Computer modules with small thicknesses and associated methods of manufacturing
View Patent ↗Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.
1. A computer module, comprising:
a module substrate having a first side, a second side opposite the first side, an aperture extending between the first and second sides, a recess adjacent to the aperture, a first plurality of bond sites in the recess, and a second plurality of bond sites along an outer edge of the module substrate operably connected to the first plurality of bond sites in the recess and configured to electrically couple with a computer socket; and
a microelectronic package having a semiconductor die and a package substrate carrying the semiconductor die, the package substrate having a plurality of contact pads corresponding to and aligned with the first plurality of bond sites in the recesses of the module substrate, wherein at least a portion of the semiconductor die is inside the aperture.
2. The computer module of claim 1 wherein the microelectronic package includes an encapsulant at least partially encapsulating the semiconductor die, and wherein the aperture has a cross-sectional dimension larger than that of the encapsulant.
3. The computer module of claim 1 wherein the aperture has a cross-sectional dimension larger than a cross-sectional dimension of the semiconductor die and smaller than a cross-sectional dimension of the package substrate.
4. The computer module of claim 1 wherein the plurality of contact pads are disposed adjacent a peripheral edge of the package substrate.
5. The computer module of claim 1 wherein the package substrate has a thickness less than a depth of the recess.
6. The computer module of claim 1 wherein the package substrate has a thickness greater than or equal to a depth of the recess.
7. The computer module of claim 1 wherein the package substrate has a first surface on which the plurality of contact pads are disposed and a second surface opposite the first surface that is co-planar with the first side of the module substrate.
8. The computer module of claim 1 wherein the plurality of contact pads are electrically coupled to the first plurality of bond sites by a corresponding plurality of electric couplers.
9. The computer module of claim 8 wherein a total thickness of the electric couplers and the package substrate is about equal to a depth of the recess.
10. The computer module of claim 1 wherein the semiconductor die is a first semiconductor die and wherein the microelectronic package further includes a second semiconductor die stacked with the first semiconductor die.
11. A computer module, comprising:
a module substrate having a module material and an aperture extending at least partially into the module material, a recess adjacent to the aperture, a first plurality of bond sites in the recess, and a second plurality of bond sites along an outer edge of the module substrate operably connected to the first plurality of bond sites in the recess and configured to electrically couple with a computer socket; and
a microelectronic package having a semiconductor die and a package substrate carrying the semiconductor die, the package substrate having a plurality of contact pads corresponding to and aligned with the first plurality of bond sites in the recess of the module substrate, wherein at least a portion of the semiconductor die is inside the aperture.
12. The computer module of claim 11 wherein the microelectronic package includes an encapsulant at least partially encapsulating the semiconductor die, and wherein the aperture has a cross-sectional dimension larger than that of the encapsulant.
13. The computer module of claim 11 wherein the aperture has a cross-sectional dimension larger than a cross-sectional dimension of the semiconductor die and smaller than a cross-sectional dimension of the package substrate.
14. The computer module of claim 11 wherein the plurality of contact pads are disposed adjacent a peripheral edge of the package substrate.
15. The computer module of claim 11 wherein the package substrate has a thickness less than a depth of the recess.
16. The computer module of claim 11 wherein the package substrate has a thickness greater than or equal to a depth of the recess.
17. The computer module of claim 11 wherein the package substrate has a first surface on which the plurality of contact pads are disposed and a second surface opposite the first surface that is co-planar with a surface of the module substrate.
18. The computer module of claim 11 wherein the plurality of contact pads are electrically coupled to the first plurality of bond sites by a corresponding plurality of electric couplers.
19. The computer module of claim 18 wherein a total thickness of the electric couplers and the package substrate is about equal to a depth of the recess.
20. The computer module of claim 11 wherein the semiconductor die is a first semiconductor die and wherein the microelectronic package further includes a second semiconductor die stacked with the first semiconductor die.
21. A computer module, comprising:
a module substrate having a first side, a second side opposite the first side, an aperture extending between the first and second sides, a first recess adjacent to the aperture at the first side, a second recess adjacent to the aperture at the second side, a first plurality of bond sites in the first recess, a second plurality of bond sites in the second recess, and a third plurality of bond sites along an outer edge of the module substrate operably connected to the first and second pluralities of bond sites in the recess and configured to electrically couple with a computer socket;
a first microelectronic package having a first semiconductor die and a first package substrate carrying the first semiconductor die, the first package substrate having a first plurality of contact pads corresponding to and aligned with the first plurality of bond sites in the first recesses of the module substrate, wherein at least a portion of the first semiconductor die is inside the aperture; and
a second microelectronic package having a second semiconductor die and a second package substrate carrying the second semiconductor die, the second package substrate having a second plurality of contact pads corresponding to and aligned with the second plurality of bond sites in the second recesses of the module substrate, wherein at least a portion of the second semiconductor die is inside the aperture.