonator, that is configured to convey the modulated second signal away from the resonator.

17. The quantum computing device of claim 16 , wherein the first material includes silicon and the second material includes silicon germanium.

18. The quantum computing device of claim 16 , wherein the central pin comprises a surface facing toward the resonator, the surface having a ridge along an outer circumference.

19. The quantum computing device of claim 16 , wherein the transducer further comprises a second cavity underneath the resonator having a same diameter as the cavity in the substrate.

20. The quantum computing device of claim 16 , wherein the transducer is coupled to the qubit via a superconducting channel disposed within the substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2017
From: BISHOP, LEV S.; FILIPP, STEFAN; GAMBETTA, JAY M.; ORCUTT, JASON S.; PAIK, HANHEE
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 042546/0609 →
Continuity (2)
Division 15018288 · Feb 8, 2016
Related Publication 20170261770A1 · Sep 14, 2017