Electrostatic chuck
An electrostatic chuck includes a dielectric layer and a conductive layer located inside the dielectric layer. The dielectric layer includes an upper surface and a plurality of protrusions protruding from the upper surface. Each of the protrusions includes a top portion that serves as an attraction surface on which a substrate is attracted. The dielectric layer includes a plurality of first dielectric portions and a second dielectric portion. The second dielectric portion surrounds each of the first dielectric portions in the upper surface of the dielectric layer. At least some of the first dielectric portions include the protrusions and are bonded to the conductive layer. Each of the first dielectric portions is formed from a material that differs from that of the second dielectric portion.
1. An electrostatic chuck comprising:
a dielectric layer including an upper surface and a plurality of protrusions protruding from the upper surface; and
a conductive layer located inside the dielectric layer, wherein:
each of the protrusions includes a top portion that serves as an attraction surface on which a substrate is attracted;
the dielectric layer includes
a plurality of first dielectric portions, wherein at least some of the first dielectric portions include the protrusions and are bonded to the conductive layer, and
a second dielectric portion that surrounds each of the first dielectric portions in the upper surface of the dielectric layer; and
each of the first dielectric portions is formed from a material that differs from that of the second dielectric portion.
2. The electrostatic chuck according to claim 1 , wherein each of the first dielectric portions has a volume resistivity that is higher than that of the second dielectric portion.
3. The electrostatic chuck according to claim 1 , wherein each of the first dielectric portions has a content percentage of a ceramics that is higher than that of the second dielectric portion.
4. The electrostatic chuck according to claim 1 , wherein at least one of the first dielectric portions bonded to the conductive layer is surrounded by part of the second dielectric portion bonded to the conductive layer.