Radio frequency device modules and methods of formation thereof
A method of operating a radio frequency (RF) module includes filtering, by a substrate integrated waveguide (SIW) band-pass filter, an RF signal propagating between an antenna and an interface structure. The antenna is disposed at a first side of a substrate. The interface structure is disposed at a second side of the substrate opposite the first side The SIW band-pass filter is disposed within the substrate between the antenna and the interface structure. The method of operating the RF module further includes transferring, by the interface structure, the RF signal between the SIW band-pass filter and an RF front end circuit.
1. A method of operating a radio frequency (RF) module, the method comprising:
filtering, by a substrate integrated waveguide (SIW) band-pass filter, an RF signal propagating between an antenna and an interface structure, wherein
the antenna is disposed at a first side of a substrate,
the interface structure is disposed at a second side of the substrate opposite the first side,
the SIW band-pass filter is disposed within the substrate between the antenna and the interface structure, and
the SIW band-pass filter is coupled to the antenna by a rectangular slot disposed between the antenna and the SIW band-pass filter; and
transferring, by the interface structure, the RF signal between the SIW band-pass filter and an RF front end circuit.
2. The method of claim 1 , wherein:
the antenna comprises a plurality of antennas;
the SIW band-pass filter comprises a plurality of SIW band-pass filters, wherein each antenna of the plurality of antennas is coupled to a corresponding SIW band-pass filter of the plurality of SIW band-pass filters; and
the interface structure comprises a plurality of interface structures, wherein each interface structure of the plurality of interface structures is coupled to
the corresponding SIW band-pass filter of the plurality of SIW band-pass filters, and
a corresponding terminal of the RF front end circuit.
3. The method of claim 2 , further comprising electronically adjusting a spatial direction of the RF signal, the electronically adjusting comprising adjusting a phase of the RF signal propagating from the from the plurality of antennas.
4. The method of claim 1 , wherein the RF front end circuit is disposed on the second side of the substrate.
5. The method of claim 1 , wherein
the substrate is a printed circuit board, and
the SIW band-pass filter extends through multiple layers of the printed circuit board.
6. The method of claim 1 , wherein
the RF signal comprises a frequency in a range of frequencies, and
an insertion loss of the SIW band-pass filter is less than 3 dB for any frequency in the range of frequencies.
7. The method of claim 1 , wherein the RF signal comprises a frequency between 27.5 GHz and 300 GHz.
8. The method of claim 1 , wherein the filtering by the SIW band-pass filter comprises propagating a transverse electric (TE) mode of the RF signal through the SIW band-pass filter between the antenna and the interface structure.
9. A radio frequency (RF) module comprising:
an antenna disposed at a first side of a substrate;
an interface structure disposed at a second side of the substrate opposite the first side;
a substrate integrated waveguide (SIW) band-pass filter disposed within the substrate between the antenna and the interface structure; and
a rectangular slot disposed between the antenna and the SIW band-pass filter, wherein
the SIW band-pass filter is coupled to the antenna by the rectangular slot,
the SIW band-pass filter is configured to filter an RF signal propagating between the antenna and the interface structure, and
the interface structure is configured to be coupled to an RF front end circuit.
10. The RF module of claim 9 , wherein
the antenna comprises a plurality of antennas;
the SIW band-pass filter comprises a plurality of SIW band-pass filters, wherein each antenna of the plurality of antennas is coupled to a corresponding SIW band-pass filter of the plurality of SIW band-pass filters; and
the interface structure comprises a plurality of interface structures, wherein each interface structure of the plurality of interface structures is coupled to the corresponding SIW band-pass filter of the plurality of SIW band-pass filters.
11. The RF module of claim 10 , further comprising the RF front end circuit, wherein the RF front end circuit is configured to electronically adjust a spatial direction of the RF signal by adjusting respective phases of RF signals propagating between the RF front end circuit and each of the plurality of antennas.
12. The RF module of claim 9 , further comprising the RF front end circuit disposed on the second side of the substrate.
13. The RF module of claim 9 , wherein
the substrate is a printed circuit board, and
the SIW band-pass filter extends through multiple layers of the printed circuit board.
14. The RF module of claim 9 , wherein
the RF signal comprises a frequency in a range of frequencies, and
an insertion loss of the SIW band-pass filter is less than 3 dB for any frequency in the range of frequencies.
15. The RF module of claim 9 , wherein the RF signal comprises a frequency between 27.5 GHz and 300 GHz.
16. The RF module of claim 9 , wherein the SIW band-pass filter is further configured to propagate a transverse electric (TE) mode of the RF signal through the SIW band-pass filter between the antenna and the interface structure.
17. A semiconductor device module comprising:
a first antenna disposed at a first laminate layer of a substrate, the first laminate layer being disposed at a first side of the substrate;
a first band-pass filter coupled to the first antenna, the first band-pass filter comprising a first waveguide cavity disposed in a second laminate layer of the substrate, the second laminate layer being disposed below the first laminate layer;
a rectangular slot disposed in a first conductive layer of the substrate, the first conductive layer being between the first laminate layer and the second laminate layer, wherein the first band-pass filter is coupled to the first antenna by the rectangular slot; and
an interface structure coupled to the first band-pass filter, the interface structure being disposed at a third laminate layer of the substrate, the third laminate layer being disposed at a second side of the substrate opposite the first side of the substrate, wherein the interface structure is configured to be coupled to a radio frequency integrated circuit (RFIC) chip.
18. The semiconductor device module of claim 17 , wherein the first band-pass filter further comprises:
a second waveguide cavity disposed in a fourth laminate layer of the substrate, the fourth laminate layer being disposed between the first laminate layer and the third laminate layer; and
a slot configured to couple the second waveguide cavity to the first waveguide cavity.
19. The semiconductor device module of claim 17 , wherein the first band-pass filter further comprises
a first conductive surface disposed at a first side of the first band-pass filter,
a second conductive surface disposed at a second side of the first band-pass filter opposite the first side of the first band-pass filter, and
a plurality of vias disposed around a perimeter of the first band-pass filter, the plurality of vias being coupled to the first conductive surface and the second conductive surface, wherein the first conductive surface, the plurality of vias, and the second conductive surface enclose the first band-pass filter.
20. The semiconductor device module of claim 17 , further comprising:
a slot disposed within the substrate between the first antenna and the first band-pass filter, the slot being configured to couple the first antenna to the first band-pass filter; and
a second waveguide cavity disposed between the first antenna and the slot, the second waveguide cavity comprising an insulator in a gaseous state.
21. The semiconductor device module of claim 17 , further comprising a plurality of vias disposed at the first side of the substrate and along a perimeter of the first band-pass filter, wherein
the plurality of vias extend into the substrate from a first surface disposed at the first side of the substrate, and
the plurality of vias at least partially surrounds both the first antenna and the first band-pass filter.
22. The semiconductor device module of claim 21 , wherein the first antenna is disposed on the first surface, and wherein the plurality of vias further extend from the first surface out of the substrate.
23. The semiconductor device module of claim 17 , wherein the first waveguide cavity comprises:
a rectangular cross-section along a direction normal to a surface of the substrate disposed at the first side of the substrate;
a first linear dimension of the rectangular cross-section; and
a second linear dimension of the rectangular cross-section perpendicular to the first linear dimension, wherein the second linear dimension is greater than the first linear dimension.