IP Library › Granted Patent US 10,136,562
Granted Patent B2
US 10,136,562 · App. 15/640,621 · Granted Nov 20, 2018

Underwater data center

Inventors: Naofumi Kosugi (Yokohama, JP); Susumu Takahashi (Yokohama, JP); Kiyomasa Kamei (Kawasaki, JP)
Assignee: FUJITSU LIMITED
H05K7/2079H05K7/1497H05K7/20709H05K7/20818B63C11/00B63C11/42B63C11/46B63C11/49B63C11/52B63G8/001B63G8/22G01C13/00G03B17/08H04B13/02
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Quick Facts
Patent No.
US 10,136,562
App. No.
15/640,621
Granted
Nov 20, 2018
Kind
B2
Abstract

An underwater data center includes an electronic device; a housing member that houses the electronic device and that is configured to be disposed under water; and a heat exchanger that is provided at the housing member and that is configured to discharge, into the water, heat discharged from the electronic device, with a face of the heat exchanger that discharges the heat making contact with the water, an opening being formed in a bottom face of the housing member and placing an inside of the housing member in communication with the water.

Claims (42)

1. An underwater data center, comprising:

an electronic device;

a housing member that houses the electronic device and that is configured to be disposed under water;

a heat exchanger that is provided at the housing member and that is configured to discharge, into the water, heat discharged from the electronic device, with a face of the heat exchanger that discharges the heat making contact with the water,

an opening being formed in a bottom face of the housing member and placing an inside of the housing member in communication with the water; and

a liquid film provided at the opening.

2. The underwater data center of claim 1 , wherein the liquid film is formed by a nonvolatile liquid that has a lower specific gravity than water and that is insoluble in water.

3. The underwater data center of claim 1 , further comprising a partitioning plate that partitions an inside part of the housing member into an inlet side for gas entering the heat exchanger and an outlet side for gas leaving the heat exchanger.

4. The underwater data center of claim 1 , wherein an outlet for gas from the heat exchanger faces the electronic device.

5. The underwater data center of claim 1 , further comprising a plurality of legs that extend downward from the housing member.

6. The underwater data center of claim 1 , further comprising a mooring member that moors the housing member at an installation site.

7. The underwater data center of claim 1 , wherein the heat exchanger is mounted to a top face of the housing member.

8. The underwater data center of claim 1 , wherein the heat exchanger forms part of the bottom face of the housing member.

9. The underwater data center of claim 1 , wherein the housing member has a hemispherical shape that is upwardly convex.

10. An underwater data center comprising:

an electronic device;

a housing member that houses the electronic device and that is configured to be disposed under water;

a heat exchanger that is provided at the housing member and that is configured to discharge, into the water, heat discharged from the electronic device, with a face of the heat exchanger that discharges the heat making contact with the water,

an opening being formed in a bottom face of the housing member and placing an inside of the housing member in communication with the water; and

a plurality of floating solid bodies that have a lower specific gravity than water, and that are insoluble in water, are provided at the opening.

11. The underwater data center of claim 10 , wherein an outlet for gas from the heat exchanger faces the electronic device.

12. The underwater data center of claim 10 , further comprising a plurality of legs that extend downward from the housing member.

13. The underwater data center of claim 10 , further comprising a mooring member that moors the housing member at an installation site.

14. The underwater data center of claim 10 , wherein the heat exchanger is mounted to a top face of the housing member.

15. The underwater data center of claim 10 , wherein the heat exchanger forms part of the bottom face of the housing member.

16. The underwater data center of claim 10 , wherein the housing member has a hemispherical shape that is upwardly convex.

17. The underwater data center of claim 10 , further comprising a partitioning plate that partitions an inside part of the housing member into an inlet side for gas entering the heat exchanger and an outlet side for gas leaving the heat exchanger.

18. An underwater data center comprising:

an electronic device;

a housing member that houses the electronic device and that is configured to be disposed under water;

a heat exchanger that is provided at the housing member and that is configured to discharge, into the water, heat discharged from the electronic device, with a face of the heat exchanger that discharges the heat making contact with the water,

an opening being formed in a bottom face of the housing member and placing an inside of the housing member in communication with the water; and

an opening-and-closing member that opens and closes the opening is attached to the housing member.

19. The underwater data center of claim 18 , further comprising a partitioning plate that partitions an inside part of the housing member into an inlet side for gas entering the heat exchanger and an outlet side for gas leaving the heat exchanger.

20. An underwater data center comprising:

an electronic device;

a housing member that houses the electronic device and that is configured to be disposed under water;

a heat exchanger that is provided at the housing member and that is configured to discharge, into the water, heat discharged from the electronic device, with a face of the heat exchanger that discharges the heat making contact with the water,

an opening being formed in a bottom face of the housing member and placing an inside of the housing member in communication with the water;

a support plate that is provided inside the housing member at a position above the opening;

a gap that is provided at the opening between a liquid surface and the support plate, and

a through-hole, through which gas flows from the gap to the electronic device, is formed in the support plate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 3, 2017
From: KOSUGI, NAOFUMI; TAKAHASHI, SUSUMU; KAMEI, KIYOMASA
To: FUJITSU LIMITED
Reel/Frame 043077/0496 →
Priority Claims (1)
JP 2016-159497 · Aug 16, 2016 · national
Continuity (1)
Related Publication 20180054916A1 · Feb 22, 2018
Cited By (2)
US 12,317,453 US 12,559,895