Methods of forming a microelectronic device structure, and related microelectronic device structures and microelectronic devices
A method of forming a microelectronic device structure comprises coiling a portion of a wire up and around at least one sidewall of a structure protruding from a substrate. At least one interface between an upper region of the structure and an upper region of the coiled portion of the wire is welded to form a fused region between the structure and the wire.
1. A method of forming a microelectronic device structure, comprising:
coiling a portion of a wire up and around at least one sidewall of a structure protruding from another structure; and
welding at least one interface between an upper region of the structure and an upper region of the coiled portion of the wire to form a fused region between the structure and the wire.
2. The method of claim 1 , wherein coiling a portion of a wire up and around at least one sidewall of a structure comprises coiling the portion of the wire substantially completely around a lateral periphery of the structure at least one time.
3. The method of claim 1 , wherein coiling a portion of a wire up and around at least one sidewall of a structure comprises coiling each of a sheathed region of the wire and an unsheathed region of the wire up and around the at least one sidewall of the structure.
4. The method of claim 3 , wherein coiling each of a sheathed region of the wire and an unsheathed region of the wire up and around the at least one sidewall of the structure comprises:
wrapping the sheathed region of the wire up and around a periphery of the structure at least one time; and
wrapping the unsheathed region of the wire up and around the periphery of the structure at least one time.
5. The method of claim 1 , wherein coiling a portion of a wire up and around at least one sidewall of a structure comprises directly physically contacting the at least one sidewall of the structure with the portion of the wire across an entire length of the portion of the wire.
6. The method of claim 1 , further comprising selecting the wire to comprise an unplated, substantially pure metal.
7. The method of claim 1 , further comprising selecting the wire to comprise an unplated metal alloy.
8. The method of claim 1 , further comprising selecting an entirety of a conductive material of the wire to consist of a single, solid conductive structure.
9. The method of claim 1 , wherein welding at least one interface between an upper region of the structure and an upper region of the coiled portion of the wire comprises subjecting the upper region of the structure and the upper region of the coiled portion of the wire to at least one micro welding process.
10. The method of claim 9 , wherein subjecting the upper region of the structure and the upper region of the coiled portion of the wire to at least one micro welding process comprises subjecting the upper region of the structure and the upper region of the coiled portion of the wire to one or more of at least one laser welding process and at least one pulse arc welding process.
11. The method of claim 1 , wherein welding at least one interface between an upper region of the structure and an upper region of the coiled portion of the wire to form a fused region between the structure and the wire comprises:
subjecting the at least one interface to at least one initial welding process to form initial, overlapping welds along the at least one interface; and
subjecting the initial, overlapping welds to at least one secondary welding process to form the fused region.
12. The method of claim 1 , wherein welding at least one interface between an upper region of the structure and an upper region of the coiled portion of the wire to form a fused region between the structure and the wire comprises forming the fused region to be substantially homogeneous.