Method and apparatus for maintaining cooling of modular electronic system during module removal
In one embodiment, a method includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.
1. An apparatus comprising:
a frame supporting a plurality of slidably removable modules, at least a portion of the modules each comprising a panel movable between a closed position and an open position in which the panel extends into an open slot from which an adjacent module is removed;
a cooling fan for cooling said modules prior to an online removal process for the adjacent module;
a thermal sensor for sensing an internal temperature at the apparatus;
a locking mechanism located in at least one of said plurality of slidably removable modules, moveable between a locked position maintaining the panel in said closed position and an unlocked position to allow the panel to extend into said open slot upon removal of the adjacent module, the locking mechanism comprising an electromechanical device coupled to a printed circuit board connection for actuating a lever to unlock the panel; and
a processor for processing a signal indicating said online removal process for the adjacent module, increasing a speed of the cooling fan in response to said signal indicating said online removal process, transmitting a signal to the electromechanical device to unlock the panel upon determining that the internal temperature has reached a cooling state, and providing an indication that the adjacent module is ready for removal;
wherein the open position of the panel substantially blocks airflow bypass from the open slot and maintains cooling within the modular electronic system.
2. The apparatus of claim 1 wherein the processor unlocks the adjacent module for removal when the temperature has reached said cooling state.
3. The apparatus of claim 1 wherein the adjacent module comprises an indicator light indicating when said cooling state has been reached and the module is ready for removal.
4. The apparatus of claim 1 wherein the electromechanical device comprises a servo motor.
5. The apparatus of claim 1 wherein said indication that the adjacent module is ready for removal comprises-aft unlocking of the adjacent module from the frame.
6. The apparatus of claim 1 wherein the panel is positioned adjacent to a face plate of the module.
7. The apparatus of claim 1 wherein the electromechanical device comprises a metallurgical phase transition temperature filament.