Substrate transfer device and bonding system

1. A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, comprising:

a first holding part configured to hold an upper surface of the first substrate, a lower surface of the first substrate serving as a first bonding surface;

a second holding part provided below the first holding part and configured to hold a lower surface of the second substrate such that an upper surface of the second substrate faces the lower surface of the first substrate, the upper surface of the second substrate serving as a second bonding surface to be bonded to the lower surface of the first substrate; and

a first driving part connected to the first holding part and the second holding part, and configured to transfer the first substrate and the second substrate to the bonding apparatus while the first holding part and second holding part hold the first substrate and the second substrate, respectively.

2. The substrate transfer device of claim 1 , wherein the first holding part is configured to hold the first substrate by vacuum suction, and

the second holding part is configured to hold the second substrate by vacuum suction.

3. The substrate transfer device of claim 2 , further comprising a third holding part configured to hold at least one selected from a group consisting of a laminated substrate in which the first substrate and the second substrate are bonded, the first substrate not bonded by the bonding apparatus, and the second substrate not bonded by the bonding apparatus.

4. The substrate transfer device of claim 3 , further comprising a second driving part connected to the third holding part and configured to drive the third holding part.

5. The substrate transfer device of claim 4 , further comprising a fourth holding part provided above the third holding part and configured to hold at least one selected from a group consisting of the laminated substrate in which the first substrate and the second substrate are bonded, the first substrate not bonded by the bonding apparatus, and the second substrate not bonded by the bonding apparatus.

6. The substrate transfer device of claim 5 , wherein the second driving part is connected to the third holding part and the fourth holding part and configured to drive both the third holding part and the fourth holding part.

7. The substrate transfer device of claim 1 , further comprising a position detecting part disposed in a direction perpendicular to the surfaces of the first substrate held by the first holding part or the surfaces of the second substrate held by the second holding part, and capable of detecting a position of a peripheral edge of the first substrate held by the first holding part or a position of a peripheral edge of the second substrate held by the second holding part,

wherein when one substrate of the first substrate and the second substrate is held as an initially-held substrate by the first holding part or the second holding part, and then the other substrate of the first substrate and the second substrate is held by the first holding part or the second holding part as an additionally-held substrate in which the additionally-held substrate is overlapped with the initially-held substrate in a plan view, the position detecting part is configured to detect a position of a peripheral edge of the initially-held substrate before the additionally-held substrate is held, to detect positions of peripheral edges of the initially-held substrate and the additionally-held substrate after the additionally-held substrate is held, and to detect a position of a peripheral edge of the additionally-held substrate based on a deviation between the detected position of the peripheral edge of the initially-held substrate and the detected positions of the peripheral edges of the initially-held substrate and the additionally-held substrate.