Interconnection structure, fabricating method thereof, and semiconductor device using the same
A semiconductor device includes a semiconductor substrate comprising a contact region, a silicide present on the contact region, a dielectric layer present on the semiconductor substrate, the dielectric layer comprising an opening to expose a portion of the contact region, a conductor present in the opening, a barrier layer present between the conductor and the dielectric layer, and a metal layer present between the barrier layer and the dielectric layer, wherein a Si concentration of the silicide is varied along a height of the silicide.
1. A device comprising:
a multi-gate transistor, the multi-gate transistor including an epitaxial source/drain region;
a dielectric layer overlying the epitaxial source/drain region;
a contact extending through an opening in the dielectric layer and electrically contacting the epitaxial source/drain region, the contact including:
a silicide layer contacting the epitaxial source/drain region, wherein a Si concentration of the silicide is varied along a height of the silicide;
a barrier layer contacting the silicide layer;
a metal layer contacting the barrier layer and contacting sidewalls of the opening in the dielectric layer, wherein the silicide layer is a silicide of the epitaxial source/drain region and the metal layer; and
a conductor contacting the barrier layer, wherein the barrier layer extends between and separates the conductor and the silicide layer.
2. The device of claim 1 , wherein the Si concentration is decreased along the height of the silicide.
3. The device of claim 1 , wherein the Si concentration at an interface between the silicide and the barrier layer is less than that at an interface between the silicide and the epitaxial source/drain region.
4. The device of claim 1 , wherein a material of the silicide comprises TiSi.
5. The device of claim 1 , wherein a material of the silicide comprises TiSiGe, and a Ge concentration is varied along the height of the silicide as the Si concentration.
6. A device comprising:
a channel region;
a gate conductor wrapped around the channel region;
a source/drain region on one side of the channel region;
a dielectric layer over the source/drain region, the dielectric layer having an opening therein aligned to the source/drain region;
a portion of the source/drain region forming a silicide layer in the opening;
a metal layer lining sidewalls of the opening, wherein the silicide is a silicide of the source/drain region and the metal layer, and further wherein a silicon concentration of the silicide varies from a top of the silicide layer to a bottom of the silicide layer;
a barrier layer on the metal layer; and
a conductor on the barrier layer and filling the opening.
7. The device of claim 6 , wherein the Si concentration is decreased along the height of the silicide.
8. The device of claim 6 , wherein the Si concentration at an interface between the silicide and the barrier layer is less than that at an interface between the silicide and the source/drain region.
9. The device of claim 6 , wherein a material of the silicide comprises TiSi.
10. The device of claim 6 , wherein a material of the silicide comprises TiSiGe, and a Ge concentration is varied along the height of the silicide as the Si concentration.
11. The device of claim 6 , wherein the metal layer is not present between the barrier layer and the silicide.
12. The device of claim 6 , wherein the metal layer comprises Ti, Co, Ni, Pt, or W.
13. The device of claim 6 , wherein the barrier layer comprises Ta or Ti.
14. The device of claim 6 , wherein the barrier layer is directly in contact with the silicide.
15. The device of claim 6 , wherein the conductor comprises W or Cu.
16. A method comprising:
forming a multi-gate transistor structure on a substrate;
covering the multi-gate transistor structure with a dielectric layer;
forming an opening in the dielectric layer, the opening exposing a source/drain region of the multi-gate transistor structure, wherein forming an opening removes a top portion of the source/drain;
lining the opening with a metal layer;
lining the metal layer with a barrier layer;
annealing the source/drain region and the metal layer to form a silicide; and
forming a conductor material atop the silicide and the barrier.
17. The method of claim 16 , wherein a portion of the metal layer between the barrier layer and the source/drain region is reacted with the source/drain region, so that the metal layer is not present between the barrier layer and the silicide.
18. The method of claim 16 , further comprising forming a conductor filling the opening, wherein the conductor is an interconnect structure in the dielectric layer.
19. The method of claim 16 , wherein annealing the source/drain region comprises an annealing temperature and an annealing duration, wherein the annealing temperature is less than 700 degrees Celsius, and wherein the annealing duration is less than 120 seconds.
20. The method of claim 16 , further comprising varying a Si concentration of the silicide along a height of the silicide.