Support pillar
The present invention disclosed a micro acoustic collector and CMOS microphone single chip. The micro acoustic collector comprising: a plurality of leaf-shaped structures annularly arranged with symmetry, each of the plurality of leaf-shaped structure having a suspended arm and a restrained arm, and the suspended arm of the plurality of leaf-shaped structures connected to a suspended fulcrum, and a plurality of through-vias formed in the suspended fulcrum and the plurality of leaf-shaped structures; a plurality of support pillars uniformly disposed under edges of the plurality of leaf-shaped structures corresponding to the restrained arms and the suspend arms; and a base metal layer formed under and insulated from the plurality of support pillars, and facing towards the inner-annular-supported acoustic collection film to form a hollow space.
1. A micro acoustic collector, manufactured by complementary metal-oxide-semiconductor (CMOS) process, and the micro acoustic collector comprising:
an inner-annular-supported acoustic collection film comprising a plurality of leaf-shaped structures annularly arranged with symmetry, each of the plurality of leaf-shaped structures having a suspended arm and a restrained arm both defined by a continuous trench, and the suspended arm of each of the plurality of leaf-shaped structures connected to a suspended fulcrum, and a plurality of through-vias formed in each of the suspended fulcrum and the plurality of leaf-shaped structures;
a plurality of support pillars uniformly and respectively disposed under edges of the plurality of leaf-shaped structures corresponding to the restrained arms and the suspend arms of the plurality of leaf-shaped structures, respectively, to support the plurality of leaf-shaped structures; and
a base metal layer formed under and insulated from the plurality of support pillars, and facing towards the inner-annular-supported acoustic collection film to form a hollow space.
2. The micro acoustic collector according to claim 1 , wherein the suspended arm of each of the plurality of leaf-shaped structures is selected from any of the following combinations: a straight shape, an L shape with straight sections having same lengths, a V shape with straight sections having same lengths, a square shape, a circular shape, an elliptic shape, and a heart-like shape.
3. The micro acoustic collector of according to claim 1 , wherein the plurality of support pillars are annularly disposed with symmetry.
4. The micro acoustic collector according to claim 1 , wherein the plurality of support pillars comprise at least three support pillars.
5. The micro acoustic collector according to claim 1 , wherein the inner-annular-supported acoustic collection film is circular.
6. The micro acoustic collector according to claim 1 , further comprising:
a circuit integration formed under the base metal layer, connected the plurality of support pillars and the base metal layer, configured to provide operation voltages to the inner-annular-supported acoustic collection film and the base metal layer, receive a voltage signal generated from a sonic signal sensed by the inner-annular-supported acoustic collection film, and convert the voltage signal into an output signal.
7. The micro acoustic collector according to claim 6 , further comprising:
a plurality of pads, formed on a side of the inner-annular-supported acoustic collection film and connected to the circuit integration, for use as a solder joint of an external package.
8. The micro acoustic collector according to claim 6 , wherein the plurality of leaf-shaped structures are spaced apart from each other to form at least one central channel which pass through a central portion of the inner-annular-supported acoustic collection film, and the at least one central channel and the leaf-shaped structures each have a plurality of through-vias.
9. The micro acoustic collector according to claim 1 , wherein each of the plurality of support pillar is formed by a metal layer coated with an insulating material.