IP Library Granted Patent US 10,359,241
Granted Patent B2
US 10,359,241 · App. 15/609,713 · Granted Jul 23, 2019

Using a conductive sheet that includes graphene for thermal conductivity and for grounding

Inventors: John Trevor Morrison (Round Rock, TX); Jace W. Files (Round Rock, TX); Travis C. North (Cedar Park, TX)
Assignee: Dell Products L.P.
F28F21/02G06F1/203H01L23/3733H01L23/427H05K7/2039H05K7/20336F28D15/02F28D2021/0029
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Quick Facts
Patent No.
US 10,359,241
App. No.
15/609,713
Granted
Jul 23, 2019
Kind
B2
Abstract

In some examples, a computing device may include a set of components (e.g., processor, memory, and the like) and a conductive sheet (or cable). The conductive sheet (or cable) may include a first graphene layer to dissipate at least a portion of heat generated by a component (e.g., the processor) of the first set of components and a second graphene layer that is used as an electrical ground by signals communicated between a first component and a second component of the set of components. The computing device may include a single housing or a first housing (with a first display device) attached to a second housing (with a second display device) by one or more hinges.

Claims (68)

1. A computing device comprising:

a set of components;

a conductive sheet comprising:

a routing layer to route a plurality of cables, the plurality of cables including at least a first cable and a second cable;

a first graphene layer to dissipate at least a portion of heat generated by a component of the set of components;

a second graphene layer to provide an electrical ground to one or more signals communicated between the first cable and the second cable;

a conductive layer through which the one or more signals are communicated; and

an insulation layer located between the second graphene layer and the conductive layer to insulate the electrical ground from the one or more signals.

2. The computing device of claim 1 , wherein:

the one or more signals include at least one of a data signal or a power signal.

3. The computing device of claim 1 , wherein:

the first graphene layer is in contact with a heat sink attached to at least one component of the set of components.

4. The computing device of claim 3 , wherein:

the heat sink comprises a vapor chamber.

5. The computing device of claim 1 , wherein the conductive layer comprises a metal or a metal alloy.

6. The computing device of claim 1 , wherein the conductive sheet further comprises:

one or more openings through which at least one of the first cable or the second cable is routed to contact one of:

the conductive layer,

or

the second graphene layer.

7. The computing device of claim 1 , wherein at least one of the first graphene layer or the second graphene layer is doped using at least one of potassium nitrate (KNO3), lithium (Li), or gold chloride (AuCl3).

8. A computing device comprising:

a first housing comprising:

a first display device;

a first set of components; and

a heat sink in contact with at least a first component of the first set of components;

a second housing comprising:

a second display device;

a second set of components;

one or more hinges coupling the first housing to the second housing; and

a conductive sheet comprising:

a routing layer to route a plurality of cables, the plurality of cables including at least a first cable and a second cable;

a first graphene layer to dissipate at least a portion of heat generated by the first set of components;

a second graphene layer to provide an electrical ground to one or more signals communicated between a first component of the first set of components and a second component of the second set of components;

a conductive layer through which the one or more signals are communicated; and

an insulation layer located between the second graphene layer and the conductive layer to insulate the electrical ground from the one or more signals.

9. The computing device of claim 8 , wherein:

the one or more signals include at least one of a data signal or a power signal.

10. The method of claim 8 , wherein:

the first graphene layer is in contact with the heat sink attached to at least one component of the first set of components.

11. The computing device of claim 8 , wherein:

at least one of the first grapheme layer or the second grapheme layer is doped using at least one of potassium nitrate (KNO3), lithium (Li), or gold chloride (AuCl3).

12. The computing device of claim 8 , wherein:

the heat sink comprises a vapor chamber.

13. The computing device of claim 8 , wherein the conductive sheet further comprises:

one or more openings through which at least one of the first cable or the second cable is routed to contact one of:

the conductive layer, or

the second graphene layer.

14. The computing device of claim 8 , wherein the conductive layer comprises a metal or a metal alloy.

15. A computing device comprising:

a set of components including a central processing unit (CPU);

a conductive sheet comprising:

a routing layer to route a plurality of cables, the plurality of cables including at least a first cable and a second cable;

a first graphene layer to dissipate at least a portion of heat generated by a component of the set of components;

a second graphene layer to provide an electrical ground to one or more signals communicated between the first cable and the second cable;

a conductive layer through which the one or more signals are communicated; and

an insulation layer located between the second graphene layer and the conductive layer to insulate the electrical ground from the one or more signals.

16. The computing device of claim 15 , wherein:

the one or more signals include at least one of a data signal or a power signal.

17. The computing device of claim 15 , wherein:

the first graphene layer is in contact with a heat sink that is attached to the CPU.

18. The computing device of claim 15 , wherein the conductive layer comprises a metal or a metal alloy.

19. The computing device of claim 15 , wherein:

at least one of first graphene layer or the second graphene layer is doped using at least one of potassium nitrate (KNO3), lithium (Li), or gold chloride (AuCl3).

20. The computing device of claim 15 , further comprising:

a first housing that includes a first display device and the set of components;

a second housing that includes a second display device, wherein the conductive layer electrically couples the set of components in the first housing with a second set of components in the second housing, the second set of components comprising the second display device; and

one or more hinges attaching the first housing to the second housing.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (043775/0082) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060958/0468 →
RELEASE OF SECURITY INTEREST AT REEL 043772 FRAME 0750 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 058298/0606 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY AGREEMENT (CREDIT) Recorded Sep 6, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 043772/0750 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Sep 6, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 043775/0082 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 1, 2017
From: MORRISON, JOHN TREVOR; FILES, JACE W.; NORTH, TRAVIS C.
To: DELL PRODUCTS L. P.
Reel/Frame 042561/0671 →
Continuity (1)
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