IP Library Granted Patent US 10,324,127
Granted Patent B2
US 10,324,127 · App. 15/617,266 · Granted Jun 18, 2019

Electronic component handling apparatus, electronic component testing apparatus, and electronic component testing method

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Quick Facts
Patent No.
US 10,324,127
App. No.
15/617,266
Granted
Jun 18, 2019
Kind
B2
Abstract

An electronic component handling apparatus ( 10 ) is provided which can improve the operation rate. The electronic component handling apparatus ( 10 ) includes: a contact arm ( 300 ) having a holding part ( 380 ) configured to hold a DUT ( 10 A), the contact arm ( 300 ) being configured to press the DUT ( 10 A) against a socket ( 410 ); an alignment device ( 200 ) including a camera ( 221 ) and a operation unit ( 230 ), the camera ( 221 ) being configured to image the DUT ( 10 A) to acquire image information, the operation unit ( 230 ) being configured to adjust a position of the holding part ( 380 ) within a range of a maximum alignment amount (AL max ); and a control device ( 105 ) configured to control the contact arm ( 300 ) and the alignment device ( 200 ). When a predetermined condition is not satisfied, the control device ( 105 ) controls the contact arm ( 300 ) and the alignment device ( 200 ) so as to perform preliminary alignment work at least once. When the predetermined condition is satisfied, the control device ( 105 ) controls the contact arm ( 300 ) and the alignment device ( 200 ) so as to perform main alignment work.

Claims (47)

1. An electronic component handling apparatus configured to handle a device under test (DUT), the apparatus comprising:

a contact arm having a holding part configured to hold the DUT, the contact arm being configured to press the DUT against a socket;

an alignment device including an imaging part and a driving part, the imaging part being configured to image the DUT to acquire image information, and the driving part being configured to move the holding part within a maximum moveable amount so as to adjust a position of the holding part; and

a control device configured to control the contact arm and the alignment device, wherein,

the maximum movable amount is an invariable value,

the driving part cannot move the holding part over the maximum movable amount,

the control device calculates a correction amount for respectively positioning the holding part with respect to the socket on a basis of the image information,

the control device determines whether the correction amount is larger than the maximum movable amount,

when the correction amount is larger than the maximum movable amount, the control device controls the driving part to move the holding part by the maximum movable amount, and

when the correction amount is not larger than the maximum movable amount, the control device controls the driving part to move the holding part by the correction amount.

2. The electronic component handling apparatus according to claim 1 , wherein

when the correction amount is larger than the maximum movable amount, the control device controls the contact arm and the alignment device to perform a preliminary alignment work,

when the correction amount is not larger than the maximum movable amount, the control device controls the contact arm and the alignment device to perform main alignment work for relatively positioning the DUT with respect to the socket,

the preliminary alignment work includes:

a first operation in which the holding part holds the DUT,

a second operation in which the driving part moves the holding part by the maximum movable amount, and

a third operation in which the holding part places the DUT, and

the main alignment work includes:

a fourth operation in which the holding part holds the DUT again, and

a fifth operation in which the driving part moves the holding part by the correction amount, and

the control device controls the contact arm to press the DUT against the socket after the main alignment work.

3. The electronic component handling apparatus according to claim 2 , wherein

the socket is provided at a test head or at a tip of the holding part,

at least the preliminary alignment work of the preliminary alignment work and main alignment work includes an operation in which the imaging part images the DUT, and

the DUT imaged by the imaging part is in a state of being held by the holding part or in a state before being held by the holding part.

4. The electronic component handling apparatus according to claim 1 , wherein

the contact arm has

a base part,

an adjustment unit configured to relatively move and/or rotate the holding part with respect to the base part, and

a lock and free unit configured to restrain relative movement and/or rotation of the holding part with respect to the base part, and

the driving part includes an operation unit configured to operate the adjustment unit.

5. An electronic component testing apparatus configured to test a DUT, comprising:

the electronic component handling apparatus according to claim 1 ;

a test head to which the socket is attached; and

a tester to which the test head is electrically connected.

6. An electronic component testing method for relatively positioning a device under test (DUT) with respect to a socket using image information of the DUT and testing the DUT,

the electronic component testing method being performed using an electronic component handling apparatus,

the electronic component handling apparatus comprising:

a contact arm having a holding part configured to hold the DUT, the contact arm being configured to press the DUT against a socket; and

an alignment device including an imaging part and a driving part, the imaging part being configured to image the DUT to acquire image information, and the driving part being configured to move the holding part within a maximum movable amount so as to adjust a position of the holding part, wherein

the maximum alignment amount is an invariable value, and

the driving part cannot move the holding part over the maximum movable amount,

the method comprises:

calculating a correction amount for respectively positioning the holding part with respect to the socket on a basis of the image information,

determining whether the correction amount is larger than the maximum movable amount,

moving the holding part with the driving part by the maximum movable amount when the correction amount is larger than the maximum movable amount; and

moving the holding part with the driving part by the correction amount when the correction is not larger than the maximum movable amount.

Assignments (2)
CHANGE OF ADDRESS Recorded Dec 18, 2018
From: ADVANTEST CORPORATION
To: ADVANTEST CORPORATION
Reel/Frame 047987/0626 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 16, 2017
From: KATO, YASUYUKI; ONOZAWA, MASATAKA; NITTA, KEISUKE
To: ADVANTEST CORPORATION
Reel/Frame 043309/0167 →