Patent Assignment
Reel/Frame 060177/0226
Assignment of Assignor's Interest
Recorded: 2022-05-25
Pages: 12
Assignor
STMICROELECTRONICS, INC.
Executed: 2022-03-30
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, 1228 PLAN-LES-OUATES, GENEVA, SWITZERLAND
Covered Properties
(46)
Enhancement of Low Power Medium Access Stas
Single-Ssid and Dual-Ssid Enhancements
High Power Factor Primary Regulated Offline Led Driver
Dual Master Jtag Method, Circuit, and System
Ink Jet Printhead with Polarity-Changing Driver for Thermal Resistors
Ink Jet Printhead Device with Compressive Stressed Dielectric Layer
Method for the Formation of Nano-Scale on-Chip Optical Waveguide Structures
Method for the Formation of Fin Structures for Finfet Devices
Methods of Making Inkjet Print Heads Using a Sacrificial Substrate Layer
Method of Making Inkjet Print Heads Having Inkjet Chambers and Orifices Formed in a Wafer and Related Devices
Method of Making Inkjet Print Heads by Filling Residual Slotted Recesses and Related Devices
Methods of Making an Inkjet Print Head by Sawing Discontinuous Slotted Recesses
Graphene Capped Hemt Device
Transistors Incorporating Metal Quantum Dots into Doped Source and Drain Regions
Slot-Based Power Save Improvement
Early Ending of Frame Reception
Preventing Shorting Dendritic Migration Between Electrodes
System and Method for an Arc Fault Detector
Hybrid Photonic and Electronic Integrated Circuits
Post-Cmp Hybrid Wafer Cleaning Technique
Method of Making a Semiconductor Device Using Trench Isolation Regions to Maintain Channel Stress
Fast Initial Link Setup (Fils) Frame Content for a Wireless Network
High Aspect Ratio Vias for High Performance Devices
Integrated Circuit for Motor Drive Controller Applications
Method for the Formation of Fin Structures for Finfet Devices
Method for the Formation of Nano-Scale on-Chip Optical Waveguide Structures
Methods of Making an Inkjet Print Head by Sawing Discontinuous Slotted Recesses
Single-Ssid and Dual-Ssid Enhancements
Hybrid Photonic and Electronic Integrated Circuits
Transistors Incorporating Metal Quantum Dots into Doped Source and Drain Regions
Method of Making Inkjet Print Heads Having Inkjet Chambers and Orifices Formed in a Wafer and Related Devices
Method of Making Inkjet Print Heads by Filling Residual Slotted Recesses and Related Devices
High Power Factor Primary Regulated Offline Led Driver
Power Efficient Ps-Poll
Power Efficient Ps-Poll
Post-Cmp Hybrid Wafer Cleaning Technique
Hybrid Photonic and Electronic Integrated Circuits
System and Method for an Arc Fault Detector
Transistors Incorporating Metal Quantum Dots into Doped Source and Drain Regions
Method of Making Inkjet Print Heads by Filling Residual Slotted Recesses and Related Devices
Power Efficient Ps-Poll
System and Method for Detecting an Arc Fault in a Power Line Signal Including a Communication Signal Modulated on an Ac Power Signal
Method for the Formation of Nano-Scale on-Chip Optical Waveguide Structures
Method of Making Inkjet Print Heads Having Inkjet Chambers and Orifices Formed in a Wafer and Related Devices
Transistors Incorporating Metal Quantum Dots into Doped Source and Drain Regions
Hybrid Photonic and Electronic Integrated Circuits
Related Assignments
(21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 28, 2012
From: CHU, LIWEN; VLANTIS, GEROGE A.
To: STMICROELECTRONICS, INC.
Reel/Frame 029049/0910 →
Assignment of Assignor's Interest
Nov 26, 2012
From: CHU, LIWEN; VLANTIS, GEORGE A.
To: STMICROELECTRONICS, INC.
Reel/Frame 029349/0849 →
Assignment of Assignor's Interest
Dec 6, 2012
From: STAMM, THOMAS
To: STMICROELECTRONICS, INC.
