Substrate processing apparatus

1. Support arrangement for supporting a radiation projection system in a substrate processing apparatus, the support arrangement comprising:

a support body for supporting the radiation projection system;

electrical wiring for supplying voltages to components within the radiation projection system and/or for supplying control data for modulation of radiation to be projected onto a target surface by the radiation projection system;

optical fibers, for supplying control data for modulation of radiation to be projected onto a target surface by the radiation projection system, and

a cooling arrangement comprising one or more fluid conduits for cooling the radiation projection system;

the electrical wiring, the optical fibers, and the cooling arrangement being at least partly accommodated in and/or supported by the support body,

and wherein the support arrangement comprises a space that is reserved for the electrical wiring, the optical fibers and the fluid conduits.

2. The support arrangement according to claim 1 , wherein the cooling arrangement comprises a plurality of tubes, the tubes being rigid and attached to the support body.

3. The support arrangement according to claim 2 , wherein the tubes are rigidly attached to the support body.

4. The support arrangement according to claim 1 , wherein the support body further comprises side walls for at least partly surrounding the radiation projection system.

5. The support arrangement according to claim 4 , wherein the side walls are connected to a base of the support body and extend in a direction substantially perpendicular to the base.

6. The support arrangement according to claim 4 , wherein the side walls comprise a shielding material for shielding the radiation projection system from external electromagnetic fields.

7. The support arrangement according to claim 4 , wherein one or more of the side walls are provided with one or more protrusions enabling draping the electrical wiring and the optical fibers respectively in such a way that the electrical wires and the fibers form a U-shaped bend at a height level below the respective protrusion.

8. Substrate processing apparatus comprising:

a support frame;

a support arrangement according to claim 1 , wherein the support arrangement is suspended from and vibrationally decoupled from the support frame.

9. The substrate processing apparatus according to claim 8 , further comprising a fluid transfer system for transferring cooling fluid to and removing cooling fluid from the cooling arrangement, the fluid transfer system being connected to the cooling arrangement,

wherein the fluid transfer system comprises a plurality of tubes each coupled to a tube of the cooling arrangement.

10. The substrate processing apparatus according to claim 9 , wherein the plurality of tubes of the fluid transfer system are at least partly accommodated by a housing from which they are vibrationally decoupled.

11. The substrate processing apparatus according to claim 9 , wherein the plurality of tubes is at least partly surrounded by a housing, the housing comprising one or more openings through which the one or more tubes of the fluid transfer system protrude.

12. The substrate processing apparatus according to claim 11 , wherein the housing is provided with an outlet for connection to a pump.

13. The substrate processing apparatus according to claim 11 , wherein the one or more openings are provided in a membrane, wherein the openings are provided with flexible portions, wherein the flexible portions extend from the membrane onto the tubes forming a seal.