IP Library › Granted Patent US 10,026,813
Granted Patent B2
US 10,026,813 · App. 15/634,116 · Granted Jul 17, 2018

SiC semiconductor device having a high mobility and a high threshold voltage, inverter circuit, and vehicle

Inventors: Tatsuo Shimizu (Shinagawa, JP); Ryosuke Iijima (Setagaya, JP)
Assignee: Kabushiki Kaisha Toshiba
H01L29/1608H01L29/513H01L29/517H01L29/518H01L29/7802
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,026,813
App. No.
15/634,116
Granted
Jul 17, 2018
Kind
B2
Abstract

A semiconductor device including a p-type SiC layer, a gate electrode, and a gate insulating layer therebetween, the gate insulating layer including a first layer, a second layer provided between the first layer and the gate electrode and having a higher oxygen density than the first layer, a first and second regions provided in the second layer, the first region including a first element (at least one of Ta, Nb and V) having a first concentration peak, and the second region including a second element (at least one of Ge, B, Al, Ga, In, Be, Mg, Ca, Sr, Ba , La, and lanthanoid) having a second concentration peak of the second element and a third concentration peak of C, a distance between the second concentration peak and the third concentration peak being shorter than a distance between the first concentration peak and the third concentration peak.

Claims (30)

1. A semiconductor device, comprising:

a p-type SiC layer;

a gate electrode; and

a gate insulating layer provided between the SiC layer and the gate electrode, the gate insulating layer including:

a first layer,

a second layer provided between the first layer and the gate electrode, the second layer having a higher oxygen density than the first layer,

a first region provided in the second layer, the first region including a first element which is at least one element in the group of Ta (tantalum), Nb (niobium), and V (vanadium) and the first region having a first concentration peak of the first element; and

a second region provided in the first layer, the second region including a second element which is at least one element in the group of Ge (germanium), B (boron), Al (aluminum), Ga (gallium), In (indium), Be (beryllium), Mg (magnesium), Ca (calcium), Sr (strontium), Ba (barium), La (lantern), and lanthanoid (Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu) and the second region having a second concentration peak of the second element and a third concentration peak of C (carbon), a distance between the second concentration peak and the third concentration peak being shorter than a distance between the first concentration peak and the third concentration peak.

2. The semiconductor device according to claim 1 , wherein a distance between the second concentration peak and the first concentration peak is equal to or less than 4 nm, and the distance between the first concentration peak and the third concentration peak is equal to or less than 4 nm.

3. The semiconductor device according to claim 1 , wherein full widths at half maximum of the first concentration peak and the second concentration peak are equal to or less than 1 nm.

4. The semiconductor device according to claim 1 , wherein a full width at half maximum of the third concentration peak is equal to or less than 1 nm.

5. The semiconductor device according to claim 1 , wherein the first layer is a silicone oxide film.

6. The semiconductor device according to claim 1 , wherein the second layer is a hafnium oxide film or a zirconium oxide film.

7. A semiconductor device, comprising:

a p-type SiC layer;

a gate electrode; and

a gate insulating layer provided between the SiC layer and the gate electrode, the gate insulating layer including:

a first layer,

a second layer provided between the first layer and the gate electrode, the second layer having a lower oxygen density than the first layer,

a first region provided across the first layer and the second layer, the first region including a first element which is at least one element in the group of N (nitrogen), P (phosphorus), As (arsenic), Sb (antimony), and Bi (bismuth) and the first region having a first concentration peak of the first element, and

a second region provided in the second layer, the second region including a second element which is at least one element in the group of N (nitrogen), P (phosphorus), As (arsenic), Sb (antimony), and Bi (bismuth) and the second region having a second concentration peak of the second element and a third concentration peak of C (carbon), a distance between the second concentration peak and the third concentration peak being shorter than a distance between the first concentration peak and the third concentration peak.

8. The semiconductor device according to claim 7 , wherein a distance between the second concentration peak and the first concentration peak is equal to or less than 4 nm, and the distance between the first concentration peak and the third concentration peak is equal to or less than 4 nm.

9. The semiconductor device according to claim 7 , wherein full widths at half maximum of the first concentration peak and the second concentration peak are equal to or less than 1 nm.

10. The semiconductor device according to claim 7 , wherein a full width at half maximum of the third concentration peak is equal to or less than 1 nm.

11. The semiconductor device according to claim 7 , wherein the second layer is a silicone oxide film.

12. The semiconductor device according to claim 7 , wherein the first layer is a hafnium oxide film or a zirconium oxide film.

13. An inverter circuit, comprising the semiconductor device according to claim 1 .

14. A vehicle comprising the semiconductor device according to claim 1 .

15. An inverter circuit, comprising the semiconductor device according to claim 7 .

16. A vehicle comprising the semiconductor device according to claim 7 .

Priority Claims (2)
JP 2015-061802 · Mar 24, 2015 · national
JP 2015-236877 · Dec 3, 2015 · national
Continuity (2)
Division 15055848 · Feb 29, 2016
Related Publication 20170301760A1 · Oct 19, 2017