IP Library › Granted Patent US 10,268,787
Granted Patent B2
US 10,268,787 · App. 15/651,714 · Granted Apr 23, 2019

Hybrid timing analysis method and associated system and non-transitory computer readable medium

Inventors: Chun-Jiun Dai (Taichung, TW); Wei Min Chan (Taipei County, TW); Yen-Huei Chen (Hsinchu County, TW); Hung-Jen Liao (Hsin-Chu, TW); Jonathan Tsung-Yung Chang (Hsinchu, TW)
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
G06F17/5031G06F17/5068
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Quick Facts
Patent No.
US 10,268,787
App. No.
15/651,714
Granted
Apr 23, 2019
Kind
B2
Abstract

A hybrid timing analysis method includes: receiving a pre-layout netlist, a post-layout netlist and a configuration file associated with an integrated circuit design; generating a first measurement script and an input stimulus waveform file according to the configuration file; performing a first dynamic timing analysis upon the pre-layout netlist by using the first measurement script and the input stimulus waveform file to generate a pre-layout simulation result; identifying at least one data path and at least one clock path according to the pre-layout simulation result; generating a second measurement script according to the at least on data path and at least one clock path; and performing a second dynamic timing analysis upon the post-layout netlist by using the second measurement script and the input stimulus waveform file to generate a first post-layout simulation result. Associated system and non-transitory computer readable medium are also provided.

Claims (54)

1. A hybrid timing analysis method, comprising:

receiving a pre-layout netlist, a post-layout netlist and a configuration file associated with an integrated circuit design;

generating a first measurement script and an input stimulus waveform file according to the configuration file;

performing a first dynamic timing analysis upon the pre-layout netlist by using the first measurement script and the input stimulus waveform file to generate a pre-layout simulation result;

identifying at least one data path and at least one clock path according to the pre-layout simulation result;

generating a second measurement script according to the at least on data path and at least one clock path;

performing a second dynamic timing analysis upon the post-layout netlist by using the second measurement script and the input stimulus waveform file to generate a first post-layout simulation result; and

fabricating a semiconductor chip according to the post-layout netlist and the first post-layout simulation result.

2. The hybrid timing analysis method of claim 1 , further comprising:

generating a false path file according to the first post-layout simulation result.

3. The hybrid timing analysis method of claim 2 , further comprising:

performing a static timing analysis upon the post-layout netlist according to the first post-layout simulation result and the false path file to generate a second post-layout simulation result.

4. The hybrid timing analysis method of claim 2 , wherein the first post-layout simulation result comprises delay information between neighboring nets along each data path.

5. The hybrid timing analysis method of claim 4 , wherein the generation of the false path file according to the first post-layout simulation result comprises:

when the delay information indicates a negative value, identifying the data path associated with the delay information as a false path recording the false path in the false path file.

6. The hybrid timing analysis method of claim 1 , wherein the receiving of the configuration file comprises:

receiving the configuration file including a logical level of each input pin of the integrated circuit design at a plurality of cycles.

7. The hybrid timing analysis method of claim 1 , wherein the generation of the first measurement script comprises:

generating the first measurement script including all nets in the pre-layout netlist.

8. The hybrid timing analysis method of claim 1 , wherein the generation of the pre-layout simulation result comprises:

generating the pre-layout simulation result including active nets and non-active nets.

9. The hybrid timing analysis method of claim 8 , wherein the identification of the at least one data path according to the pre-layout simulation result comprises:

identifying the at least one data path associated with the active nets.

10. The hybrid timing analysis method of claim 9 , wherein the identification of the at least one clock path according to the pre-layout simulation result comprises:

identifying the at least one clock path associated with the at least one data path.

11. The hybrid timing analysis method of claim 1 , wherein the generation of the second measurement script comprises:

generating the second measurement script for indicating a plurality of nets in the post-layout netlist corresponding to the data path and the clock path.

12. The hybrid timing analysis method of claim 11 , wherein the plurality of nets indicated in the second measurement script is less than the nets included in the first measurement script.

13. A system, comprising:

a computer aided engineering (CAE) design system for performing the hybrid timing analysis method of claim 1 ;

a storage subsystem for storing a pre-layout netlist, a post-layout netlist and a configuration file associated with an integrated circuit design; and

a first bus coupled between the CAE design system and the storage subsystem;

wherein the CAE design system receives the pre-layout netlist, the post-layout netlist and the configuration file from the storage subsystem through the first bus.

14. The system of claim 13 , further comprising:

an interactive user interface; and

a second bus coupled between the CAE design system and the interactive user interface.

15. A non-transitory computer readable medium storing a set of instructions which when executed performs a hybrid timing analysis method, the hybrid timing analysis method comprising:

receiving a pre-layout netlist, a post-layout netlist and a configuration file associated with an integrated circuit design;

generating a first measurement script and an input stimulus waveform file according to the configuration file;

performing a first dynamic timing analysis upon the pre-layout netlist by using the first measurement script and the input stimulus waveform file to generate a pre-layout simulation result;

identifying at least one data path and at least one clock path according to the pre-layout simulation result;

generating a second measurement script according to the at least on data path and at least one clock path;

performing a second dynamic timing analysis upon the post-layout netlist by using the second measurement script and the input stimulus waveform file to generate a first post-layout simulation result; and

fabricating a semiconductor chip according to the post-layout netlist and the first post-layout simulation result.

16. The non-transitory computer readable medium of claim 15 , wherein the hybrid timing analysis method further comprises:

generating a false path file according to the first post-layout simulation result.

17. The non-transitory computer readable medium of claim 16 , wherein the hybrid timing analysis method further comprises:

performing a static timing analysis upon the post-layout netlist according to the first post-layout simulation result and the false path file to generate a second post-layout simulation result.

18. The non-transitory computer readable medium of claim 15 , wherein the receiving of the configuration file comprises:

receiving the configuration file including a logical level of each input pin of the integrated circuit design at a plurality of cycles.

19. The non-transitory computer readable medium of claim 15 , wherein the generation of the first measurement script comprises:

generating the first measurement script including all nets in the pre-layout netlist.

20. The non-transitory computer readable medium of claim 15 , the generation of the pre-layout simulation result comprises:

generating the pre-layout simulation result including active nets and non-active nets.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 12, 2017
From: DAI, CHUN-JIUN; CHAN, WEI MIN; CHEN, YEN-HUEI; LIAO, HUNG-JEN; CHANG, JONATHAN TSUNG-YUNG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Reel/Frame 043566/0307 →
Continuity (1)
Related Publication 20190018917A1 · Jan 17, 2019