IP Library › Granted Patent US 10,347,339
Granted Patent B2
US 10,347,339 · App. 15/623,466 · Granted Jul 9, 2019

Semiconductor memory device and operating method thereof

Inventor: Eun Young Park (Chungcheongbuk-do, KR)
Assignee: SK hynix Inc.
G11C16/14G11C16/0483G11C16/08G11C16/10G11C16/16G11C16/24G11C16/26G11C16/32
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Quick Facts
Patent No.
US 10,347,339
App. No.
15/623,466
Granted
Jul 9, 2019
Kind
B2
Abstract

A semiconductor memory device includes a memory cell array including a plurality of memory blocks, a voltage generator suitable for applying an erase voltage to a source line of at least one memory block selected from among the plurality of memory blocks during an erase operation, a read and write circuit suitable for applying an initial setting voltage, to bit lines of at least one memory block during the erase operation, and a control logic suitable for controlling the voltage generator and the read and write circuit to apply the initial setting voltage to the bit lines before applying the erase voltage to the source line.

Claims (21)

1. A semiconductor memory device, comprising: a memory cell array including a plurality of memory blocks; a voltage generator that applies a pre-erase voltage and an erase voltage to a source line of at least one memory block selected from among the plurality of memory blocks during an erase operation; a read and write circuit that applies an initial setting voltage to bit lines of at least one memory block during the erase operation; and a control logic that controls the voltage generator and the read and write circuit to apply the initial setting voltage to the bit lines before applying the pre-erase voltage and the erase voltage to the source line, wherein the initial setting voltage is greater than OV.

2. The semiconductor memory device of claim 1 , wherein the initial setting voltage is lower than a power voltage.

3. The semiconductor memory device of claim 1 , wherein the voltage generator applies the erase voltage by increasing the pre-erase voltage to the erase voltage.

4. The semiconductor memory device of claim 1 , wherein the read and write circuit further controls the bit lines to be in a floating state when applying the erase voltage to the source line after applying the initial setting voltage to the bit lines.

5. The semiconductor memory device of claim 1 , wherein the voltage generator further controls word lines of the at least one memory block to be in a floating state when applying the erase voltage.

6. The semiconductor memory device of claim 5 , wherein the voltage generator further applies a positive set voltage to the word lines before controlling the word lines to be in the floating state.

7. The semiconductor memory device of claim 1 , wherein the voltage generator further applies a positive set voltage to a gate of a pipe transistor included in the at least one memory block before applying the erase voltage to the source line, and further controls the pipe transistor to be in a floating state when applying the erase voltage to the source line.

8. The semiconductor memory device of claim 1 , wherein the voltage generator further sequentially applies a predetermined positive voltage and a ground voltage to the source line before applying the erase voltage to the source line.

9. A method for operating a semiconductor device, the method comprising:

applying an initial setting voltage to bit lines of a selected memory block among a plurality of memory blocks, wherein the initial setting voltage is greater than 0V;

floating the bit lines after applying the initial setting voltage to the bit lines; and

applying a pre-erase voltage and an erase voltage to a source line of the selected memory block when the bit lines are floated.

10. The method of claim 9 , wherein the initial setting voltage is lower than a power voltage.

11. The method of claim 9 , wherein the applying of the pre-erase voltage and the erase voltage comprises:

applying the pre-erase voltage to the source line for a predetermined time when the bit lines are floated; and

increasing the pre-erase voltage to the erase voltage.

12. The method of claim 11 ,

wherein the applying of the initial setting voltage to the bit lines further comprises applying a positive set voltage to word lines of the selected memory block, and

wherein the increasing of the pre-erase voltage further comprises floating the word lines.

13. The method of claim 11 , wherein the increasing of the pre-erase voltage further comprises floating a source selection line of the selected memory block.

14. The method of claim 11 , further comprising sequentially applying a predetermined positive voltage and a ground voltage to the source line before applying the pre-erase voltage to the source line.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 15, 2017
From: PARK, EUN YOUNG
To: SK HYNIX INC.
Reel/Frame 042815/0801 →
Priority Claims (1)
KR 10-2016-0158939 · Nov 28, 2016 · national
Continuity (1)
Related Publication 20180151230A1 · May 31, 2018