Multilayer ceramic electronic component
A multilayer ceramic electronic component includes an electronic component body including a laminate and an external electrode, and a pair of metal terminals that are joined by a joining material. The pair of metal terminals includes a terminal joint portion, an extended portion and a mounting portion. The external electrode is provided only on both end surfaces of the laminate, and includes first and second external electrodes. The first external electrode and the second external electrode each include a saddle portion with a thickness larger than the thickness of a center portion of each end surface in the periphery of the first end surface and the second end surface of the laminate, respectively.
1. A multilayer ceramic electronic component comprising:
an electronic component body including:
a laminate including a plurality of laminated ceramic layers and a plurality of laminated internal electrode layers, and including first and second principal surfaces that are opposed to each other, first and second lateral surfaces that are opposed to each other, and first and second end surfaces that are opposed to each other;
a first external electrode connected with the first end surface of the laminate; and
a second external electrode connected with the second end surface of the laminate;
a first metal terminal connected with the first external electrode; and
a second metal terminal connected with the second external electrode; wherein
the first and second external electrodes are disposed on the first and second end surfaces;
the first and second external electrodes include a portion having a thickness larger than a thickness of a center portion of the first and second end surfaces in peripheries of the first and second end surfaces in a planar view from a direction linking the first and second end surfaces;
the center portion of the first and second end surfaces include a base electrode layer and a plating layer provided on the base electrode layer;
the first metal terminal includes a first terminal joint portion connected with the first end surface, a first extended portion connected with the first terminal joint portion and extending in a mounting surface direction, and a first mounting portion connected with the first extended portion and extending in a direction linking the end surfaces from the first extended portion;
the second metal terminal includes a second terminal joint portion connected with the second end surface, a second extended portion connected with the second terminal joint portion and extending in the mounting surface direction, and a second mounting portion connected with the second extended portion and extending in a direction linking the end surfaces from the extended portion;
the extended portion defines a gap between a bottom surface of the electronic component body and the first mounting portion or the second mounting portion.
2. The multilayer ceramic electronic component according to claim 1 , wherein the portion of the first and second external electrodes having the larger thickness surrounds the peripheries of the first and second end surfaces.
3. The multilayer ceramic electronic component according to claim 1 , wherein a base material of the first and second metal terminals is phosphor bronze.
4. The multilayer ceramic electronic component according to claim 1 , wherein the electronic component body has rectangular or substantially rectangular parallelepiped shape.
5. The multilayer ceramic electronic component according to claim 1 , wherein the ceramic layers are made of a dielectric material.
6. The multilayer ceramic electronic component according to claim 1 , wherein the ceramic layers are made of a piezoelectric material.
7. The multilayer ceramic electronic component according to claim 1 , wherein the ceramic layers are made of a semiconductor material.
8. The multilayer ceramic electronic component according to claim 1 , wherein the ceramic layers are made of a magnetic material.
9. The multilayer ceramic electronic component according to claim 1 , wherein each of the ceramic layers has a thickness of about 0.5 μm to about 10 μm.
10. The multilayer ceramic electronic component according to claim 1 , wherein the internal electrode layers are parallel or perpendicular to the mounting surface direction.
11. The multilayer ceramic electronic component according to claim 1 , wherein the laminate includes an opposed electrode portion where a first of the internal electrode layers and a second of the second internal electrode layers are opposed to each other, and a gap between one end in a width direction of the opposed electrode portion and a first lateral surface, and between the other end in the width direction of the opposed electrode portion and a second lateral surface.
12. The multilayer ceramic electronic component according to claim 1 , wherein the laminate includes an opposed electrode portion where a first of the internal electrode layers and a second of the second internal electrode layers are opposed to each other, and a gap between an end portion on a side opposite to the first extended electrode portion of a first of the internal electrode layers and the second end surface, and between an end portion on a side opposite to a second extended electrode portion of a second of the internal electrode layers and the first end surface.
13. The multilayer ceramic electronic component according to claim 1 , wherein each of the internal electrode layers has a thickness of about 0.1 μm to about 2 μm.
14. The multilayer ceramic electronic component according to claim 1 , wherein the multilayer ceramic electronic component is a capacitor.
15. The multilayer ceramic electronic component according to claim 1 , wherein a difference in thickness of the portion of the first and second external electrodes having the thickness larger than the thickness of the center portion of the first and second end surfaces in peripheries of the first and second end surfaces in the planar view from a direction linking the first and second end surfaces is about 0.1 μm to about 5.0 μm.
16. The multilayer ceramic electronic component according to claim 1 , wherein a difference in thickness of the portion of the first and second external electrodes having the thickness larger than the thickness of the center portion of the first and second end surfaces in peripheries of the first and second end surfaces in the planar view from a direction linking the first and second end surfaces is about 2.0 μm to about 5.0 μm.
17. The multilayer ceramic electronic component according to claim 1 , wherein each of the first external electrode and the second external electrode includes the base electrode layer and the plating layer on the base electrode layer.
18. The multilayer ceramic electronic component according to claim 17 , wherein the base electrode layer includes at least one selected from a baked layer, a resin layer, and a thin film layer.
19. The multilayer ceramic electronic component according to claim 17 , wherein the plating layer includes at least one metal selected from Cu, Ni, Sn, Ag, Pd, Ag—Pd alloy, Au, Bi, Zn or an alloy of the at least one metal.
20. The multilayer ceramic electronic component according to claim 17 , wherein the plating layer includes a plurality of plating layers.