Organic light emitting diode device and manufacturing method thereof
An organic light emitting diode device can have an enhanced thin film encapsulation layer for preventing moisture from permeating from the outside. The thin film encapsulation layer can have a multilayered structure in which one or more inorganic layers and one or more organic layers are alternately laminated. A barrier can be formed outside of a portion of the substrate on which the organic light emitting diode is formed. The organic layers of the thin film encapsulation layer can be formed inside an area defined by the barrier.
1. An organic light emitting diode device, comprising:
a substrate;
an organic light emitting diode unit on the substrate, the organic light emitting diode unit comprises an insulating layer disposed on the substrate, a first electrode disposed on the insulating layer, an organic emission layer and a second electrode;
a first barrier disposed on the substrate and spaced apart from the insulating layer in a plan view; and
a thin film encapsulation layer disposed on the organic light emitting diode unit,
wherein the thin film encapsulation layer comprises an organic layer on the organic light emitting diode unit and a first inorganic layer on the organic layer, and
wherein the organic layer is disposed in an area defined by the first barrier, and the first inorganic layer is disposed on the organic layer and overlaps with the first barrier.
2. The organic light emitting diode device of claim 1 , wherein the thin film encapsulation layer has a multilayered structure in which one or more inorganic layers and one or more organic layers are alternately disposed.
3. The organic light emitting diode device of claim 1 , further comprising a second barrier disposed outside the area defined by the first barrier.
4. The organic light emitting diode device of claim 3 , further comprising a pixel defining layer disposed inside the area defined by the first barrier,
wherein the second barrier has a same material as the pixel defining layer.
5. The organic light emitting diode device of claim 3 , wherein the second barrier comprises at least one material selected from an organic material comprising at least one of a photoresist, a polyacryl-based resin, a polyimide-based resin and an acryl-based resin and an inorganic material comprising a silicon compound.
6. The organic light emitting diode device of claim 3 , wherein the first barrier directly contacts with the substrate.
7. The organic light emitting diode device of claim 1 , wherein the first barrier has a dotted-line shape.
8. The organic light emitting diode device of claim 1 , further comprising a pixel defining layer disposed inside the area defined by the first barrier.
9. The organic light emitting diode device of claim 8 , wherein the first barrier has a same material as the pixel defining layer.
10. The organic light emitting diode device of claim 1 , wherein the first barrier comprises at least one material selected from an organic material comprising a photoresist, a polyacryl-based resin, a polyimide-based resin and an acryl-based resin and an inorganic material comprising a silicon compound.
11. The organic light emitting diode device of claim 1 , wherein the thin film encapsulation layer further comprises a second inorganic layer between the organic light emitting diode unit and the organic layer.
12. The organic light emitting diode device of claim 11 , wherein the first inorganic layer and the second inorganic layer directly contact with each other outside the area defined by the first barrier.
13. The organic light emitting diode device of claim 11 , wherein the first inorganic layer and the second inorganic layer directly contact with each other inside the area defined by the first barrier.
14. The organic light emitting diode device of claim 11 , wherein the second inorganic layer contacts with an inside surface of the first barrier facing the organic light emitting diode unit.
15. The organic light emitting diode device of claim 11 , further comprising a second barrier disposed outside the area defined by the first barrier.
16. The organic light emitting diode device of claim 15 , wherein the first inorganic layer and the second inorganic layer directly contact with each other between the first barrier and the second barrier.
17. The organic light emitting diode device of claim 1 , further comprising a thin film transistor disposed between the substrate and the insulating layer, the thin film transistor comprising a gate electrode, a source electrode, and a drain electrode.
18. The organic light emitting diode device of claim 17 , wherein the insulating layer disposed on the thin film transistor has a flat upper surface.
19. The organic light emitting diode device of claim 1 , wherein the first barrier directly contacts with the substrate.
20. The organic light emitting diode device of claim 19 , wherein the substrate comprises lower structures including at least one of a switching element, a contact, a pad, a plug, an electrode, a conductive pattern, and an insulation pattern.
21. The organic light emitting diode device of claim 1 , wherein the first barrier is not overlapping with the insulating layer.
22. The organic light emitting diode device of claim 1 , wherein the insulating layer comprises an organic material.
23. The organic light emitting diode device of claim 22 , wherein a layer having the organic material is not disposed between the first barrier and the substrate.
24. The organic light emitting diode device of claim 22 , wherein the organic material comprises at least one of a photoresist, an acrylic polymer, a polyimide polymer, a polyamide polymer, a siloxane polymer, a polymer containing a photosensitive acryl carboxyl group, a novolac resin, and an alkali developable resin.
25. The organic light emitting diode device of claim 1 , wherein the organic light emitting diode unit further comprises a pixel defining layer directly on the insulating layer.
26. The organic light emitting diode device of claim 1 , wherein a layer having a same material as the insulating layer is not disposed between the first barrier and the substrate in a plan view.