Microfeature workpieces having alloyed conductive structures, and associated methods
Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a bond pad of a microfeature workpiece, with the volume of material including a first metallic constituent and the bond pad including a second constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the bond pad to alloy the first metallic constituent and the second metallic constituent so that the first metallic constituent is alloyed generally throughout the volume of material. A thickness of the bond pad can be reduced from an initial thickness T 1 to a reduced thickness T 2.
1. A microfeature workpiece, comprising:
a substrate having a first side and a second side opposite the first side; and
an interconnect structure comprising—
a conductive material positioned in a via extending from the first side of the substrate at least partially through the substrate, the conductive material including a first metallic constituent,
first and second conductive layers positioned laterally between the conductive material and the substrate, the first and second conductive layers (a) at least partially surrounding the conductive material, and (b) having a second metallic constituent, and
a barrier layer positioned laterally between the first and second conductive layers.
2. The microfeature workpiece of claim 1 wherein the second metallic constituent is configured to bond with the first metallic constituent under heat.
3. The microfeature workpiece of claim 1 , further comprising:
a first bond site at the first side of the substrate; and
a second bond site at the second side of the substrate,
wherein the first and second bond sites are each electrically coupled to the conductive material in the via.
4. The microfeature workpiece of claim 3 , further comprising an interconnect element coupled to the second bond site and configured to electrically couple the microfeature workpiece to an external package.
5. The microfeature workpiece of claim 1 wherein the barrier layer
at least partially inhibits migration of the first conductive layer in a direction toward the conductive material.
6. The microfeature workpiece of claim 5 further comprising:
a seed layer between the first conductive layer and the substrate;
and
a dielectric layer between the seed layer and the substrate.
7. The microfeature workpiece of claim 1 wherein the conductive material includes solder material.
8. The microfeature workpiece of claim 1 wherein the conductive material has a melting point from 240° C. to 260° C.
9. The microfeature workpiece of claim 1 wherein the first and second metallic constituents each includes solder, tin, silver, copper, lead, gold, nickel or a combination thereof.
10. The microfeature workpiece of claim 1 wherein the first and second metallic constituents are composed of different materials.
11. A microfeature workpiece, comprising:
a substrate having a first side, a second side opposite the first side, and a via extending from the first side at least partially through the substrate;
a conductive material disposed in the via and including a first metallic constituent generally distributed throughout the conductive material;
first and second conductive layers positioned laterally between the conductive material and the substrate and at least partially surrounding the conductive material, the first and second conductive layers having a second metallic constituent; and
a barrier layer positioned laterally between the first and second conductive layers.
12. The microfeature workpiece of claim 11 wherein the second metallic constituent includes a first portion in the first conductive layer and a second portion in the second conductive layer, and wherein, upon being heated, the second portion of the second metallic constituent migrates toward the conductive material and the first portion remains in the first conductive layer.
13. The microfeature workpiece of claim 11 , further comprising:
a bond site at the second side of the substrate; and
a solder ball electrically coupling the bond site to an external package,
wherein the first and second bond sites are each electrically coupled to the conductive material in the via.
14. The microfeature workpiece of claim 11 , wherein
the barrier layer at least partially prevents migration of the first conductive layer in a direction toward the conductive material.
15. The microfeature workpiece of claim 14 , further comprising:
a seed layer between the first conductive layer and the substrate;
and
a dielectric layer between the seed layer and the substrate.
16. The microfeature workpiece of claim 11 wherein the conductive material has a melting point from 240° C. to 260° C.
17. The microfeature workpiece of claim 11 wherein:
the first metallic constituent includes at least one of tin or silver, and
the second metallic constituent includes copper.