IP Library Granted Patent US 10,108,234
Granted Patent B1
US 10,108,234 · App. 15/618,551 · Granted Oct 23, 2018

Shielded motherboard

Inventor: Johnny Hou (City of Industry, CA)
Assignee: NZXT INC.
G06F1/20H05K7/2039
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Quick Facts
Patent No.
US 10,108,234
App. No.
15/618,551
Granted
Oct 23, 2018
Kind
B1
Abstract

A shielded motherboard includes a circuit board, a first metal cover and a second metal cover. The circuit board is provided with a plurality of slots, a central processor, a chip set, a plurality of storage devices, a power supply module, a plurality of I/O ports and a plurality of connectors thereon. The first metal cover is penetrated with a plurality of openings, and a side of the first metal cover is recessed to form a notch. The first metal cover covers the circuit board. The notch exposes the central processor, the power supply module and the I/O ports, and the openings expose the slots, the chip set, the storage devices and the connectors. The second metal cover is arranged on the circuit board to shield the I/O ports.

Claims (28)

1. A shielded motherboard comprising:

a circuit board provided with a plurality of slots, a central processor, a chip set, a plurality of storage devices, a power supply module, a plurality of Input/Output (I/O) ports and a plurality of connectors thereon, and said central processor, said power supply module and said plurality of I/O ports are neighbors of each other, and positions of said plurality of I/O ports correspond to a position of an edge of said circuit board;

a first metal cover penetrated with a plurality of openings, and a side of said first metal cover is recessed to form a notch, and said first metal cover covers said circuit board, and a position of said notch corresponds to positions of said central processor, said power supply module and said plurality of I/O ports to expose said central processor, said power supply module and said plurality of I/O ports, and positions of said plurality of openings correspond to said plurality of slots, said chip set, said plurality of storage devices and said plurality of connectors to expose said plurality of slots, said chip set, said plurality of storage devices and said plurality of connectors;

a second metal cover arranged on said circuit board to shield said plurality of I/O ports, said plurality of storage devices further comprises a first storage device and a second storage device, said plurality of openings further comprises a first opening and a second opening, and positions of said first opening and said second opening respectively correspond to positions of said first storage device and said second storage device to expose said first storage device and said second storage device;

a first metal shielding plate with a bottom surface thereof provided with a plurality of first fasteners, and said first metal shielding plate is fixed on said first metal cover using said plurality of first fasteners, so as to shield said first storage device; and

a second metal shielding plate with a bottom surface thereof provided with a plurality of second fasteners, and said second metal shielding plate is fixed on said first metal cover using said plurality of second fasteners, so as to shield said second storage device.

2. The shielded motherboard according to claim 1 , further comprising a third metal shielding plate with a bottom surface thereof provided with a plurality of third fasteners, and said third metal shielding plate is fixed on said first metal cover using said plurality of third fasteners, and said third metal shielding plate is arranged between said first metal shielding plate and said second metal shielding plate.

3. The shielded motherboard according to claim 2 , wherein said first metal cover, said second metal cover, said first metal shielding plate, said second metal shielding plate and said third metal shielding plate comprise steel.

4. The shielded motherboard according to claim 2 , further comprising a L-shaped heat sink arranged on said power supply module, and said notch exposes said L-shaped heat sink, and said power supply module is arranged between said plurality of I/O ports and said central processor, and said power supply module has a shape of L.

5. The shielded motherboard according to claim 4 , wherein said L-shaped heat sink comprises aluminum.

6. The shielded motherboard according to claim 4 , wherein said L-shaped heat sink further comprises:

an L-shaped substrate with a bottom surface thereof having a central region extending downwardly to form a flange, and said flange is arranged on said power supply module; and

a plurality of heat-dissipation plates spaced and neighbored, and said plurality of heat-dissipation plates is vertically connected with a top surface of said L-shaped substrate.

7. The shielded motherboard according to claim 6 , further comprising an L-shaped heat-dissipation cover penetrated with a plurality of first heat-dissipation holes arranged into a plurality of columns, and sizes of said plurality of first heat-dissipation holes of each said column are sequentially reduced, and a bottom surface of said L-shaped heat-dissipation cover is provided with a plurality of fourth fasteners, and said L-shaped heat-dissipation cover is fixed on said L-shaped substrate using said plurality of fourth fasteners, and said L-shaped heat-dissipation cover shields said plurality of heat-dissipation plates.

