IP Library Granted Patent US 10,572,164
Granted Patent B2
US 10,572,164 · App. 15/637,327 · Granted Feb 25, 2020

Systems and methods for improving efficiencies of a memory system

Inventor: J. Thomas Pawlowski (Boise, ID)
Assignee: Micron Technology, Inc.
G06F3/0619G06F3/061G06F3/0604G06F3/0611G06F3/0617G06F3/0644G06F3/0655G06F3/0656G06F3/0659G06F3/0673G06F3/0679G06F3/0683G06F3/0685G06F3/0688G06F11/07G06F11/073G06F11/076G06F11/0727G06F11/10G06F11/1016G06F11/1044G06F11/1068G06F11/1072G06F13/16G06F13/38G11C29/52H04L1/189H04L47/12H04L47/25H04L47/52Y02D10/14
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Quick Facts
Patent No.
US 10,572,164
App. No.
15/637,327
Granted
Feb 25, 2020
Kind
B2
Abstract

A memory device includes a memory component that stores data. The memory device also includes a processor that receives a signal indicating that the memory component is coupled to the processor and retrieves information from the memory component. The information may include one or more algorithms capable of being performed by the memory component. The processor may then receive one or more packets associated with one or more data operations regarding the memory component. The processor may then perform the one or more data operations by using the memory component to employ the one or more algorithms.

Claims (17)

1. A device comprising:

a memory component configured to store data; and

a processor, configured to:

receive a signal indicating that the memory component is coupled to the processor;

retrieve information from the memory component, wherein the information is indicative of one or more locations within the memory component, and wherein the one or more locations correspond to one or more portions of the memory component that are accessed when the memory component is to perform one or more operations associated with one or more data operations regarding the memory component;

receive one or more packets associated with the one or more data operations regarding the memory component; and

perform the one or more data operations at the one more locations of the memory component.

2. The device of claim 1 , wherein the signal is received upon receiving power at the processor.

3. The device of claim 1 , wherein the information comprises an indication regarding whether the device is configured to perform a portion of the one or more data operations.

4. The device of claim 1 , wherein the memory component comprises a Dynamic Random-Access Memory, a Static Random-Access Memory, a NAND memory, or any combination thereof.

5. The device of claim 1 , wherein the information comprises an amount of memory space in the device.

6. A tangible, non-transitory, machine-readable medium for storing instructions which, when executed by a processor, causes the processor to:

receive a plurality of packets from a plurality of control silicons associated with one or more memory components, wherein the plurality of packets is associated with a plurality of data operations to be performed on a memory component of the one or more memory components, wherein each of the plurality of control silicons is associated with a respective system window comprising a respective virtual channel implemented using a respective virtual address space associated with the memory component, and wherein each of the plurality of packets is modified by a respective control silicon of the plurality of control silicons prior to transmission based on the respective system window comprising a source field indicative of a source of a respective packet and a destination field indicative of a destination of the respective packet; and

perform one or more data operations using the memory component based on the respective system window of each of the plurality of packets.

7. The tangible, non-transitory, machine-readable medium of claim 6 , wherein the instructions are configured to cause the processor to generate a globally-enabled memory management system based on the system window for each of the plurality of control silicons.

8. The tangible, non-transitory, machine-readable medium of claim 7 , wherein the globally-enabled memory management system comprises a mapping between virtual memory space comprising the virtual address space to an actual memory space of the memory component.

9. The tangible, non-transitory, machine-readable medium of claim 7 , wherein the globally-enabled memory management system comprises an access list indicative of a portion of the plurality of control silicons that is provided access to the memory component.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050709/0838 →
RELEASE OF SECURITY INTEREST Recorded Jul 20, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046597/0333 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
SUPPLEMENT NO. 6 TO PATENT SECURITY AGREEMENT Recorded Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 044348/0253 →
SUPPLEMENT NO. 6 TO PATENT SECURITY AGREEMENT Recorded Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 044653/0333 →