Flexible and conformal electronics using rigid substrates
A flexible electronics assembly includes a single-piece substrate having two regions of rigidity separated by a localized region of flexibility. The localized region of flexibility has a lower rigidity than the two regions of rigidity. The two regions of rigidity are angularly deflectable from a planar configuration of the single-piece substrate to a non-planar configuration of the single-piece substrate by hinging action of the localized region of flexibility. At least one electronic component is mounted on at least one of the two regions of rigidity.
1. A flexible electronics assembly comprising:
a single-piece substrate, the substrate including two regions of rigidity separated by a localized region of flexibility, the localized region of flexibility having a lower rigidity than the two regions of rigidity; and
at least one electronic component mounted on at least one of the two regions of rigidity, the localized region of flexibility including a plurality of compliant joints, the plurality of compliant joints including at least a lamina emergent torsional (LET) joint and forming a hinge configured to angularly deflect, repeatedly, the two regions of rigidity:
from a planar configuration of the single-piece substrate to a non-planar configuration of the single-piece substrate; and
from the non- planar configuration of the single-piece substrate to the planar configuration of the single-piece substrate.
2. The flexible electronics assembly of claim 1 , wherein the localized region of flexibility elastically accommodates substantially all stresses and strains in the single-piece substrate caused by angular deflection of the two regions of rigidity.
3. The flexible electronics assembly of claim 1 , wherein the localized region of flexibility is a geometrically modified region of the single-piece substrate.
4. The flexible electronics assembly of claim 3 , wherein the plurality of compliant joints include at least one compliant joint formed by geometrical shaping of the single-piece substrate.
5. The flexible electronics assembly of claim 4 , wherein the at least one compliant joint formed by geometrical shaping of the single-piece substrate is a lamina emergent torsional (LET) joint.
6. The flexible electronics assembly of claim 4 , wherein the at least one compliant joint formed by geometrical shaping of the single-piece substrate includes an array of LET joints in series and or in parallel.
7. The flexible electronics assembly of claim 5 , wherein the LET joint includes two torsional members and two bending members as sides of a rectangle circumscribing a rectangular slot cut in the localized region of flexibility.
8. The flexible electronics assembly of claim 7 , wherein the LET joint is configured to transfer a bending load associated with angular deflection of the two regions of rigidity and applied to the LET joint as a torsional load on the two torsional members of the LET joint.
9. The flexible electronics assembly of claim 1 , wherein the single-piece substrate is a conductor clad substrate.
10. The flexible electronics assembly of claim 1 , wherein an electrically conducting trace running across the localized region of flexibility provides an electrical connection to the at least one electronic component mounted on at least one of the two regions of rigidity.
11. The flexible electronics assembly of claim 1 , wherein the single-piece substrate, includes a plurality of localized regions of flexibility disposed along fold axes of an origami pattern.
12. A printed circuit board comprising:
a localized region of flexibility separating two regions of rigidity, the localized region of flexibility having a lower rigidity than the two regions of rigidity, the localized region of flexibility separating the two regions of rigidity, the localized region of flexibility including a plurality of compliant joints, the plurality of compliant joints including at least a lamina emergent torsional (LET) joint and forming a hinge configured to angularly deflect the two regions of rigidity, repeatedly:
from a planar configuration of the printed circuit board to a non-planar configuration of the printed circuit board; and
from the non-planar configuration of the printed circuit board to the planar configuration of the printed circuit board,
wherein at least one of the two regions of rigidity of the printed circuit board is configured to receive an electronic device component mounted thereon.
13. The printed circuit board of claim 12 , wherein the localized region of flexibility elastically accommodates substantially all stresses and strains in the printed circuit board caused by angular deflection of the two regions of rigidity.
14. The printed circuit board of claim 12 , wherein the plurality of compliant joints include at least one geometrically shaped compliant joint in the printed circuit board.
15. The printed circuit board of claim 14 , wherein the at least one geometrically shaped compliant joint in the printed circuit board includes at least one lamina emergent torsional (LET) joint.
16. The printed circuit board of claim 15 , wherein the at least one
LET joint includes:
two torsional members and two bending members as sides of a rectangle circumscribing a rectangular slot cut in the localized region of flexibility, wherein the at least one LET joint transfers a bending load associated with angular deflection of the two regions of rigidity and applied to the LET joint as a torsional load on the two torsional members of the at least one LET joint.
17. The printed circuit board of claim 12 , further including:
an electrically conducting trace running across the localized region of flexibility.
18. The printed circuit board of claim 12 , wherein the localized region of flexibility includes a plurality of localized regions of flexibility along fold axes of an origami pattern.