Reel/Frame 029416/0397 →
Corrective Assignment to Correct Assignor Name from Geroge to George Previously Record on Reel 29049, Frame 910 Assignor Hereby Confirms the Assignment of Assignors Interest.
Feb 19, 2013
From: CHU, LIWEN; VLANTIS, GEORGE A.
To: STMICROELECTRONICS INC.
Reel/Frame 029968/0024 →
Assignment of Assignor's Interest
May 14, 2013
From: KUNNAVAKKAM, MADANAGOPAL; NEO, TECK KHIM; SMILEY, KENNETH W.
To: STMICROELECTRONICS, INC.; STMICROELECTRONICS ASIA PACIFIC PTE LTD
Reel/Frame 030409/0596 →
Assignment of Assignor's Interest
May 14, 2013
From: KUNNAVAKKAM, MADANAGOPAL; LI, JIN ZHI; NEO, TECK KHIM; BONG, CHUN CHEK
To: STMICROELECTRONICS, INC.; STMICROELECTRONICS ASIA PACIFIC PTE LTD; STMICROELECTRONICS PTE LTD
Reel/Frame 030409/0713 →
Assignment of Assignor's Interest
May 23, 2013
From: LIU, QING
To: STMICROELECTRONICS, INC.
Reel/Frame 030477/0879 →
Assignment of Assignor's Interest
May 28, 2013
From: LIU, QING; LOUBET, NICOLAS
To: STMICROELECTRONICS, INC.
Reel/Frame 030496/0574 →
Assignment of Assignor's Interest
Jul 2, 2013
From: MIKULAN, PAUL I.; STEWART, KENNETH J.; HWANG, VIRGINIA L.
To: STMICROELECTRONICS, INC.
Reel/Frame 030725/0220 →
Assignment of Assignor's Interest
Jul 2, 2013
From: STEWART, KENNETH J.
To: STMICROELECTRONICS, INC.
Reel/Frame 030725/0226 →
Assignment of Assignor's Interest
Jul 3, 2013
From: ROBINSON, MURRAY J.; STEWART, KENNETH J.
To: STMICROELECTRONICS, INC.
Reel/Frame 030737/0368 →
Assignment of Assignor's Interest
Jul 9, 2013
From: STEWART, KENNETH J.
To: STMICROELECTRONICS, INC.
Reel/Frame 030755/0174 →
Assignment of Assignor's Interest
Jul 26, 2013
From: CHU, LIWEN; VLANTIS, GEORGE A.
To: STMICROELECTRONICS, INC.
Reel/Frame 030887/0139 →
Assignment of Assignor's Interest
Sep 12, 2013
From: CHU, LIWEN; VLANTIS, GEORGE
To: STMICROELECTRONICS, INC.
Reel/Frame 031195/0911 →
Assignment of Assignor's Interest
Sep 16, 2013
From: PRITISKUTCH, JOHN C.; HILDENBRANDT, RICHARD
To: STMICROELECTRONICS, INC.
Reel/Frame 031210/0116 →
Assignment of Assignor's Interest
Oct 17, 2013
From: BRAMBILLA, MARCO; LACOUR, ULDERIC; OZDEMIR, CECILIA
To: STMICROELECTRONICS, INC.
Reel/Frame 031426/0711 →
Assignment of Assignor's Interest
Nov 5, 2013
From: ZHANG, JOHN H.
To: STMICROELECTRONICS, INC.
Reel/Frame 031549/0273 →
Assignment of Assignor's Interest
Nov 5, 2013
From: CHU, LIWEN; VLANTIS, GEORGE A.
To: STMICROELECTRONICS, INC.
Reel/Frame 031546/0488 →
Assignment of Assignor's Interest
Dec 30, 2014
From: ZHANG, JOHN H.; GOLDBERG, CINDY; KLEEMEIER, WALTER
To: STMICROELECTRONICS, INC.
Reel/Frame 034603/0814 →
Assignment of Assignor's Interest
Jun 7, 2022
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060126/0592 →
Assignment of Assignor's Interest
Jun 7, 2022
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060127/0427 →