SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device includes a substrate, a channel layer, a barrier layer, a recess, a charge trapping layer, a ferroelectric material layer, a gate, a source and a drain. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The barrier layer has a recess, and a portion of the barrier layer under the recess has a thickness. The source and the drain are disposed on the barrier layer. The charge trapping layer covers the bottom of the recess. The ferroelectric material is disposed on the charge trapping layer. The gate is disposed on the ferroelectric material.
1 . A semiconductor device comprising:
a substrate;
a channel layer disposed on the substrate;
a barrier layer disposed on the channel layer, the barrier layer having a recess, wherein the barrier layer has a portion underneath the recess, and the portion has a thickness;
a source and a drain disposed on the barrier layer;
a charge trapping layer covering a bottom surface of the recess;
a ferroelectric material layer disposed on the charge trapping layer; and
a gate disposed over the ferroelectric material.
2 . The semiconductor device of claim 1 , further comprising a first dielectric layer disposed between the bottom surface of the recess and the charge trapping layer.
3 . The semiconductor device of claim 1 , further comprising a second dielectric layer disposed between the ferroelectric material layer and the gate.
4 . The semiconductor device of claim 2 , wherein the first dielectric layer has a bandgap, and the bandgap ranges between 7 eV to 12 eV.
5 . The semiconductor device of claim 1 , wherein the thickness of the portion of the barrier layer ranges between 5 nm and 15 nm.
6 . The semiconductor device of claim 5 , wherein the ferroelectric material layer comprises a layer made of BaTiO3, KH2PO4, HfZrO2, SrBi2Ta2O9 or PbZrTiO3.
7 - 10 . (canceled)