IP Library › Granted Patent US 10,644,647
Granted Patent B2
US 10,644,647 · App. 15/622,274 · Granted May 5, 2020

Oscillator, an electronic apparatus, and a vehicle

Inventor: Manabu Kondo (Matsumoto, JP)
Assignee: SEIKO EPSON CORPORATION
H03B5/04H03B1/02H03B5/02H03B5/32H03H9/02102H03H9/0519H03H9/0547H03H9/08H03H9/1021H03L1/028H01L2224/48091H01L2924/16195
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Quick Facts
Patent No.
US 10,644,647
App. No.
15/622,274
Granted
May 5, 2020
Kind
B2
Abstract

An oscillator includes a first package including a first base, and a first lid bonded to the first base, a first temperature controller housed in the first package, and mounted on the first base, a second temperature controller housed in the first package, and mounted on the first base, and a circuit element housed in the first package, mounted on the first base, and including at least a part of an oscillation circuit, the circuit element is disposed between the first temperature controller and the second temperature controller in a planar view.

Claims (55)

1. An oscillator comprising:

a first package comprising a first base, and a first lid bonded to the first base;

a first temperature controller housed in the first package, and mounted on the first base;

a second temperature controller housed in the first package, and mounted on the first base; and

a circuit element housed in the first package, mounted on the first base, and including at least a part of an oscillation circuit;

a second package housed in the first package, and mounted on the first temperature controller and the second temperature controller via fixation members; and

an oscillation element housed in the second package,

wherein at least a part of the circuit element is located between the second package and the first base, and

wherein the circuit element is disposed between the first temperature controller and the second temperature controller in a planar view.

2. An oscillator comprising:

a first package comprising a first base, and a first lid bonded to the first base;

a first temperature controller housed in the first package, and mounted on the first base;

a second temperature controller housed in the first package, and mounted on the first base;

a circuit element housed in the first package, mounted on the first base, and including at least a part of an oscillation circuit;

a second package housed in the first package, and mounted on the first temperature controller and the second temperature controller via fixation members; and

an oscillation element housed in the second package,

wherein at least a part of the circuit element is located between the second package and the first base, and

wherein defining a distance between the circuit element and the first temperature controller as L 1 , a distance between the circuit element and the second temperature controller as L 2 , and a distance between the first temperature controller and the second temperature controller as L 3 in a planar view, relationships of L 1 <L 3 and L 2 <L 3 are satisfied.

3. The oscillator according to claim 1 , wherein

defining a distance between the circuit element and the first temperature controller as L 1 , and a distance between the circuit element and the second temperature controller as L 2 , a relationship of 0.9≤L 1 /L 2 ≤1.1 is satisfied.

4. The oscillator according to claim 2 , wherein

defining a distance between the circuit element and the first temperature controller as L 1 , and a distance between the circuit element and the second temperature controller as L 2 , a relationship of 0.9≤L 1 /L 2 ≤1.1 is satisfied.

5. The oscillator according to claim 1 , wherein

the second package comprises a second base on which the oscillation element is mounted, a second lid, and a sealing ring disposed between the second base and the second lid, and adapted to bond the second base and the second lid to each other, and

the sealing ring surrounds at least a part of the circuit element in the planar view.

6. The oscillator according to claim 2 , wherein

the second package comprises a second base on which the oscillation element is mounted, a second lid, and a sealing ring disposed between the second base and the second lid, and adapted to bond the second base and the second lid to each other, and

the sealing ring surrounds at least a part of the circuit element in the planar view.

7. The oscillator according to claim 1 , further comprising:

a third temperature controller and a fourth temperature controller housed in the second package.

8. The oscillator according to claim 2 , further comprising:

a third temperature controller and a fourth temperature controller housed in the second package.

9. The oscillator according to claim 7 , wherein

the circuit element is disposed between the third temperature controller and the fourth temperature controller in the planar view.

10. The oscillator according to claim 8 , wherein

the circuit element is disposed between the third temperature controller and the fourth temperature controller in the planar view.

11. The oscillator according to claim 7 , wherein

in the planar view, the first temperature controller and the second temperature controller are arranged side by side along a first direction, and

the third temperature controller and the fourth temperature controller are arranged side by side along a second direction crossing the first direction.

12. The oscillator according to claim 8 , wherein

in the planar view, the first temperature controller and the second temperature controller are arranged side by side along a first direction, and

the third temperature controller and the fourth temperature controller are arranged side by side along a second direction crossing the first direction.

13. The oscillator according to claim 4 , wherein

the first package and the second package are each airtightly sealed.

14. The oscillator according to claim 1 , further comprising:

an interconnection substrate; and

a flexible substrate adapted to support the first package, and connected to the interconnection substrate.

15. The oscillator according to claim 10 , further comprising:

a third package adapted to house the interconnection substrate, the flexible substrate, and the first package.

16. The oscillator according to claim 9 , further comprising:

a pin electrically connected to the interconnection substrate, adapted to fix the interconnection substrate to the third package, and penetrating the third package.

17. An electronic apparatus comprising:

the oscillator according to claim 1 .

18. A vehicle comprising:

the oscillator according to claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2017
From: KONDO, MANABU
To: SEIKO EPSON CORPORATION
Reel/Frame 042703/0597 →
Priority Claims (1)
JP 2016-126627 · Jun 27, 2016 · national
Continuity (1)
Related Publication 20170373637A1 · Dec 28, 2017