Method of making inkjet print heads by filling residual slotted recesses and related devices
An inkjet print head includes a semiconductor substrate having a plurality of continuous slotted recesses in a first surface. The plurality of continuous slotted recesses is arranged in parallel, spaced apart relation. Each continuous slotted recess extends continuously across the first surface. The semiconductor substrate also has a plurality of discontinuous slotted recesses in a second surface that is opposite the first surface. The plurality of discontinuous slotted recesses is aligned and coupled in communication with the continuous slotted recesses to have a first portion defining a plurality of alternating through-wafer channels and a second portion defining residual slotted recess portions. A dielectric material is disposed within the residual slotted recess portions. A plurality of inkjet heaters is carried by said semiconductor substrate.
1. An inkjet print head comprising:
a semiconductor substrate having a plurality of continuous slotted recesses in a first surface, the plurality of continuous slotted recesses being arranged in parallel, spaced apart relation, and each continuous slotted recess extending continuously across the first surface, said semiconductor substrate also having a plurality of discontinuous slotted recesses in a second surface opposite the first surface and aligned and coupled in communication with the continuous slotted recesses to have a first portion defining a plurality of alternating through-wafer channels and a second portion defining residual slotted recess portions;
a dielectric material within the residual slotted recess portions; and
a plurality of inkjet heaters carried by said semiconductor substrate.
2. The inkjet print head of claim 1 , further comprising at least one layer on the semiconductor substrate to define a plurality of inkjet chambers.
3. The inkjet print head of claim 2 , wherein the at least one layer has a plurality of inkjet orifices formed therein.
4. The inkjet print head of claim 1 , comprising control circuitry coupled to said plurality of inkjet heaters.
5. The inkjet print head of claim 1 , wherein each inkjet heater comprises a resistor.
6. An inkjet print head comprising:
a semiconductor substrate having a plurality of continuous slotted recesses in a first surface, the plurality of continuous slotted recesses being arranged in parallel, spaced apart relation, and each continuous slotted recess extending continuously across the first surface, said semiconductor substrate also having a plurality of discontinuous slotted recesses in a second surface opposite the first surface and aligned and coupled in communication with the continuous slotted recesses to have a first portion defining a plurality of alternating through-wafer channels and a second portion defining residual slotted recess portions;
a polymer material within the residual slotted recess portions; and
a plurality of inkjet heaters carried by said semiconductor substrate.
7. The inkjet print head of claim 6 , further comprising at least one layer on the semiconductor substrate to define a plurality of inkjet chambers.
8. The inkjet print head of claim 7 , wherein the at least one layer has a plurality of inkjet orifices formed therein.
9. The inkjet print head of claim 6 , comprising control circuitry coupled to said plurality of inkjet heaters.
10. The inkjet print head of claim 6 , wherein each inkjet heater comprises a resistor.
11. An inkjet print head comprising:
a semiconductor substrate comprising
a first recess at a first surface, where the first recess extends continuously across the first surface,
a second recess at a second surface opposite to the first surface, the second recess overlapping with the first recess, the first recess being connected to the second recess to form a first portion comprising a first through substrate channel and a second portion comprising a first residual recess;
a polymer material disposed in the first residual recess; and
a first inkjet heater proximate the first portion.
12. The inkjet print head of claim 11 , further comprising control circuitry coupled to the first inkjet heater.
13. The inkjet print head of claim 12 , further comprising a conductive trace coupled between the control circuitry and the first inkjet heater.
14. The inkjet print head of claim 11 , wherein the first inkjet heater comprises a resistor.
15. The inkjet print head of claim 11 , wherein the semiconductor substrate further comprises:
a third recess at the first surface, where the third recess extends continuously across the first surface,
a fourth recess at a second surface opposite to the first surface, the fourth recess overlapping with the third recess, the third recess being connected to the fourth recess to form a third portion comprising a second through substrate channel and a fourth portion comprising a second residual recess, wherein the polymer material is disposed in the second residual recess.
16. The inkjet print head of claim 15 , further comprising a second inkjet heater proximate the third portion.
17. The inkjet print head of claim 15 , wherein the first portion is parallel to the third portion.
18. The inkjet print head of claim 15 , further comprising a second semiconductor substrate disposed over the first surface to define a first inkjet chamber.
19. The inkjet print head of claim 18 , wherein the second semiconductor substrate comprises an orifice.
20. The inkjet print head of claim 15 , wherein the semiconductor substrate further comprises a layer to define a first inkjet chamber, the layer comprising an orifice.