IP Library Granted Patent US 10,211,157
Granted Patent B2
US 10,211,157 · App. 15/633,013 · Granted Feb 19, 2019

Electronic component

Inventors: Kenichi Yoshida (Tokyo, JP); Mitsuhiro Tomikawa (Tokyo, JP); Eiko Wakata (Tokyo, JP)
Assignee: TDK CORPORATION
H01L23/5385H01G4/005H01G4/228H01G4/232H01G4/33H01G4/40H05K1/162H05K2201/0195H05K2201/09063H05K2201/09072H05K2201/10015H05K2201/10537H05K2201/10545
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Quick Facts
Patent No.
US 10,211,157
App. No.
15/633,013
Granted
Feb 19, 2019
Kind
B2
Abstract

An electronic component includes a first electronic component and a second electronic component that is stacked on the first electronic component. A second electrode layer of the first electronic component includes a plurality of divided electrode layers, and a pair of electrodes of the second electronic component are electrically connected to different electrode layers included in the plurality of electrode layers of the second electrode layer, and a first electrode layer of the first electronic component is divided into a plurality of electrode layers to correspond to the electrode layers which are included in the second electrode layer and which are electrically connected to the pair of electrodes of the second electronic component.

Claims (18)

1. An electronic component comprising:

a first electronic component that includes a first functional layer and a first and second electrode layer which are disposed to interpose the first functional layer therebetween; and

a second electronic component that is stacked on the first electronic component and includes a second functional layer and at least a pair of electrodes which are disposed to interpose the second functional layer therebetween,

wherein the second electrode layer of the first electronic component includes a plurality of divided electrode layers,

the pair of electrodes of the second electronic component are each electrically connected to different electrode layers which are included in the plurality of electrode layers of the second electrode layer; and

a conductive material is disposed between the pair of electrodes of the second electronic component and the electrode layers which are included in the second electrode layer and which are electrically connected to the pair of electrodes of the second electronic component.

2. The electronic component according to claim 1 , wherein an insulating material that comes into contact with the first electronic component and the second electronic component is disposed in an area which is disposed between the first electronic component and the second electronic component and which is different from an area in which both electronic components are electrically connected to each other.

3. An electronic component comprising:

a first electronic component that includes a dielectric layer and a first and second electrode layer which are disposed to interpose the dielectric layer therebetween; and

a second electronic component that is stacked on the first electronic component and includes a dielectric and a pair of electrodes which are disposed to interpose the dielectric therebetween,

wherein the second electrode layer of the first electronic component includes a plurality of divided electrode layers,

the pair of electrodes of the second electronic component are each electrically connected to different electrode layers which are included in the plurality of electrode layers of the second electrode layer,

the first electrode layer of the first electronic component is divided into a plurality of electrode layers to correspond to the electrode layers which are included in the second electrode layer and which are electrically connected to the pair of electrodes of the second electronic component,

capacitance of the second electronic component is greater than capacitance of the first electronic component, and

equivalent series inductance of the second electronic component is greater than equivalent series inductance of the first electronic component.

4. The electronic component according to claim 3 , wherein a part of an area in the first electrode layer corresponding to the electrode layers which are included in the second electrode layer and electrically connected to the pair of electrodes of the second electronic component is divided into a plurality of areas.

5. The electronic component according to claim 3 , wherein an insulating material that comes into contact with the first electronic component and the second electronic component is disposed in an area which is disposed between the first electronic component and the second electronic component and which is different from an area in which both electronic components are electrically connected to each other.

6. The electronic component according to claim 3 , wherein a conductive material is disposed between the pair of electrodes of the second electronic component and the electrode layers which are included in the second electrode layer and which are electrically connected to the pair of electrodes of the second electronic component.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2017
From: YOSHIDA, KENICHI; TOMIKAWA, MITSUHIRO; WAKATA, EIKO
To: TDK CORPORATION
Reel/Frame 043024/0893 →
Priority Claims (2)
JP 2016-126688 · Jun 27, 2016 · national
JP 2017-091897 · May 2, 2017 · national
Continuity (1)
Related Publication 20170373009A1 · Dec 28, 2017