Substrate fixing device
A substrate fixing device includes a baseplate, an electrostatic chuck, and an insulating layer interposed between the baseplate and the electrostatic chuck. The insulating layer includes a heating element formed of a first material and a wiring line connected in series to the heating element. The wiring line includes a first conductive layer formed of the first material and a second conductive layer joined onto the first conductive layer. The second conductive layer is formed of a second material having a resistivity lower than the resistivity of the first material.
1. A substrate fixing device, comprising:
a baseplate;
an electrostatic chuck; and
an insulating layer interposed between the baseplate and the electrostatic chuck,
the insulating layer including
a heating element formed of a first material; and
a wiring line connected in series to the heating element,
the wiring line including
a first conductive layer formed of the first material; and
a second conductive layer joined onto the first conductive layer, the second conductive layer being formed of a second material having a resistivity lower than a resistivity of the first material,
wherein a layer thickness of the first conductive layer is smaller than or equal to a layer thickness of the heating element.
2. The substrate fixing device as claimed in claim 1 , further comprising:
a power feed terminal configured to supply voltage to the heating element, the power feed terminal being connected to the heating element through the wiring line.
3. The substrate fixing device as claimed in claim 2 , wherein
the heating element is independently disposed in each of a plurality of zones including a first zone and a second zone,
the wiring line is disposed across the first zone and the second zone,
the power feed terminal is disposed in the second zone, and
the heating element disposed in the first zone is connected to the power feed terminal through the wiring line.
4. The substrate fixing device as claimed in claim 1 , wherein the insulating layer and the electrostatic chuck are directly bonded.
5. The substrate fixing device as claimed in claim 1 , wherein the heating element includes at least one roughened surface.
6. The substrate fixing device as claimed in claim 1 , wherein a surface of the heating element facing toward the electrostatic chuck and a surface of the wiring line facing toward the electrostatic chuck are in a same plane.
7. The substrate fixing device as claimed in claim 1 , wherein
the first conductive layer is a rolled alloy, and
the second conductive layer is a metal plating on the rolled alloy.