Method of making inkjet print heads having inkjet chambers and orifices formed in a wafer and related devices
A method of making inkjet print heads may include forming recesses in a first surface of a first wafer to define inkjet chambers. The method may also include forming openings extending from a second surface of the first wafer through to respective ones of the inkjet chambers to define inkjet orifices. The method may further include forming a second wafer including ink heaters, and joining the first and second wafers together so that the ink heaters are aligned within respective inkjet chambers to thereby define the inkjet print heads.
1. An inkjet print head comprising:
a first monocrystalline silicon substrate comprising a first surface having a <100> crystalline orientation, the first monocrystalline silicon substrate comprising a plurality of recesses extending from the first surface into the first monocrystalline silicon substrate to define a plurality of inkjet chambers;
the first monocrystalline silicon substrate also having a plurality of openings extending from a second surface into the first monocrystalline silicon substrate to respective ones of the plurality of inkjet chambers to define a plurality of inkjet orifices;
a second substrate joined to said first monocrystalline silicon substrate, said second substrate including a plurality of ink heaters being aligned within respective inkjet chambers; and
an adhesion layer disposed between the first monocrystalline silicon substrate and the second substrate.
2. The inkjet print head of claim 1 , wherein each inkjet chamber has a trapezoidal cross-sectional shape.
3. The inkjet print head of claim 1 , wherein each inkjet chamber has a height of about 20 microns, a roof of about 12 microns, and a floor of about 40 microns.
4. The inkjet print head of claim 1 , wherein each inkjet chamber comprises a sidewall inclined at an angle of 54.7° to the first surface.
5. The inkjet print head of claim 1 , wherein each inkjet chamber has a rectangular cross-sectional shape.
6. The inkjet print head of claim 1 , wherein the adhesion layer comprises a photosensitive polymer layer.
7. The inkjet print head of claim 1 , further comprising control circuitry coupled to the plurality of ink heaters.
8. The inkjet print head of claim 1 , wherein each ink heater comprises a resistor.
9. The inkjet print head of claim 1 , wherein said second substrate comprises monocrystalline silicon.
10. The inkjet print head of claim 1 , wherein one of the plurality of ink heaters is disposed directly underneath one of the plurality of inkjet chambers and has a footprint disposed within a footprint of the one of the plurality of inkjet chambers overlying it.
11. The inkjet print head of claim 1 , wherein each of the plurality of ink heaters overlaps with the respective inkjet chambers and has a footprint disposed within a footprint of the respective inkjet chambers overlying it.