IP Library Granted Patent US 10,770,644
Granted Patent B2
US 10,770,644 · App. 15/646,160 · Granted Sep 8, 2020

Piezoelectric device

Inventors: Heishiro Fudo (Tokyo, JP); Yasuji Hagiwara (Tokyo, JP); Daisuke Takai (Tokyo, JP); Shoji Sakurai (Tokyo, JP); Masahiro Ishida (Tokyo, JP); Yo Tahara (Tokyo, JP)
Assignee: ALPS ALPINE CO., LTD.
H01L41/1132H01L41/047H01L41/0477H01L41/0478H01L41/0533H01L41/081H01L41/0805H01L41/1138H01L41/183H01L41/314H01L41/33H01L41/333H01L41/37
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Quick Facts
Patent No.
US 10,770,644
App. No.
15/646,160
Granted
Sep 8, 2020
Kind
B2
Abstract

A piezoelectric device includes a substrate that is flexible and thermally deformable, and a composite piezoelectric body disposed on the substrate. Output in accordance with deformation of the composite piezoelectric body is obtained. The composite piezoelectric body includes a piezoelectric layer containing an organic binder containing piezoelectric particles, a first electrode layer stacked on a first surface side of the piezoelectric layer, and a second electrode stacked on a second surface side of the piezoelectric layer. The substrate is insert molded and integrated with a molded resin body having a curved shape.

Claims (28)

1. A piezoelectric device producing output according to deformation of a composite piezoelectric body, the piezoelectric device comprising:

a substrate that is flexible and thermally deformable; and

a composite piezoelectric body disposed on the substrate, the composite piezoelectric body including:

a piezoelectric layer containing an organic binder and piezoelectric particles,

a first electrode layer stacked on a first surface side of the piezoelectric layer, and

a second electrode layer stacked on a second surface side of the piezoelectric layer,

wherein the substrate is insert molded and integrated with a molded resin body having a curved shape;

the substrate is formed of a thermoplastic resin;

the organic binder is formed of a thermoplastic resin;

the first electrode layer contains a first binder resin which is a thermoplastic resin, and first conductive particles dispersed in the first binder resin;

the second electrode layer contains a second binder resin which is a thermoplastic resin, and a second conductive particles dispersed in the second binder resin; and

the organic binder has a melt viscosity at 250° C. of 300 Pa·s or more.

2. The piezoelectric device according to claim 1 , wherein the piezoelectric particles are formed of a polarized ferroelectric and have a Curie temperature of 250° C. or higher.

3. The piezoelectric device according to claim 2 , wherein the piezoelectric particles have a Curie temperature of 375° C. or higher.

4. The piezoelectric device according to claim 1 , wherein:

the substrate provided with the composite piezoelectric body is heated and pressurized to be deformed into a curved shape prior to the insert molding; and

the organic binder has a storage elastic modulus at 140° C. of 1 MPa or more and a loss elastic modulus of 0.1 MPa or more.

5. The piezoelectric device according to claim 1 , wherein a maximum height (Ry) of surface roughness of the first electrode layer and the second electrode layer is one half of the thickness of the piezoelectric layer or less.

6. The piezoelectric device according to claim 1 , wherein the piezoelectric particles are formed of potassium niobate.

7. A piezoelectric device producing output according to deformation of a composite piezoelectric body, the piezoelectric device comprising:

a substrate that is flexible and thermally deformable; and

a composite piezoelectric body disposed on the substrate, the composite piezoelectric body including:

a piezoelectric layer containing an organic binder and piezoelectric particles,

a first electrode layer stacked on a first surface side of the piezoelectric layer, and

a second electrode layer stacked on a second surface side of the piezoelectric layer,

wherein the substrate is insert molded and integrated with a molded resin body having a curved shape;

the substrate and the molded resin body are integrated at a second surface side opposite to a first surface side of the substrate provided with the composite piezoelectric body; and

an overcoat layer formed of a thermoplastic resin is provided on the first surface side of the substrate so as to cover the composite piezoelectric body.

Assignments (2)
CHANGE OF NAME Recorded Jan 31, 2019
From: ALPS ELECTRIC CO., LTD
To: ALPS ALPINE CO., LTD
Reel/Frame 048208/0698 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2017
From: FUDO, HEISHIRO; HAGIWARA, YASUJI; TAKAI, DAISUKE; SAKURAI, SHOJI; ISHIDA, MASAHIRO; TAHARA, YO
To: ALPS ELECTRIC CO., LTD.
Reel/Frame 042962/0706 →
Priority Claims (1)
JP 2015-009285 · Jan 21, 2015 · national
Continuity (2)
Continuation PCTJP2016051004 · Jan 14, 2016
Related Publication 20170317265A1 · Nov 2, 2017