Memory cells and memory arrays
View Patent ↗Some embodiments include a memory cell having first and second transistors and first and second capacitors. The first capacitor is vertically displaced relative to the first transistor. The first capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a common plate structure, and a first capacitor dielectric material between the first and second nodes. The second capacitor is vertically displaced relative to the second transistor. The second capacitor has a third node electrically coupled with a source/drain region of the second transistor, a fourth node electrically coupled with the common plate structure, and a second capacitor dielectric material between the first and second nodes. Some embodiments include memory arrays having 2T-2C memory cells.
1. A memory array, comprising:
a plurality of memory cells; each memory cell of said plurality having a two transistor two capacitor (2T-2C) configuration and comprising:
first and second transistors laterally displaced relative to one another;
a first capacitor vertically displaced relative to the first transistor, the first capacitor having a first node electrically coupled with a source/drain region of the first transistor, having a second node electrically coupled with a common plate structure, and having a first capacitor dielectric material between the first and second nodes;
a second capacitor vertically displaced relative to the second transistor, the second capacitor having a third node electrically coupled with a source/drain region of the second transistor, having a fourth node electrically coupled with the common plate structure, and having a second capacitor dielectric material between the first and second nodes; and wherein:
the first transistor has a first source/drain region and a second source/drain region, and the first node is electrically coupled with the first source/drain region;
the second transistor has a third source/drain region and a fourth source/drain region, and the third node is electrically coupled with the third source/drain region; and
the second and fourth source/drain regions are electrically coupled with first and second comparative bitlines, respectively; and
wherein an axis through the first and second comparative bitlines defines a mirror plane; and
wherein a second memory cell of said plurality is on an opposing side of the mirror plane from a first memory cell of said plurality and is substantially a mirror image of said first memory cell across the mirror plane; said second memory cell sharing the first and second comparative bitlines with said first memory cell.
2. The memory array of claim 1 wherein a common wordline extends to both of the first and second transistors of said first memory cell and comprises gates of the first and second transistors of said first memory cells.
3. The memory array of claim 2 wherein the first and second capacitors of said first memory cell are in a common horizontal plane as one another.
4. The memory array of claim 1 wherein the first and third nodes of said first memory cell are container-shaped, and wherein the second and fourth nodes of said first memory cell extend into the container-shaped first and third nodes, respectively.
5. The memory array of claim 1 wherein the first and second comparative bitlines are a same vertical thickness as one another and in a common horizontal plane as one another.