Server cooling fluid inlet and pickup placement in submerged cooling enclosures

1. A cooling device, comprising:

a connection block including a surface and including an inlet passage and an outlet passage;

a first membrane defining a first volume with a first opening at a first end thereof, wherein the first membrane is sealingly engaged with the surface around the inlet passage;

a second membrane defining a second volume with a second opening at a second end thereof and defining a plurality of apertures, wherein the second membrane is sealingly engaged with the surface inside of the first membrane and around the outlet passage; and

a substrate that is arranged in the second membrane, that is connected to the surface, and that includes at least one heat-generating device, wherein coolant fluid flows into the first volume via the inlet passage, through the plurality of apertures into the second volume, and exits via the outlet passage.

2. The cooling device of claim 1 , further comprising:

a first closure structure configured to create a liquid impermeable seal at an interface formed between the surface and the first membrane; and

a second closure structure configured to create a liquid impermeable seal at an interface formed between the surface and the second membrane.

3. The cooling device of claim 1 , further comprising adhesive to create a liquid impermeable seal at an interface formed between the surface and the first membrane and the surface and the second membrane.

4. The cooling device of claim 1 , further comprising thermoplastic material to create a first liquid impermeable seal at an interface formed between the surface and the first membrane and the surface and the second membrane.

5. The cooling device of claim 1 , further comprising an elastic material to create a liquid impermeable seal at an interface formed between the surface and the first membrane and the surface and the second membrane.

6. The cooling device of claim 1 , wherein the substrate includes a printed circuit board and the at least one heat-generating device comprises at least one of an electronic device and a heat sink.

7. The cooling device of claim 1 , further comprising a plurality of internal support structures arranged inside of the second volume to internally support the second membrane.

8. The cooling device of claim 7 , wherein the plurality of internal support structures include internal fluid passages.

9. The cooling device of claim 8 , further comprising nozzles connected to at least one of the plurality of internal support structures to direct fluid towards the at least one heat-generating device.

10. The cooling device of claim 1 , wherein the substrate includes a first connector and the connection block includes a second connector, and wherein the first connector mates with the second connector.

11. The cooling device of claim 10 , wherein the substrate receives data and power signals via the first and second connectors.

12. A cooling device, comprising:

a connection block including a surface and including an inlet passage and an outlet passage;

a membrane defining a volume with a first opening at a first end thereof, wherein the membrane is sealingly engaged with the surface around the inlet passage and the outlet passage;

a substrate that is arranged in the membrane, that is connected to the surface, and that includes at least one heat-generating device, wherein coolant fluid flows into the volume via the inlet passage and exits via the outlet passage; and

a conduit in fluid communication with at least one of the inlet passage and the outlet passage, the conduit extending outwardly from the connection block in a cantilever configuration.

13. The cooling device of claim 12 , further comprising:

a closure structure configured to create a liquid impermeable seal at an interface formed between the surface and the membrane.

14. The cooling device of claim 12 , further comprising adhesive to create a liquid impermeable seal at an interface formed between the surface and the membrane.

15. The cooling device of claim 12 , further comprising thermoplastic material to create a liquid impermeable seal at an interface formed between the surface and the membrane.

16. The cooling device of claim 12 , further comprising an elastic material to create a liquid impermeable seal at an interface formed between the surface and the membrane.

17. The cooling device of claim 12 , wherein the connection block and the substrate define a channel configured to receive the membrane.

18. The cooling device of claim 12 , further comprising a plurality of internal support structures arranged inside of the volume to internally support the membrane.

19. The cooling device of claim 18 , further comprising nozzles connected to at least one of the plurality of internal support structures to direct fluid towards the at least one heat-generating device.

20. A cooling device for fluid submersion of heat-generating devices, comprising:

a connection block including a surface and including an inlet passage and an outlet passage;

a first membrane defining a first volume with a first opening at a first end thereof, wherein the first membrane is sealingly engaged with the surface around the inlet passage;

a second membrane defining a second volume with a second opening at a second end thereof and defining a plurality of apertures, wherein the second membrane is sealingly engaged with the surface inside of the first membrane and around the outlet passage;

a substrate that is arranged in the second membrane, that is connected to the surface, and that includes at least one heat-generating device, wherein coolant fluid flows into the first volume, through the plurality of apertures into the second volume, and exits the outlet passage; and

a plurality of internal support structures arranged inside of the second volume to internally support the second membrane.