Power semiconductor device and method of fabricating the same
Provided is a power semiconductor device comprising a gate electrode in a trench of a substrate; a body region having a first conductivity type on one side of the gate electrode; a source region having a second conductivity type adjacent to the gate electrode; a floating region having a first conductivity type on the other side of the gate electrode; an edge doped region having a first conductivity type spaced apart from the floating region and electrically connected to the source region; an edge junction isolation region having a second conductivity type between the floating region and the edge doped region; and a drift region having a second conductivity type below the floating, edge doped, and edge junction isolation regions, wherein the doping concentration of a second conductivity type in the edge junction isolation region is higher than the doping concentration of a second conductivity type in the drift region.
1. A power semiconductor device comprising:
a gate electrode disposed in a trench of a substrate;
a body region having a first conductivity type disposed on one side of the gate electrode in the substrate;
a source region having a second conductivity type disposed adjacent to the gate electrode in the body region having a first conductivity type;
a floating region having a first conductivity type disposed on the other side of the gate electrode in the substrate;
an edge doped region having a first conductivity type spaced apart from the floating region having a first conductivity type and electrically connected to the source region in the substrate;
an edge junction isolation region having a second conductivity type interposed between the floating region having a first conductivity type and the edge doped region having a first conductivity type in the substrate; and
a drift region having a second conductivity type disposed below the floating region having a first conductivity type, the edge doped region having a first conductivity type, and the edge junction isolation region having a second conductivity type,
wherein the doping concentration of a second conductivity type in the edge junction isolation region is higher than the doping concentration of a second conductivity type in the drift region.
2. The device of claim 1 ,
wherein the edge doped region having a first conductivity type is disposed in an edge termination region of the device.
3. The device of claim 1 , further comprising:
a wiring pattern disposed on the substrate to electrically connect the source region and the edge doped region having a first conductivity type.
4. The device of claim 1 ,
wherein the floating region having a first conductivity type surrounds the bottom surface and at least the other side of the gate electrode,
wherein the maximum doping depth of the floating region having a first conductivity type is larger than the depth of the trench, and
wherein the maximum doping depth of the edge doped region having a first conductivity type is larger than the depth of the trench.
5. The device of claim 4 ,
wherein, in a vertical distribution of the electric field from an upper surface of the substrate through a region between the floating region having a first conductivity type and the edge doped region having a first conductivity type to a lower surface of the substrate, a depth at which a maximum electric field is located is larger than the depth of the trench.
6. The device of claim 1 ,
wherein the substrate includes a wafer and an epitaxial layer grown on the wafer, and
wherein a region below the floating region having a first conductivity type and a region below the edge doped region having a first conductivity type include a boundary surface between the wafer and the epitaxial layer.
7. The device of claim 1 ,
wherein the second conductivity type and the first conductivity type have opposite conductivity types and are each one of n-type and p-type.
8. A method for fabricating a power semiconductor device, the method comprising:
implanting impurities having a first conductivity type into a first region and a second region on a wafer;
implanting impurities having a second conductivity type, which have a higher doping concentration than that of the impurities having a second conductivity type in the wafer, into a third region disposed between the first region and the second region;
forming a substrate by forming an epitaxial layer on the wafer, the substrate comprising the wafer and the epitaxial layer;
forming a floating region having a first conductivity type in the substrate corresponding to the first region, an edge doped region having a first conductivity type in the substrate corresponding to the second region, and an edge junction isolation region having a second conductivity type in the substrate corresponding to the third region, by diffusing the impurities;
forming a source region having a second conductivity type by implanting impurities into the epitaxial layer and diffusing the impurities; and
forming a wiring pattern for electrically connecting the source region and the edge doped region.
9. The method of claim 8 ,
wherein a region below the floating region having a first conductivity type and a region below the edge doped region having a first conductivity type include a boundary surface between the wafer and the epitaxial layer.