Wafer bow reduction

1. A method for reducing bow in a composite wafer comprising a silicon wafer and a silicon carbide epitaxial layer grown on the silicon wafer, the method comprising:

applying nitrogen atoms during the epitaxial growth of the silicon carbide epitaxial layer on the silicon wafer so as to generate a compressive stress within the composite wafer;

wherein the epitaxial growth occurs at an epitaxial growth rate; and

wherein the epitaxial growth takes place over a low growth rate region, a transition region, and a high growth rate region; and

wherein the nitrogen atoms are incorporated into the silicon carbide epitaxial layer at a first incorporation rate close to an interface in the low growth rate region; and

wherein the nitrogen atoms are incorporated into the silicon carbide epitaxial layer at an incorporation rate which is inversely proportional to the epitaxial growth rate in the silicon carbide epitaxial layer in the low growth rate region away from the interface and in the transition region; and

wherein the nitrogen atoms incorporated during the single crystal epitaxial growth of the silicon carbide epitaxial layer are in addition to the nitrogen of the doping concentration of the silicon carbide epitaxial layer so that the nitrogen atoms do not form part of the doping concentration of the silicon carbide epitaxial layer.

2. A method according to claim 1 , wherein the nitrogen atoms are applied during the single crystal epitaxial growth phase of the silicon carbide layer.

3. A method according to claim 1 , wherein the application of the nitrogen atoms generates the compressive stress to countermand a natural tensile stress causing the bow of the composite wafer, and optionally the compressive stress is generated at the same place within the composite wafer where the natural tensile stress is generated.

4. A method according to claim 1 , wherein the interface between the silicon wafer and the silicon carbide layer includes dislocations or crystal defects, and optionally wherein the dislocations or crystal defects at the interface incorporates the nitrogen atoms at a higher rate than a single crystal.

5. A method according to claim 1 , wherein the silicon carbide layer is a 3-step cubic silicon carbide (3C—SiC); and/or

wherein the application of nitrogen atoms causes the substantially central part of the composite wafer to be substantially flattened so as to reduce the bow of the composite wafer; and/or

wherein the nitrogen atoms are applied across substantially the whole area of the composite wafer; and/or

wherein the nitrogen atoms applied during the single crystal epitaxial growth of the silicon carbide layer do not form part of the doping concentration of the silicon carbide layer.

6. A method according to claim 1 , wherein the composite wafer is an on-axis wafer or wherein the composite wafer is an off-axis wafer.

7. A method according to claim 1 , wherein the nitrogen flow rate is zero in the high growth rate region.

8. A method for manufacturing a composite wafer, the method comprising:

forming a silicon wafer;

thermally growing a silicon carbide epitaxial layer on the silicon wafer to form the composite wafer; and

applying nitrogen atoms during the thermal epitaxial growth of the silicon carbide epitaxial layer so as to generate a compressive stress within the composite wafer;

wherein the epitaxial growth occurs at an epitaxial growth rate; and

wherein the epitaxial growth takes place over a low growth rate region, a transition region, and a high growth rate region; and

wherein the nitrogen atoms are incorporated into the silicon carbide epitaxial layer at a first incorporation rate close to an interface in the low growth rate region; and

wherein the nitrogen atoms are incorporated into the silicon carbide epitaxial layer at an incorporation rate which is inversely proportional to the epitaxial growth rate in the silicon carbide epitaxial layer in the low growth rate region away from the interface and in the transition region; and

wherein the nitrogen atoms incorporated during the single crystal epitaxial growth of the silicon carbide epitaxial layer are in addition to the nitrogen of the doping concentration of the silicon carbide epitaxial layer so that the nitrogen atoms do not form part of the doping concentration of the silicon carbide epitaxial layer.

9. A method according to claim 8 , wherein the nitrogen flow rate is zero in the high growth rate region.

10. A silicon carbide semiconductor structure comprising:

a monocrystalline silicon wafer;

a silicon carbide epitaxial layer grown on the monocrystalline silicon wafer;

wherein the interface between the silicon wafer and the silicon carbide layer comprises nitrogen atoms which are applied during the epitaxial growth process of the silicon carbide epitaxial layer so as to generate a compressive stress within the semiconductor structure;

wherein the epitaxial growth occurs at an epitaxial growth rate; and

wherein the epitaxial growth takes place over a low growth rate region, a transition region, and a high growth rate region; and

wherein the nitrogen atoms are incorporated into the silicon carbide epitaxial layer at a first incorporation rate close to an interface in the low growth rate region; and

wherein the nitrogen atoms are incorporated into the silicon carbide epitaxial layer at an incorporation rate which is inversely proportional to the epitaxial growth rate in the silicon carbide epitaxial layer in the low growth rate region away from the interface and in the transition region; and

wherein the nitrogen atoms incorporated during the single crystal epitaxial growth of the silicon carbide epitaxial layer are in addition to the nitrogen of the doping concentration of the silicon carbide epitaxial layer so that the nitrogen atoms do not form part of the doping concentration of the silicon carbide epitaxial layer.

11. A semiconductor structure according to claim 10 , wherein the nitrogen atoms are applied during the single crystal epitaxial growth phase of the silicon carbide layer.

12. A semiconductor structure according to claim 10 , wherein the application of the nitrogen atoms generates the compressive stress to countermand a natural tensile stress causing the bow of the semiconductor structure, and optionally wherein the compressive stress is generated at the same place within the semiconductor where the natural tensile stress is generated.

13. A semiconductor structure according to claim 10 , wherein the interface between the silicon wafer and the silicon carbide layer includes dislocations or crystal defects, and optionally wherein the dislocations or crystal defects at the interface incorporates the nitrogen atoms at a higher rate than a single crystal.

14. A semiconductor structure according to claim 10 , wherein the silicon carbide layer is a 3-step cubic silicon carbide (3C-SiC).

15. A semiconductor structure according to claim 10 , wherein the application of nitrogen atoms causes the substantially central part of the semiconductor structure to be substantially flattened so as to reduce bow of the semiconductor structure; and/or

wherein the nitrogen atoms are applied across the substantially the whole area of the semiconductor structure; and/or

wherein the nitrogen atoms applied during the crystal growth of the silicon carbide layer do not form part of the doping concentration of the silicon carbide layer.

16. A semiconductor structure according to claim 10 , wherein the silicon wafer is an on-axis wafer or wherein the silicon wafer is an off-axis wafer.

17. A SiC device comprising:

the semiconductor structure according to claim 10 ; and

one or more semiconductor device or transistor structures over the semiconductor structure.

18. A SiC diode incorporating the SiC device of claim 17 .

19. A SiC insulated gate bipolar transistor (IGBT) incorporating the SiC device of claim 17 .

20. A SiC MOSFET incorporating the SiC device of claim 17 .

21. A semiconductor structure according to claim 10 , wherein the nitrogen flow rate is zero in the high growth rate region.