Stress retention in fins of fin field-effect transistors
View Patent ↗Embodiments of the present invention provide a structure and method of minimizing stress relaxation during fin formation. Embodiments may involve forming a looped spacer on an upper surface of a substrate and adjacent to at least a sidewall of a mandrel. The mandrel may be removed, leaving the looped spacer on the substrate. An exposed portion of the substrate may be removed to form a looped fin below the looped spacer. The spacer may be removed, leaving a looped fin. A looped fin formation may reduce stress relaxation compared to conventional fin formation methods. Embodiments may include forming a gate over a looped portion of a looped fin. Securing a looped portion in position with a gate may decrease stress relaxation in the fin. Thus, a looped fin with a looped portion of the looped fin under a gate may have substantially reduced stress relaxation compared to a conventional fin.
1. A structure comprising:
a looped fin located on a substrate, wherein a first portion of the looped fin and a third portion of the looped fin extend in a first direction, and wherein a second portion of the looped fin extends in a second direction and connects the first portion of the looped fin and the second portion of the looped fin;
a second fin located on the substrate, wherein the second fin extends in the first direction, wherein an end of the second fin abuts a confining layer, wherein the looped fin and the second fin are not contiguous, and wherein the confining layer restricts a movement of the second fin;
a first gate located over the second portion of the looped fin and the second fin, wherein the first gate is substantially parallel to the second portion of the looped fin; and
a second gate over the first portion of the looped fin, the third portion of the looped fin, and the second fin.
2. The structure of claim 1 , wherein a material of the looped fin comprises a semiconductor material having a compressive stress.
3. The structure of claim 1 , wherein the second gate is substantially perpendicular to the first portion of the looped fin.
4. The structure of claim 1 , wherein the first direction and second direction are substantially orthogonal.
5. The structure of claim 4 , wherein a material of the looped fin comprises a semiconductor material having a compressive stress.
6. The structure of claim 1 , wherein a material of the second fin comprises a semiconductor material having a compressive stress.