8. The shielded motherboard according to claim 7 , wherein said plurality of openings further comprises a third opening, a fourth opening, a fifth opening, a sixth opening and a seventh opening, and said plurality of connectors further comprises a first connector, a second connector, a third connector and a fourth connector, and said plurality of slots further comprises a first slot, a second slot, a third slot, a fourth slot, a fifth slot and a sixth slot, and said first connector, said first slot and said first storage device are neighbors of each other, and said second slot and said second storage device are neighbors of each other, and said second connector is arranged between said second slot and said first slot, and said second slot is arranged between said second connector and said third connector, and said third slot, said fourth slot, said fifth slot and said sixth slot are neighbors of each other, and a position of said first opening corresponds to positions of said first connector and said first slot to expose said first connector and said first slot, and a position of said second opening corresponds to a position of said second slot to expose said second slot, and a position of said third opening corresponds to a position of said second connector to expose said second connector, and a position of said fourth opening corresponds to a position of said third connector to expose said third connector, and a position of said fifth opening corresponds to positions of said third slot, said fourth slot, said fifth slot and said sixth slot to expose said third slot, said fourth slot, said fifth slot and said sixth slot, and a position of said sixth opening corresponds to a position of said fourth connector to expose said fourth connector, and a position of said seventh opening corresponds to a position of said chip set to expose said chip set.

9. The shielded motherboard according to claim 8 , wherein said first slot, said second slot, said third slot, said fourth slot, said fifth slot and said sixth slot are accelerated graphics port (AGP) slots, peripheral component interconnect (PCI) slots, or peripheral component interconnect express (PCI-E) slots, and said first storage device and said second storage device are solid state disk (SSD), and said first connector, said second connector, said third connector and said fourth connector are data cable connectors or power cable connectors.

10. The shielded motherboard according to claim 8 , further comprising a square heat sink arranged on said chip set, and said sixth opening exposes said square heat sink, and said chip set has a shape of square.

11. The shielded motherboard according to claim 10 , wherein said square heat sink comprises aluminum.

12. The shielded motherboard according to claim 10 , wherein said square heat sink further comprises:

a square substrate arranged on said chip set; and

a plurality of heat-dissipation columns neighbored and spaced, and said plurality of heat-dissipation columns is vertically connected with a top surface of said square substrate.

13. The shielded motherboard according to claim 12 , further comprising a square heat-dissipation cover penetrated with a plurality of second heat-dissipation holes, and said plurality of second heat-dissipation holes is arranged into a plurality of columns, and sizes of said plurality of second heat-dissipation holes of each said column are sequentially reduced, and a bottom surface of said square heat-dissipation cover is provided with a plurality of fifth fasteners, and said first metal cover is penetrated with a plurality of opening holes, and positions of said plurality of opening holes respectively correspond to positions of said plurality of fifth fasteners, and said circuit board is further provided with a plurality of sixth fasteners, and positions of said plurality of sixth fasteners respectively correspond to said positions of said plurality of opening holes, and said plurality of fifth fasteners is combined with said plurality of sixth fasteners through said plurality of opening holes, so as to fix said square heat-dissipation cover to said circuit board, and said square heat-dissipation cover shields said plurality of heat-dissipation columns.

14. The shielded motherboard according to claim 1 , wherein a top surface of said first metal shielding plate has a logo.

15. The shielded motherboard according to claim 1 , further comprising:

a first heat-dissipation patch arranged on said bottom surface of said first metal shielding plate; and

a second heat-dissipation patch arranged on said bottom surface of said second metal shielding plate.

16. The shielded motherboard according to claim 1 , wherein said first metal cover is further penetrated with a plurality of first fixed holes, and said circuit board is further penetrated with a plurality of second fixed holes, and positions of said plurality of first fixed holes respectively correspond to positions of said plurality of second fixed holes, and each said first fixed hole and said second fixed hole corresponded thereof are inserted with a bolt, so as to fix said first metal cover to said circuit board.

17. The shielded motherboard according to claim 16 , wherein said bolt has a thread therein, and said bolt is inserted with a screw, and said screw is fixed in said bolt using said thread.

Assignments (6)
SECURITY INTEREST Recorded Nov 1, 2024
From: NZXT, INC.
To: SIENA LENDING GROUP LLC
Reel/Frame 069099/0990 →
TERMINATION AND RELEASE OF CONFIRMATORY GRANT OF SECURITY INTEREST IN PATENTS Recorded Jun 16, 2023
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: NZXT, INC.
Reel/Frame 064009/0178 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
CONFIRMATORY GRANT OF SECURITY INTEREST IN PATENTS Recorded Nov 11, 2021
From: NZXT, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 058103/0455 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 29, 2017
From: HOU, JOHNNY
To: NZXT INC.
Reel/Frame 042864/0759 →
Cited By (3)
US 12,197,262 US 12,289,822 US 12,591,283