Bonding apparatus
A bonding apparatus includes an upper holding unit, a lower holding unit, a pushing unit and an attracting/holding unit. The upper holding unit is configured to hold a first substrate from a top surface thereof which is a non-bonding surface. The lower holding unit is provided under the upper holding unit and is configured to hold a second substrate from a bottom surface thereof while allowing the second substrate to face the first substrate. The pushing unit is configured to press a central portion of the first substrate from above to bring the central portion of the first substrate into contact with the second substrate. The attracting/holding unit is configured to be moved up and down with respect to the upper holding unit and hold a part of the top surface of the first substrate by attraction before the first substrate is held by the upper holding unit.
1. A bonding apparatus, comprising:
an upper holding unit configured to hold a first substrate from a top surface thereof which is a non-bonding surface;
a lower holding unit provided under the upper holding unit and configured to hold a second substrate from a bottom surface thereof while allowing the second substrate to face the first substrate;
a pushing unit configured to press a central portion of the non-bonding surface the first substrate from above to bring a central portion of a bonding surface of the first substrate into contact with the second substrate;
an attracting/holding unit configured to be moved up and down with respect to the upper holding unit, hold a part of the non-bonding surface of the first substrate by attraction before the first substrate is held by the upper holding unit, and deliver the first substrate to the upper holding unit; and
a transfer unit configured to hold the first substrate by attracting at least a part of the non-bonding surface of the first substrate and transfer the first substrate to the attracting/holding unit,
wherein the upper holding unit holds the first substrate which is delivered from the attracting/holding unit.
2. The bonding apparatus of claim 1 ,
wherein the attracting/holding unit has an insertion through hole through which the pushing unit is inserted.
3. The bonding apparatus of claim 1 ,
wherein the attracting/holding unit comprises:
a base member configured to be moved up and down with respect to the upper holding unit;
an air suction path which is formed in the base member and through which suction air for attracting the first substrate is flown; and
an attracting member provided in the air suction path and configured to be brought into contact with and attracted to the first substrate before the first substrate is held by the upper holding unit,
wherein the attracting member is located such that the attracting member is protruded from an end surface of the base member at a side of the first substrate in a state before the attracting member comes into contact with the first substrate.
4. The bonding apparatus of claim 3 ,
wherein the attracting member comprises an elastic member.
5. The bonding apparatus of claim 1 , further comprising:
a controller configured to control the attracting/holding unit,
wherein the controller controls the attracting/holding unit to hold the first substrate by the attraction and then raises the attracting/holding unit to deliver the first substrate held by the attracting/holding unit to the upper holding unit.
6. The bonding apparatus of claim 5 ,
wherein, after delivering the first substrate to the upper holding unit, the controller raises the attracting/holding unit until the attracting/holding unit is located above a holding surface of the upper holding unit.
7. The bonding apparatus of claim 1 ,
wherein the upper holding unit holds the first substrate by attraction, and
an attracting force of the attracting/holding unit is set to be equal to or smaller than an attracting force of the upper holding unit.